JP2014535159A - 半導体用途のための陽性金属含有層 - Google Patents
半導体用途のための陽性金属含有層 Download PDFInfo
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- JP2014535159A JP2014535159A JP2014533260A JP2014533260A JP2014535159A JP 2014535159 A JP2014535159 A JP 2014535159A JP 2014533260 A JP2014533260 A JP 2014533260A JP 2014533260 A JP2014533260 A JP 2014533260A JP 2014535159 A JP2014535159 A JP 2014535159A
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 173
- 239000002184 metal Substances 0.000 title claims abstract description 170
- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 54
- 150000002739 metals Chemical class 0.000 claims abstract description 29
- 239000002243 precursor Substances 0.000 claims description 72
- 239000000758 substrate Substances 0.000 claims description 67
- 229910052710 silicon Inorganic materials 0.000 claims description 62
- 229910052732 germanium Inorganic materials 0.000 claims description 51
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 32
- 239000010703 silicon Substances 0.000 claims description 31
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 30
- 239000003989 dielectric material Substances 0.000 claims description 27
- 239000002070 nanowire Substances 0.000 claims description 24
- 229910052757 nitrogen Inorganic materials 0.000 claims description 24
- 125000004429 atom Chemical group 0.000 claims description 23
- 229910052760 oxygen Inorganic materials 0.000 claims description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 18
- 238000004891 communication Methods 0.000 claims description 17
- 125000000217 alkyl group Chemical group 0.000 claims description 16
- 229910052782 aluminium Inorganic materials 0.000 claims description 15
- 230000004888 barrier function Effects 0.000 claims description 15
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 13
- 229910052735 hafnium Inorganic materials 0.000 claims description 13
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 12
- 125000005842 heteroatom Chemical group 0.000 claims description 12
- 239000001301 oxygen Substances 0.000 claims description 12
- 229910052719 titanium Inorganic materials 0.000 claims description 12
- 229910052721 tungsten Inorganic materials 0.000 claims description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 11
- 229910052799 carbon Inorganic materials 0.000 claims description 11
- 229910052706 scandium Inorganic materials 0.000 claims description 11
- 229910052727 yttrium Inorganic materials 0.000 claims description 11
- 229910052726 zirconium Inorganic materials 0.000 claims description 11
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 9
- 125000003118 aryl group Chemical group 0.000 claims description 9
- 125000000524 functional group Chemical group 0.000 claims description 9
- 229910052736 halogen Inorganic materials 0.000 claims description 9
- 239000000377 silicon dioxide Substances 0.000 claims description 9
