JP2015173088A5 - - Google Patents
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- JP2015173088A5 JP2015173088A5 JP2014174769A JP2014174769A JP2015173088A5 JP 2015173088 A5 JP2015173088 A5 JP 2015173088A5 JP 2014174769 A JP2014174769 A JP 2014174769A JP 2014174769 A JP2014174769 A JP 2014174769A JP 2015173088 A5 JP2015173088 A5 JP 2015173088A5
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- processing
- suction
- wedge
- gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014174769A JP6564563B2 (ja) | 2013-08-30 | 2014-08-29 | 積層体の加工装置 |
| JP2019138698A JP6891232B2 (ja) | 2013-08-30 | 2019-07-29 | 積層体の加工方法 |
Applications Claiming Priority (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013179220 | 2013-08-30 | ||
| JP2013179220 | 2013-08-30 | ||
| JP2013179217 | 2013-08-30 | ||
| JP2013179217 | 2013-08-30 | ||
| JP2014029422 | 2014-02-19 | ||
| JP2014029423 | 2014-02-19 | ||
| JP2014029423 | 2014-02-19 | ||
| JP2014029422 | 2014-02-19 | ||
| JP2014174769A JP6564563B2 (ja) | 2013-08-30 | 2014-08-29 | 積層体の加工装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019138698A Division JP6891232B2 (ja) | 2013-08-30 | 2019-07-29 | 積層体の加工方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015173088A JP2015173088A (ja) | 2015-10-01 |
| JP2015173088A5 true JP2015173088A5 (enExample) | 2017-10-05 |
| JP6564563B2 JP6564563B2 (ja) | 2019-08-21 |
Family
ID=52581492
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014174769A Active JP6564563B2 (ja) | 2013-08-30 | 2014-08-29 | 積層体の加工装置 |
| JP2019138698A Active JP6891232B2 (ja) | 2013-08-30 | 2019-07-29 | 積層体の加工方法 |
| JP2021088428A Active JP7295904B2 (ja) | 2013-08-30 | 2021-05-26 | 積層体の加工装置 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019138698A Active JP6891232B2 (ja) | 2013-08-30 | 2019-07-29 | 積層体の加工方法 |
| JP2021088428A Active JP7295904B2 (ja) | 2013-08-30 | 2021-05-26 | 積層体の加工装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US9333736B2 (enExample) |
| JP (3) | JP6564563B2 (enExample) |
| KR (2) | KR102437483B1 (enExample) |
| CN (2) | CN105493631B (enExample) |
| TW (2) | TWI674033B (enExample) |
| WO (1) | WO2015029806A1 (enExample) |
Families Citing this family (66)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI671141B (zh) | 2013-08-30 | 2019-09-11 | 半導體能源研究所股份有限公司 | 支撐體供應裝置及供應支撐體的方法 |
| WO2015029806A1 (en) * | 2013-08-30 | 2015-03-05 | Semiconductor Energy Laboratory Co., Ltd. | Processing apparatus and processing method of stack |
| TWI618131B (zh) | 2013-08-30 | 2018-03-11 | 半導體能源研究所股份有限公司 | 剝離起點形成裝置及形成方法、疊層體製造裝置 |
| US9925749B2 (en) | 2013-09-06 | 2018-03-27 | Semiconductor Energy Laboratory Co., Ltd. | Bonding apparatus and stack body manufacturing apparatus |
| US9427949B2 (en) | 2013-12-03 | 2016-08-30 | Semiconductor Energy Laboratory Co., Ltd. | Peeling apparatus and stack manufacturing apparatus |
| US9229481B2 (en) | 2013-12-20 | 2016-01-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| KR102064405B1 (ko) * | 2014-02-04 | 2020-01-10 | 삼성디스플레이 주식회사 | 기판 박리 장치 및 그것을 이용한 기판 박리 방법 |
