JP2007208160A - 半導体装置およびその製造方法 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims description 86
- 238000004519 manufacturing process Methods 0.000 title claims description 34
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 103
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 69
- 239000000758 substrate Substances 0.000 claims abstract description 39
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 35
- 229910052814 silicon oxide Inorganic materials 0.000 claims abstract description 35
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 34
- 239000010703 silicon Substances 0.000 claims abstract description 34
- 238000000034 method Methods 0.000 claims description 21
- 238000005121 nitriding Methods 0.000 claims description 17
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 13
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 9
- 229910000449 hafnium oxide Inorganic materials 0.000 claims description 6
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- 229910021332 silicide Inorganic materials 0.000 claims description 6
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 6
- 238000000137 annealing Methods 0.000 claims description 4
- 238000001039 wet etching Methods 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims 3
- 229910052761 rare earth metal Inorganic materials 0.000 claims 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 abstract description 29
- 238000009413 insulation Methods 0.000 abstract 2
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 35
- 239000000463 material Substances 0.000 description 12
- 229910001404 rare earth metal oxide Inorganic materials 0.000 description 11
- 229910003855 HfAlO Inorganic materials 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 239000012212 insulator Substances 0.000 description 7
- 229910004129 HfSiO Inorganic materials 0.000 description 6
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 6
- 239000012535 impurity Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 229910052735 hafnium Inorganic materials 0.000 description 4
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- PEUPIGGLJVUNEU-UHFFFAOYSA-N nickel silicon Chemical compound [Si].[Ni] PEUPIGGLJVUNEU-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 230000002411 adverse Effects 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 150000004767 nitrides Chemical group 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- -1 HfO X Chemical compound 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
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Abstract
【解決手段】ゲート長が10nm以下のMISトランジスタにおいて、シリコン基板11上に形成された酸化シリコン膜4およびその酸化シリコン膜4上に形成されたhigh−k膜5を含んでなるゲート絶縁膜2は、ゲート長方向において中央より側面側で窒素を多く含み、かつ、膜厚方向において下面側より上面側で窒素を多く含む窒素領域21を有している。
【選択図】図1
Description
本発明に係る半導体装置の一例として、本実施の形態1では、MIS(Metal Insulator Semiconductor)トランジスタを備えた半導体装置について説明する。