- 235000012239 silicon dioxide Nutrition 0.000 claims description 9
- 229910052715 tantalum Inorganic materials 0.000 claims description 9
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 8
- 229910052790 beryllium Inorganic materials 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims description 8
- 239000001257 hydrogen Substances 0.000 claims description 8
- 229910052749 magnesium Inorganic materials 0.000 claims description 8
- 229910052698 phosphorus Inorganic materials 0.000 claims description 8
- SBYHFKPVCBCYGV-UHFFFAOYSA-N quinuclidine Chemical compound C1CC2CCN1CC2 SBYHFKPVCBCYGV-UHFFFAOYSA-N 0.000 claims description 8
- 150000001336 alkenes Chemical class 0.000 claims description 7
- 150000001345 alkine derivatives Chemical class 0.000 claims description 7
- 229910052791 calcium Inorganic materials 0.000 claims description 7
- 239000007795 chemical reaction product Substances 0.000 claims description 7
- 229910052804 chromium Inorganic materials 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 7
- 229910052748 manganese Inorganic materials 0.000 claims description 7
- 229910052750 molybdenum Inorganic materials 0.000 claims description 7
- 229910052758 niobium Inorganic materials 0.000 claims description 7
- 125000003367 polycyclic group Chemical group 0.000 claims description 7
- 229910052712 strontium Inorganic materials 0.000 claims description 7
- 229910052720 vanadium Inorganic materials 0.000 claims description 7
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 6
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 6
- 150000002367 halogens Chemical class 0.000 claims description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 6
- 125000004122 cyclic group Chemical group 0.000 claims description 5
- 239000007789 gas Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 229910052717 sulfur Inorganic materials 0.000 claims description 5
- 101150030352 Arsi gene Proteins 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 150000004703 alkoxides Chemical group 0.000 claims description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 2
- 125000005843 halogen group Chemical group 0.000 claims 3
- 150000002431 hydrogen Chemical class 0.000 claims 1
- 238000000231 atomic layer deposition Methods 0.000 abstract description 15
- 238000005229 chemical vapour deposition Methods 0.000 abstract description 13
- 239000010410 layer Substances 0.000 description 63
- 239000010408 film Substances 0.000 description 48
- 238000000151 deposition Methods 0.000 description 24
- 239000000376 reactant Substances 0.000 description 24
- 230000008021 deposition Effects 0.000 description 15
- 239000000463 material Substances 0.000 description 14
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 10
- 239000010936 titanium Substances 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- -1 for example Substances 0.000 description 7
- 125000001183 hydrocarbyl group Chemical group 0.000 description 6
