JP2014508313A5 - - Google Patents

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Publication number
JP2014508313A5
JP2014508313A5 JP2013547671A JP2013547671A JP2014508313A5 JP 2014508313 A5 JP2014508313 A5 JP 2014508313A5 JP 2013547671 A JP2013547671 A JP 2013547671A JP 2013547671 A JP2013547671 A JP 2013547671A JP 2014508313 A5 JP2014508313 A5 JP 2014508313A5
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JP
Japan
Prior art keywords
film body
less
laser radiation
optical stack
main surface
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JP2013547671A
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English (en)
Japanese (ja)
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JP2014508313A (ja
JP6392514B2 (ja
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Priority claimed from PCT/US2011/067826 external-priority patent/WO2012092478A1/en
Publication of JP2014508313A publication Critical patent/JP2014508313A/ja
Publication of JP2014508313A5 publication Critical patent/JP2014508313A5/ja
Application granted granted Critical
Publication of JP6392514B2 publication Critical patent/JP6392514B2/ja
Expired - Fee Related legal-status Critical Current
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JP2013547671A 2010-12-30 2011-12-29 レーザー切断方法及びこれにより製造された物品 Expired - Fee Related JP6392514B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201061428395P 2010-12-30 2010-12-30
US61/428,395 2010-12-30
PCT/US2011/067826 WO2012092478A1 (en) 2010-12-30 2011-12-29 Laser cutting method and articles produced therewith

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017001054A Division JP6530429B2 (ja) 2010-12-30 2017-01-06 レーザー切断方法及びこれにより製造された物品

Publications (3)

Publication Number Publication Date
JP2014508313A JP2014508313A (ja) 2014-04-03
JP2014508313A5 true JP2014508313A5 (enExample) 2015-02-19
JP6392514B2 JP6392514B2 (ja) 2018-09-19

Family

ID=45541080

Family Applications (2)

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JP2013547671A Expired - Fee Related JP6392514B2 (ja) 2010-12-30 2011-12-29 レーザー切断方法及びこれにより製造された物品
JP2017001054A Active JP6530429B2 (ja) 2010-12-30 2017-01-06 レーザー切断方法及びこれにより製造された物品

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2017001054A Active JP6530429B2 (ja) 2010-12-30 2017-01-06 レーザー切断方法及びこれにより製造された物品

Country Status (9)

Country Link
US (2) US9878530B2 (enExample)
EP (1) EP2658716A1 (enExample)
JP (2) JP6392514B2 (enExample)
KR (1) KR101899617B1 (enExample)
CN (1) CN103260879B (enExample)
BR (1) BR112013016437A2 (enExample)
SG (2) SG191204A1 (enExample)
TW (1) TWI552870B (enExample)
WO (1) WO2012092478A1 (enExample)

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TWI534008B (zh) * 2015-04-30 2016-05-21 住華科技股份有限公司 光學膜片、光學膜片之製造方法及應用其之顯示面板
TWI583479B (zh) * 2015-06-12 2017-05-21 住華科技股份有限公司 光學膜片的加工方法
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CN106751589A (zh) * 2016-09-27 2017-05-31 无锡卡卡生物科技有限公司 一种生物降解型薄膜及其制备方法
CN106633009A (zh) * 2016-09-27 2017-05-10 无锡卡卡生物科技有限公司 一种聚2,3‑萘二甲酸乙二醇酯可生物降解聚酯及其制备方法和用途
CN106633730A (zh) * 2016-09-27 2017-05-10 无锡卡卡生物科技有限公司 一种可降解阻燃聚乳酸复合材料的制备方法
JP7260993B2 (ja) * 2017-12-07 2023-04-19 住友化学株式会社 積層フィルムの切断方法及び製造方法
CN109725378B (zh) * 2018-02-13 2020-03-10 华为技术有限公司 保护膜、切割保护膜的方法和装置
KR102511337B1 (ko) * 2018-04-19 2023-03-16 도요보 가부시키가이샤 폴딩형 디스플레이의 표면보호 필름용 폴리에스테르 필름과 그의 용도
MX2021002001A (es) * 2018-08-31 2021-04-28 Kimberly Clark Co Metodos y sistemas para cortar o perforar una trama con un laser.
CN110039188B (zh) * 2019-05-06 2021-12-07 深圳市万普拉斯科技有限公司 镭雕方法
TWI704999B (zh) * 2019-12-24 2020-09-21 茂林光學股份有限公司 具保護膜之導光板之加工方法、加工設備及其導光板
KR102921537B1 (ko) * 2021-04-07 2026-02-03 주식회사 엘지에너지솔루션 분리막 커팅 장치 및 이를 포함하는 전극셀 제조 시스템
JP7220764B1 (ja) 2021-11-02 2023-02-10 住友化学株式会社 貫通孔付きフィルムの製造方法、及び、円偏光板
DE102022103620A1 (de) * 2022-02-16 2023-08-17 Lisa Dräxlmaier GmbH Verfahren zum herstellen eines eine funktionsöffnung aufweisenden dekorelements für ein kraftfahrzeug sowie dekorelement
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