| JP6548871B2 (ja) | 2014-05-03 | 2019-07-24 | 株式会社半導体エネルギー研究所 | 積層体の基板剥離装置 |
| JP6378530B2 (ja) | 2014-05-03 | 2018-08-22 | 株式会社半導体エネルギー研究所 | フィルム吸着機構 |
| CN110625540B (zh) | 2014-05-03 | 2021-10-29 | 株式会社半导体能源研究所 | 薄膜状部件支撑设备 |
| JP2016021560A (ja) | 2014-06-20 | 2016-02-04 | 株式会社半導体エネルギー研究所 | 剥離装置 |
| KR102368997B1 (ko) | 2014-06-27 | 2022-02-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치, 모듈, 전자 기기, 발광 장치의 제작 방법 |
| US9751293B2 (en) * | 2014-12-04 | 2017-09-05 | Industrial Technology Research Institute | Laminated substrate separating device and method for separating laminated substrate |
| JP6815096B2 (ja) | 2015-05-27 | 2021-01-20 | 株式会社半導体エネルギー研究所 | 剥離装置 |
| US20160375600A1 (en) * | 2015-06-29 | 2016-12-29 | Igor Markovsky | Joint cutting in a device |
| KR102405122B1 (ko) * | 2015-09-10 | 2022-06-08 | 삼성디스플레이 주식회사 | 기판 분리 장치 및 이를 이용한 기판 분리 방법 |
| CN106710442B (zh) * | 2015-10-21 | 2021-01-22 | 京东方科技集团股份有限公司 | 背光源分离设备 |
| WO2017115485A1 (ja) * | 2015-12-29 | 2017-07-06 | 鴻海精密工業股▲ふん▼有限公司 | 樹脂フィルムの剥離方法、フレキシブル基板を有する電子デバイスの製造方法および有機el表示装置の製造方法ならびに樹脂フィルムの剥離装置 |
| TW201737766A (zh) * | 2016-01-21 | 2017-10-16 | 康寧公司 | 處理基板的方法 |
| US10259207B2 (en) | 2016-01-26 | 2019-04-16 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming separation starting point and separation method |
| US10279576B2 (en) | 2016-04-26 | 2019-05-07 | Semiconductor Energy Laboratory Co., Ltd. | Peeling method and manufacturing method of flexible device |
| US10804407B2 (en) | 2016-05-12 | 2020-10-13 | Semiconductor Energy Laboratory Co., Ltd. | Laser processing apparatus and stack processing apparatus |
| US10528198B2 (en) | 2016-09-16 | 2020-01-07 | Semiconductor Energy Laboratory Co., Ltd. | Display panel, display device, input/output device, data processing device, and method for manufacturing the display panel |
| KR102650013B1 (ko) * | 2016-10-05 | 2024-03-21 | 삼성디스플레이 주식회사 | 표시 장치의 분해 시스템 및 이를 이용한 표시 장치의 분해 방법 |
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| CN108726174B (zh) * | 2017-12-06 | 2018-12-28 | 湖南永创机电设备有限公司 | 一种平板显示玻璃起爪装置、起爪机械臂、自动上下料装置及起爪装置的使用方法 |
| KR102507884B1 (ko) * | 2018-01-05 | 2023-03-09 | 삼성디스플레이 주식회사 | 윈도우 분리 장치 및 그 장치를 이용한 윈도우 분리 방법 |
| JP6674593B1 (ja) * | 2018-05-09 | 2020-04-01 | 堺ディスプレイプロダクト株式会社 | フレキシブル発光デバイスの製造方法および製造装置 |
| CN112042270A (zh) | 2018-05-09 | 2020-12-04 | 堺显示器制品株式会社 | 柔性发光器件的制造方法以及制造装置 |
| US11158804B2 (en) | 2018-05-09 | 2021-10-26 | Sakai Display Products Corporation | Method and apparatus for manufacturing flexible light emitting device |
| US11101258B2 (en) | 2018-05-09 | 2021-08-24 | Sakai Display Products Corporation | Method and apparatus for manufacturing flexible light-emitting device |
| JP6674592B1 (ja) * | 2018-05-09 | 2020-04-01 | 堺ディスプレイプロダクト株式会社 | フレキシブル発光デバイスの製造方法および製造装置 |
| WO2019215830A1 (ja) * | 2018-05-09 | 2019-11-14 | 堺ディスプレイプロダクト株式会社 | フレキシブル発光デバイスの製造方法および製造装置 |
| JP7410935B2 (ja) | 2018-05-24 | 2024-01-10 | ザ リサーチ ファウンデーション フォー ザ ステイト ユニバーシティー オブ ニューヨーク | 容量性センサ |