- 239000011261 inert gas Substances 0.000 description 6
- 229910052786 argon Inorganic materials 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 5
- 230000000737 periodic effect Effects 0.000 description 5
- 239000004215 Carbon black (E152) Substances 0.000 description 4
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 4
- KXNLCSXBJCPWGL-UHFFFAOYSA-N [Ga].[As].[In] Chemical compound [Ga].[As].[In] KXNLCSXBJCPWGL-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229930195733 hydrocarbon Natural products 0.000 description 4
- 238000010926 purge Methods 0.000 description 4
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 229910052734 helium Inorganic materials 0.000 description 3
- 239000001307 helium Substances 0.000 description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 3
- 150000002430 hydrocarbons Chemical group 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 229910052743 krypton Inorganic materials 0.000 description 3
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 229910052754 neon Inorganic materials 0.000 description 3
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229910052724 xenon Inorganic materials 0.000 description 3
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 3
- 239000002879 Lewis base Substances 0.000 description 2
- AUCDRFABNLOFRE-UHFFFAOYSA-N alumane;indium Chemical compound [AlH3].[In] AUCDRFABNLOFRE-UHFFFAOYSA-N 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 2
- 150000007527 lewis bases Chemical class 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 229910052987 metal hydride Inorganic materials 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 125000004437 phosphorous atom Chemical group 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 125000004434 sulfur atom Chemical group 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229910052692 Dysprosium Inorganic materials 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910000673 Indium arsenide Inorganic materials 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- 229910008484 TiSi Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 1
- XWCMFHPRATWWFO-UHFFFAOYSA-N [O-2].[Ta+5].[Sc+3].[O-2].[O-2].[O-2] Chemical compound [O-2].[Ta+5].[Sc+3].[O-2].[O-2].[O-2] XWCMFHPRATWWFO-UHFFFAOYSA-N 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical group [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- ILCYGSITMBHYNK-UHFFFAOYSA-N [Si]=O.[Hf] Chemical compound [Si]=O.[Hf] ILCYGSITMBHYNK-UHFFFAOYSA-N 0.000 description 1
- 238000000277 atomic layer chemical vapour deposition Methods 0.000 description 1
- VKJLWXGJGDEGSO-UHFFFAOYSA-N barium(2+);oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[O-2].[Ti+4].[Ba+2] VKJLWXGJGDEGSO-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229940104869 fluorosilicate Drugs 0.000 description 1
- VTGARNNDLOTBET-UHFFFAOYSA-N gallium antimonide Chemical compound [Sb]#[Ga] VTGARNNDLOTBET-UHFFFAOYSA-N 0.000 description 1
