JP2014514450A5 - - Google Patents

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Publication number
JP2014514450A5
JP2014514450A5 JP2014503119A JP2014503119A JP2014514450A5 JP 2014514450 A5 JP2014514450 A5 JP 2014514450A5 JP 2014503119 A JP2014503119 A JP 2014503119A JP 2014503119 A JP2014503119 A JP 2014503119A JP 2014514450 A5 JP2014514450 A5 JP 2014514450A5
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JP
Japan
Prior art keywords
measurement
detector
evaporator
substrate
measurement system
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JP2014503119A
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English (en)
Japanese (ja)
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JP2014514450A (ja
JP6140681B2 (ja
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Priority claimed from EP11161343.6A external-priority patent/EP2508645B1/en
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Publication of JP2014514450A5 publication Critical patent/JP2014514450A5/ja
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Publication of JP6140681B2 publication Critical patent/JP6140681B2/ja
Expired - Fee Related legal-status Critical Current
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JP2014503119A 2011-04-06 2012-04-03 測定ユニットを備えた蒸発システム Expired - Fee Related JP6140681B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP11161343.6 2011-04-06
EP11161343.6A EP2508645B1 (en) 2011-04-06 2011-04-06 Evaporation system with measurement unit
PCT/EP2012/056107 WO2012136673A1 (en) 2011-04-06 2012-04-03 Evaporation system with measurement unit

Publications (3)

Publication Number Publication Date
JP2014514450A JP2014514450A (ja) 2014-06-19
JP2014514450A5 true JP2014514450A5 (https=) 2015-05-28
JP6140681B2 JP6140681B2 (ja) 2017-05-31

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ID=44533347

Family Applications (1)

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JP2014503119A Expired - Fee Related JP6140681B2 (ja) 2011-04-06 2012-04-03 測定ユニットを備えた蒸発システム

Country Status (6)

Country Link
US (2) US20120258239A1 (https=)
EP (1) EP2508645B1 (https=)
JP (1) JP6140681B2 (https=)
KR (1) KR101877458B1 (https=)
CN (1) CN103476964B (https=)
WO (1) WO2012136673A1 (https=)

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US10100410B2 (en) * 2016-08-05 2018-10-16 Industrial Technology Research Institute Film thickness monitoring system and method using the same
CN109715846B (zh) * 2016-12-14 2024-07-23 应用材料公司 沉积系统
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WO2020108743A1 (en) * 2018-11-28 2020-06-04 Applied Materials, Inc. Deposition source for depositing evaporated material, deposition apparatus, and methods therefor
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KR102245087B1 (ko) * 2019-07-08 2021-04-28 엘지전자 주식회사 증착 장비용 박막 두께 측정장치
EP3869534A1 (en) * 2020-02-20 2021-08-25 Bühler Alzenau GmbH In-situ etch rate or deposition rate measurement system
WO2021230859A1 (en) * 2020-05-12 2021-11-18 Applied Materials, Inc. Evaporation source, evaporation system, and method of monitoring material deposition on a substrate
CN111549319B (zh) * 2020-05-20 2022-03-29 武汉天马微电子有限公司 一种真空蒸镀系统及真空蒸镀方法
EP4143362B1 (en) * 2020-06-30 2025-04-30 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. Method for controlling a flux distribution of evaporated source material, detector for measuring electromagnetic radiation reflected on a source surface and system for thermal evaporation with electromagnetic radiation
US20230175892A1 (en) * 2020-06-30 2023-06-08 MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. Method for controlling an evaporation rate of source material, detector for measuring electromagnetic radiation reflected on a source surface and system for thermal evaporation with electromagnetic radiation
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