本発明に係る半導体装置の一例として、本実施の形態2では、MISトランジスタを備えた半導体装置について説明する。
本発明に係る半導体装置の一例として、本実施の形態3では、MISトランジスタのチャネルにフィン(Fin)型構造を用いたFinFETを備えた半導体装置について説明する。
2 ゲート絶縁膜
3 ゲート電極
3a 多結晶あるいはアモルファスシリコン膜
4 酸化シリコン膜
5 high−k膜
11 シリコン基板
12 埋め込み酸化膜
13 支持基板
14 低濃度半導体領域
15 高濃度半導体領域
16 シリサイド
21 窒素領域
22 サイドウォール
23 層間絶縁膜
30 マスク
51 SOI層
53a 多結晶シリコン、アモルファスシリコン、あるいは導電性膜
61 シリコン基板
62 埋め込み酸化膜
63 支持基板
101 SOI層
102 ゲート絶縁膜
103 ゲート電極
104 酸化シリコン膜
105 high−k膜
106 酸化膜
Claims (18)
- シリコン基板と、
前記シリコン基板上に形成されたhigh−k膜を含んでなるゲート絶縁膜と、
前記ゲート絶縁膜上に形成されたゲート電極とを有するMISトランジスタを備えた半導体装置であって、
前記ゲート絶縁膜は、前記ゲート電極のゲート長方向において、前記ゲート電極の中央側より周辺側で窒素がより多く含まれており、かつ、前記ゲート絶縁膜の膜厚方向において、前記シリコン基板側より前記ゲート電極側で窒素がより多く含まれていることを特徴とする半導体装置。 - 前記ゲート絶縁膜の前記シリコン基板側には、窒素が含まれていない領域が存在することを特徴とする請求項1記載の半導体装置。
- 前記high−k膜は、希土類元素の酸化物を含むことを特徴とする請求項1記載の半導体装置。
- 前記high−k膜は、ハフニウム酸化物を含むことを特徴とする請求項1記載の半導体装置。
- 前記ゲート電極のゲート長が、10nm以下であることを特徴とする請求項1記載の半導体装置。
- 前記ゲート電極は、金属シリサイドあるいは金属からなることを特徴とする請求項1記載の半導体装置。
- 前記シリコン基板は、SOI層を備えており、
前記MISトランジスタのチャネルは、前記SOI層に形成されることを特徴とする請求項1記載の半導体装置。 - 支持基板、埋め込み酸化膜、およびフィン構造のSOI層を備えたシリコン基板と、
前記SOI層上に形成された酸化シリコン膜および前記酸化シリコン膜上に形成されたhigh−k膜を含んでなるゲート絶縁膜と、
前記ゲート絶縁膜上に形成されたゲート電極とを有するFinFETを備えた半導体装置であって、
前記ゲート絶縁膜は、前記ゲート電極のゲート長方向において、前記ゲート電極の中央側より周辺側で窒素がより多く含まれており、かつ、前記ゲート絶縁膜の膜厚方向において前記SOI層側より前記ゲート電極側で窒素がより多く含まれていることを特徴とする半導体装置。 - (a)シリコン基板上に酸化シリコン膜を形成した後、前記酸化シリコン膜上にhigh−k膜を形成する工程と、
(b)前記high−k膜上にゲート電極を形成する工程と、
(c)前記ゲート電極を選択的にエッチングすると共に、前記ゲート電極の下部以外の領域の前記high−k膜を露出する工程と、
(d)前記工程(c)の後、前記ゲート電極下の前記high−k膜に窒素が含まれるように、露出した前記high−k膜の表面から窒化処理する工程と、
(e)前記工程(d)の後、露出した前記high−k膜を含むゲート絶縁膜をエッチングする工程とを含む半導体装置の製造方法であって、
前記ゲート絶縁膜は、前記ゲート電極のゲート長方向において、前記ゲート電極の中央側より周辺側で窒素がより多く含まれており、かつ、前記ゲート絶縁膜の膜厚方向において、前記シリコン基板側より前記ゲート電極側で窒素がより多く含まれていることを特徴とする半導体装置の製造方法。 - 前記工程(d)の前記窒化処理は、N2、NO、N2OまたはNH3を含んだ雰囲気中でのアニール処理であることを特徴とする請求項9記載の半導体装置の製造方法。
- 前記工程(d)の前記窒化処理は、プラズマ窒化処理であることを特徴とする請求項9記載の半導体装置の製造方法。
- 前記工程(d)の前記窒化処理は、前記工程(c)の前記ゲート電極のエッチング後に、試料を移動することなく行うプラズマ窒化処理であることを特徴とする請求項9記載の半導体装置の製造方法。
- 前記工程(d)では、前記酸化シリコン膜下の前記シリコン基板の表面を窒化処理しないことを特徴とする請求項9記載の半導体装置の製造方法。
- 前記工程(a)では、希土類元素の酸化物を含む前記high−k膜を形成することを特徴とする請求項9記載の半導体装置の製造方法。
- 前記工程(a)では、ハフニウム酸化物を含む前記high−k膜を形成することを特徴とする請求項9記載の半導体装置の製造方法。
- 前記工程(e)の前記high−k膜のエッチングは、ウエットエッチングであることを特徴とする請求項9記載の半導体装置の製造方法。
- 前記工程(c)では、前記ゲート電極のゲート長が10nm以下となるように前記導電性膜をエッチングすることを特徴とする請求項9記載の半導体装置の製造方法。
- 前記ゲート電極は、多結晶あるいはアモルファスシリコン膜と、前記導電性膜上に形成された金属膜とを反応させてなる金属シリサイドから構成されることを特徴とする請求項9記載の半導体装置の製造方法。
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WO2020129571A1 (ja) * | 2018-12-20 | 2020-06-25 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置及びその製造方法、並びに電子機器 |
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JP2009295621A (ja) * | 2008-06-02 | 2009-12-17 | Panasonic Corp | 半導体装置及びその製造方法 |
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JP5521726B2 (ja) * | 2010-04-16 | 2014-06-18 | 富士通セミコンダクター株式会社 | 半導体装置及びその製造方法 |
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