- SCCCLDWUZODEKG-UHFFFAOYSA-N germanide Chemical compound [GeH3-] SCCCLDWUZODEKG-UHFFFAOYSA-N 0.000 description 1
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 1
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- JQJCSZOEVBFDKO-UHFFFAOYSA-N lead zinc Chemical compound [Zn].[Pb] JQJCSZOEVBFDKO-UHFFFAOYSA-N 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 150000004681 metal hydrides Chemical class 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910003455 mixed metal oxide Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- BCCOBQSFUDVTJQ-UHFFFAOYSA-N octafluorocyclobutane Chemical compound FC1(F)C(F)(F)C(F)(F)C1(F)F BCCOBQSFUDVTJQ-UHFFFAOYSA-N 0.000 description 1
- 235000019407 octafluorocyclobutane Nutrition 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- KJXBRHIPHIVJCS-UHFFFAOYSA-N oxo(oxoalumanyloxy)lanthanum Chemical compound O=[Al]O[La]=O KJXBRHIPHIVJCS-UHFFFAOYSA-N 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000000678 plasma activation Methods 0.000 description 1
- 229910052696 pnictogen Inorganic materials 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 239000013545 self-assembled monolayer Substances 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- CZXRMHUWVGPWRM-UHFFFAOYSA-N strontium;barium(2+);oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[O-2].[O-2].[Ti+4].[Sr+2].[Ba+2] CZXRMHUWVGPWRM-UHFFFAOYSA-N 0.000 description 1
- 238000006557 surface reaction Methods 0.000 description 1
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 1
- OCGWQDWYSQAFTO-UHFFFAOYSA-N tellanylidenelead Chemical compound [Pb]=[Te] OCGWQDWYSQAFTO-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7842—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate
- H01L29/7845—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate the means being a conductive material, e.g. silicided S/D or Gate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/42—Silicides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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Abstract
Description
Claims (38)
- トランジスタ素子のチャネル領域を形成するサスペンデッドナノワイヤと、前記サスペンデッドナノワイヤ上に配設される誘電体材料の層と、前記誘電体材料の層上に配設される金属層であって、99.5原子%〜75.0原子%の2族〜7族金属又はAlと、0.5原子%〜10.0原子%の範囲の量で存在するSi又はGeとを含む、金属層とを備え、前記ナノワイヤがそのゲート電極内に懸架され(suspended)、前記金属層が前記ゲート電極の一部を形成する、ナノワイヤトランジスタ素子。
- 前記金属層が15原子%未満の炭素、窒素及び酸素の総量を有する、請求項1に記載の素子。
- 前記誘電体材料の層が、二酸化ケイ素(SiO2)、酸化窒化ケイ素(SiOxNy)、窒化ケイ素(Si3N4)、又は高k誘電体材料から形成される、請求項1または2に記載の素子。
- 前記ナノワイヤが、シリコン、シリコンとゲルマニウムとの混合物、又はIII−V族化合物半導体から形成される、請求項1から3の何れか1項に記載の素子。
- 2つのサスペンデッドナノワイヤを備える、請求項1から4の何れか1項に記載の素子。
- 上面と一対の横方向に対向する側壁とを有するチャネル構造と、前記上面及び前記一対の横方向に対向する側壁上に配設される誘電体層と、前記上面及び前記一対の横方向に対向する側壁上の前記誘電体層上に配設される金属層であって、99.5原子%〜75.0原子%の2族〜7族金属又はAlと、0.5原子%〜10.0原子%の範囲の量で存在するSi又はGeとを含む、金属層とを備える、トランジスタ素子。
- 前記金属層が15原子%未満の炭素、窒素及び酸素の総量を有する、請求項6に記載の素子。
- 前記誘電体層が、二酸化ケイ素(SiO2)、酸化窒化ケイ素(SiOxNy)、窒化ケイ素(Si3N4)、又は高k誘電体材料から形成される、請求項6または7に記載の素子。