| JP6556298B2 (ja) * | 2018-06-15 | 2019-08-07 | 堺ディスプレイプロダクト株式会社 | フレキシブルoledデバイスの製造方法および製造装置 |
| CN110969931B (zh) * | 2018-09-29 | 2022-08-23 | 杰宜斯科技有限公司 | 显示部模块的返工装置及方法 |
| JP6916223B2 (ja) * | 2019-01-30 | 2021-08-11 | 日機装株式会社 | 剥離装置 |
| JP7215206B2 (ja) * | 2019-02-19 | 2023-01-31 | 富士電機株式会社 | 半導体装置の製造方法 |
| KR102221435B1 (ko) | 2019-03-18 | 2021-03-03 | 주식회사 알리 | 플라스틱 이종간 접합을 위한 레이저를 이용한 용착 장치 및 그 제어방법 |
| KR102261103B1 (ko) | 2019-03-18 | 2021-06-07 | 주식회사 알리 | 레이저 빔을 이용하여 어닐링 과정 없이, 불투과성의 플라스틱과 투과성의 플라스틱을 용착시키는 장치 |
| KR102275489B1 (ko) | 2019-03-18 | 2021-07-09 | 주식회사 알리 | 불투과성의 플라스틱과 투과성의 플라스틱을 용착시키는 시스템 |
| CN109926914A (zh) * | 2019-04-24 | 2019-06-25 | 蚌埠中光电科技有限公司 | 一种浮法tft-lcd玻璃面研磨剥片装置 |
| KR102812431B1 (ko) * | 2019-06-17 | 2025-05-27 | 삼성디스플레이 주식회사 | 표시장치의 제조설비 및 표시장치의 제조방법 |
| JP7262903B2 (ja) * | 2019-08-26 | 2023-04-24 | 株式会社ディスコ | キャリア板の除去方法 |
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| US11130329B2 (en) * | 2020-02-07 | 2021-09-28 | The Boeing Company | Apparatus and method for peeling a liner away from a substrate |
| US11465333B2 (en) * | 2020-11-05 | 2022-10-11 | Samsung Display Co., Ltd. | Film peeling device and method of peeling film |
| KR102292717B1 (ko) * | 2021-06-10 | 2021-08-20 | 주식회사 가람텍 | 에어매트 제조용 자동재단장치 및 재단 방법 |
| CN114308680A (zh) * | 2021-12-31 | 2022-04-12 | 中科微至智能制造科技江苏股份有限公司 | 一种用于叠件分离的控制方法 |
| KR102811159B1 (ko) * | 2023-11-24 | 2025-05-26 | 주식회사 제우스 | 기판 처리 장치 및 그 제어 방법 |
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| TWI618131B (zh) | 2013-08-30 | 2018-03-11 | 半導體能源研究所股份有限公司 | 剝離起點形成裝置及形成方法、疊層體製造裝置 |
| WO2015029806A1 (en) * | 2013-08-30 | 2015-03-05 | Semiconductor Energy Laboratory Co., Ltd. | Processing apparatus and processing method of stack |
-
2014
- 2014-08-11 WO PCT/JP2014/071507 patent/WO2015029806A1/en not_active Ceased
- 2014-08-11 CN CN201480047352.0A patent/CN105493631B/zh not_active Expired - Fee Related
- 2014-08-11 CN CN201710952085.7A patent/CN107731716A/zh active Pending
- 2014-08-11 KR KR1020217024021A patent/KR102437483B1/ko active Active
- 2014-08-11 KR KR1020167007419A patent/KR102285804B1/ko active Active
- 2014-08-13 TW TW108109391A patent/TWI674033B/zh not_active IP Right Cessation
- 2014-08-13 TW TW103127758A patent/TWI674032B/zh not_active IP Right Cessation
- 2014-08-26 US US14/468,662 patent/US9333736B2/en not_active Expired - Fee Related
- 2014-08-29 JP JP2014174769A patent/JP6564563B2/ja active Active
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2016
- 2016-05-05 US US15/147,020 patent/US9682544B2/en active Active
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2017
- 2017-06-01 US US15/610,890 patent/US10442172B2/en active Active
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2019
- 2019-07-29 JP JP2019138698A patent/JP6891232B2/ja active Active
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2021
- 2021-05-26 JP JP2021088428A patent/JP7295904B2/ja active Active
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