- 前記チャネル構造が、単結晶シリコン、シリコン、シリコンとゲルマニウムとの混合物、又はIII−V族化合物半導体から形成される、請求項6から8の何れか1項に記載のトランジスタ素子。
- 表面を有する基板と、
前記基板の表面上に配設される誘電体材料の層と、
前記誘電体材料の層内に形成され、側壁と底面とを有するトレンチ又はビアと、
前記側壁及び底面上に配設され、99.5原子%〜75.0原子%の2族〜7族金属と、0.5原子%〜10.0原子%の範囲の量で存在するSi又はGeとを含む、バリア層と、
ウェル内の金属領域とを備え、
前記バリア層が、前記金属領域と前記誘電体材料の層との間にある、素子。 - 前記2族〜7族金属が、W、Hf、Ta又はそれらの組合せである、請求項10に記載の素子。
- 前記金属領域が15原子%未満の炭素、窒素及び酸素の総量を有する、請求項10または11に記載の素子。
- 前記金属領域が、銀、銅又はアルミニウムから形成される、請求項10から12の何れか1項に記載の素子。
- 表面を有する基板と、
前記基板の表面上に配設される誘電体材料の層と、
前記誘電体材料の層内に形成されるトレンチ又はビアと、
表面を有し、前記トレンチ又はビア内の金属領域と、
前記金属領域の表面上に配設されるキャップ層と、を備え、
前記キャップ層は99.5原子%〜75.0原子%の2族〜7族金属と、0.5原子%〜10.0原子%の範囲の量で存在するSi又はGeとを含む、素子。 - 前記2族〜7族金属がWである、請求項14に記載の素子。
- 前記金属領域が15原子%未満の炭素、窒素及び酸素の総量を有する、請求項14または15に記載の素子。
- 前記金属領域が、銀、銅又はアルミニウムから形成される、請求項14から16の何れか1項に記載の素子。
- 表面を有する基板を準備することと、
前記基板の表面を気相状の第1の前駆体分子に曝すことであって、前記第1の前駆体分子が金属M1(金属M1は2族〜7族金属又はAlであり、金属M1は、少なくとも2つのシリコン原子、ゲルマニウム原子、又はシリコン原子及びゲルマニウム原子に直接結合する)を含む、ことと、
残るガス状の第1の前駆体分子を全て除去することと、
前記基板の表面を第2の気相状前駆体分子M2Xn(式中、Xはハロゲンであり、nは2〜6(両端を含む)の数字であり、M2は2族〜7族金属又はAlであり、M1及びM2は同じ金属又は異なる金属である)に曝すことと、
残るガス状の第2の前駆体分子を全て除去することと、
前記基板の表面上にM1とM2とを含む層が作製されるように、前記基板を前記第1の前駆体分子に曝すこと、ガス状の第1の前駆体分子を全て除去すること、前記基板を前記第2の前駆体分子に曝すこと、及び、残るガス状の第2の前駆体分子を全て除去することという要素を少なくとも1回繰り返すことと、
を含む、方法。 - M1及びM2が、Zr、Be、Mg、Ca、Sr、Al、Sc、Y、Ti、Hf、V、Nb、Ta、Cr、Mo、W及びMnからなる群から選択される、請求項18に記載の方法。
- 前記第1の前駆体分子が2つの2族〜7族金属原子又はAlを含む、請求項18または19に記載の方法。
- 前記第1の前駆体分子が、((CH3)3Si)3Al・N(CH3)2(CH2CH3)、((CH3)2ArSi)3Al・N(CH3)2(CH2CH3)、((CH3)3Si)3Al(キヌクリジン)、((CH3)3Ge)3Al(キヌクリジン)、((C4H9)3Si)2Mn、((C4H9)3Si)2Mn・N(CH3)3、((CH3)3Ge)2Mn(テトラメチルエチレンジアミン)及び((C4H9)3Si)2Ti・N(CH3)3からなる群から選択される、請求項18から20の何れか1項に記載の方法。
- M1が、−SiR1R2R3、−GeR1R2R3、又はそれらの組合せ(式中、R1、R2及びR3は、同じか又は異なり、かつ、ヘテロ原子含有及び非ヘテロ原子含有アルキル、アリール、シクロアルキル、アルケン、アルキン、環式基及び多環式基からなる群から選択されるアルキル基であり、ヘテロ原子がハロゲン、O、N、S、P、Si及びGeからなる群から選択される)である少なくとも2つの官能基に結合する、請求項18から21の何れか1項に記載の方法。
- M1が、Al、Ti、Sc、Y、Zr又はHfであり、M1が、−SiR1R2R3、−GeR1R2R3、又はそれらの組合せ(式中、R1、R2及びR3は、同じか又は異なり、かつ、アルキル、アリール、シクロアルキル、アルケン、アルキン、環式基及び多環式基からなる群から選択されるアルキル基であり、ヘテロ原子がハロゲン、O、N、S、P、Si及びGeからなる群から選択される)である少なくとも3つの官能基に結合する、請求項18から22の何れか1項に記載の方法。
- 表面を有する基板を準備することと、
前記基板の表面を気相状の第1の前駆体分子に曝すことであって、前記第1の前駆体分子が金属M1(金属M1は2族〜7族金属又はAlであり、金属M1は、少なくとも2つのシリコン原子、ゲルマニウム原子、又はシリコン原子及びゲルマニウム原子に直接結合する)を含む、ことと、
残るガス状の第1の前駆体分子を全て除去することと、
前記基板の表面を第2の気相状前駆体分子M2Xn(式中、Xはアルコキシド基であり、nは2〜6(両端を含む)の数字であり、M2は2族〜7族金属又はAlであり、M1及びM2は同じ金属又は異なる金属である)に曝すことと、
残るガス状の第2の前駆体分子を全て除去することと、
前記基板の表面上にM1とM2とを含む層が作製されるように、前記基板を前記第1の前駆体分子に曝すこと、ガス状の第1の前駆体分子を全て除去すること、前記基板を前記第2の前駆体分子に曝すこと、及び、残るガス状の第2の前駆体分子を全て除去することという要素を少なくとも1回繰り返すことと、
を含む、方法。 - M1及びM2が、Zr、Be、Mg、Ca、Sr、Al、Sc、Y、Ti、Hf、V、Nb、Ta、Cr、Mo、W及びMnからなる群から選択される、請求項24に記載の方法。
- 前記第1の前駆体分子が2つの2族〜7族金属原子又はAlを含む、請求項24または25に記載の方法。
- 前記第1の前駆体分子が、((CH3)3Si)3Al・N(CH3)2(CH2CH3)、((CH3)2ArSi)3Al・N(CH3)2(CH2CH3)、((CH3)3Si)3Al(キヌクリジン)、((CH3)3Ge)3Al(キヌクリジン)、((C4H9)3Si)2Mn、((C4H9)3Si)2Mn・N(CH3)3、((CH3)3Ge)2Mn(テトラメチルエチレンジアミン)及び((C4H9)3Si)2Ti・N(CH3)3からなる群から選択される、請求項24から26の何れか1項に記載の方法。
- M1が、−SiR1R2R3、−GeR1R2R3、又はそれらの組合せ(式中、R1、R2及びR3は、同じか又は異なり、かつ、アルキル、アリール、シクロアルキル、アルケン、アルキン、及び多環式基からなる群から選択されるアルキル基である)である少なくとも2つの官能基に結合する、請求項24から27の何れか1項に記載の方法。
- M1が、Al、Ti、Sc、Y、Zr又はHfであり、M1が、−SiR1R2R3、−GeR1R2R3、又はそれらの組合せ(式中、R1、R2及びR3は、同じか又は異なり、かつ、アルキル、アリール、シクロアルキル、アルケン、アルキン、及び多環式基からなる群から選択されるアルキル基である)である少なくとも3つの官能基に結合する、請求項24から28の何れか1項に記載の方法。
- 表面を有する基板を準備することと、
前記基板の表面を、金属を含む前駆体分子に曝すことであって、前記金属が2族〜7族金属又はAlであり、前記金属が、少なくとも2つのシリコン原子、ゲルマニウム原子、又はシリコン原子及びゲルマニウム原子に直接結合する、ことと、
残るガス状の前駆体分子を全て除去することと、
前記基板の表面を水素に曝すことと、
残る水素及びガス状反応生成物を全て除去することと、
前記基板の表面上にMを含む層が作製されるように、前記基板を前記前駆体分子に曝すこと、ガス状の前駆体分子を全て除去すること、前記基板を水素に曝すこと、並びに、残る水素及びガス状反応生成物を全て除去することという要素を複数回繰り返すことと、
を含む、方法。 - 前記金属が、Zr、Be、Mg、Ca、Sr、Al、Sc、Y、Ti、Hf、V、Nb、Ta、Cr、Mo、W及びMnからなる群から選択される、請求項30に記載の方法。
- 前記前駆体分子が2つの2族〜7族金属原子又はAl金属原子を含む、請求項30または31に記載の方法。
- 水素を分子水素又はプラズマ励起された水素の形態で供給する、請求項30から32の何れか1項に記載の方法。
- 前記前駆体分子が、((CH3)3Si)3Al・N(CH3)2(CH2CH3)、((CH3)2ArSi)3Al・N(CH3)2(CH2CH3)、((CH3)3Si)3Al(キヌクリジン)、((CH3)3Ge)3Al(キヌクリジン)、((C4H9)3Si)2Mn、((C4H9)3Si)2Mn・N(CH3)3、((CH3)3Ge)2Mn(テトラメチルエチレンジアミン)及び((C4H9)3Si)2Ti・N(CH3)3からなる群から選択される、請求項30から33の何れか1項に記載の方法。
- 前記金属が、Al、Ti、Sc、Y、Zr又はHfであり、前記金属が、−SiR1R2R3、−GeR1R2R3、又はそれらの組合せ(式中、R1、R2及びR3は、同じか又は異なり、ヘテロ原子含有及び非ヘテロ原子含有アルキル、アリール、シクロアルキル、アルケン、アルキン、環式基及び多環式基からなる群から選択されるアルキル基であり、ヘテロ原子がハロゲン、O、N、S、P、Si及びGeからなる群から選択される)である少なくとも3つの官能基に結合する、請求項30から34の何れか1項に記載の方法。
- マザーボードと、
前記マザーボード上に搭載される通信チップと、
前記マザーボード上に搭載され、ナノワイヤトランジスタ素子を有するプロセッサ、とを備え、
ナノワイヤトランジスタ素子は前記トランジスタ素子のチャネル領域を形成するサスペンデッドナノワイヤと、前記サスペンデッドナノワイヤ上に配設される誘電体材料の層と、前記誘電体材料の層上に配設される金属層とを有し、
前記金属層は99.5原子%〜75.0原子%の2族〜7族金属又はAlと、0.5原子%〜10.0原子%の範囲の量で存在するSi又はGeとを含む、金属層とを備え、前記ナノワイヤがそのゲート電極内に懸架され、前記金属層が前記ゲート電極の一部を形成する、ナノワイヤトランジスタ素子を備える、プロセッサと、
を備える、演算素子。 - マザーボードと、
前記マザーボード上に搭載される通信チップと、
前記マザーボード上に搭載され、トランジスタ素子を有するプロセッサとを備え、
前記トランジスタ素子は、
上面と一対の横方向に対向する側壁とを有するチャネル構造と、前記上面及び前記一対の横方向に対向する側壁上に配設される誘電体層と、前記上面及び前記一対の横方向に対向する側壁上の前記誘電体層上に配設される金属層とを有し、
前記金属層は99.5原子%〜75.0原子%の2族〜7族金属又はAlと、0.5原子%〜10.0原子%の範囲の量で存在するSi又はGeとを含む、プロセッサと、
を備える、演算素子。 - マザーボードと、
前記マザーボード上に搭載される通信チップと、
前記マザーボード上に搭載され、表面を含む基板を有するプロセッサであって、
前記基板の表面上に配設される誘電体材料の層と、
側壁と底面とを有する、前記誘電体材料の層内に形成されるトレンチ又はビアと、
前記側壁及び底面上に配設されるバリア層であって、99.5原子%〜75.0原子%の2族〜7族金属と、0.5原子%〜10.0原子%の範囲の量で存在するSi又はGeとを含む、バリア層と、
ウェル内の金属領域であって、前記バリア層が、前記金属領域と前記誘電体材料の層との間にある、金属領域とを備える、プロセッサと、
を備える、演算素子。
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US20130270513A1 (en) | 2013-10-17 |
KR20140054372A (ko) | 2014-05-08 |
EP2761663A1 (en) | 2014-08-06 |
EP2761663A4 (en) | 2015-07-22 |
TW201620139A (zh) | 2016-06-01 |
WO2013048417A1 (en) | 2013-04-04 |
EP2761663B1 (en) | 2016-09-14 |
KR101713920B1 (ko) | 2017-03-09 |
US8952355B2 (en) | 2015-02-10 |
US9390932B2 (en) | 2016-07-12 |
TWI517394B (zh) | 2016-01-11 |
KR20160036070A (ko) | 2016-04-01 |
TW201327827A (zh) | 2013-07-01 |
KR101605643B1 (ko) | 2016-03-22 |
TWI582997B (zh) | 2017-05-11 |
US20150243508A1 (en) | 2015-08-27 |
JP6122854B2 (ja) | 2017-04-26 |
CN103843144B (zh) | 2018-06-19 |
CN103843144A (zh) | 2014-06-04 |
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