JP2017083878A5 - - Google Patents

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Publication number
JP2017083878A5
JP2017083878A5 JP2017001054A JP2017001054A JP2017083878A5 JP 2017083878 A5 JP2017083878 A5 JP 2017083878A5 JP 2017001054 A JP2017001054 A JP 2017001054A JP 2017001054 A JP2017001054 A JP 2017001054A JP 2017083878 A5 JP2017083878 A5 JP 2017083878A5
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micrometers
optical stack
film body
less
laser radiation
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JP2017001054A
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Japanese (ja)
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JP6530429B2 (ja
JP2017083878A (ja
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JP2017001054A 2010-12-30 2017-01-06 レーザー切断方法及びこれにより製造された物品 Active JP6530429B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201061428395P 2010-12-30 2010-12-30
US61/428,395 2010-12-30

Related Parent Applications (1)

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JP2013547671A Division JP6392514B2 (ja) 2010-12-30 2011-12-29 レーザー切断方法及びこれにより製造された物品

Publications (3)

Publication Number Publication Date
JP2017083878A JP2017083878A (ja) 2017-05-18
JP2017083878A5 true JP2017083878A5 (enExample) 2017-06-29
JP6530429B2 JP6530429B2 (ja) 2019-06-12

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JP2013547671A Expired - Fee Related JP6392514B2 (ja) 2010-12-30 2011-12-29 レーザー切断方法及びこれにより製造された物品
JP2017001054A Active JP6530429B2 (ja) 2010-12-30 2017-01-06 レーザー切断方法及びこれにより製造された物品

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JP2013547671A Expired - Fee Related JP6392514B2 (ja) 2010-12-30 2011-12-29 レーザー切断方法及びこれにより製造された物品

Country Status (9)

Country Link
US (2) US9878530B2 (enExample)
EP (1) EP2658716A1 (enExample)
JP (2) JP6392514B2 (enExample)
KR (1) KR101899617B1 (enExample)
CN (1) CN103260879B (enExample)
BR (1) BR112013016437A2 (enExample)
SG (2) SG10201602517RA (enExample)
TW (1) TWI552870B (enExample)
WO (1) WO2012092478A1 (enExample)

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WO2017188168A1 (ja) * 2016-04-28 2017-11-02 日本ゼオン株式会社 光学フィルムの製造方法
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CN106751589A (zh) * 2016-09-27 2017-05-31 无锡卡卡生物科技有限公司 一种生物降解型薄膜及其制备方法
JP7260993B2 (ja) * 2017-12-07 2023-04-19 住友化学株式会社 積層フィルムの切断方法及び製造方法
CN109946780B (zh) * 2018-02-13 2020-09-04 华为技术有限公司 保护膜、切割保护膜的方法和装置
CN111989357B (zh) * 2018-04-19 2023-08-11 东洋纺株式会社 折叠型显示器的表面保护膜用聚酯薄膜及其用途
GB2591674B (en) * 2018-08-31 2023-07-05 Kimberly Clark Co Methods and systems for cutting or perforating a web with a laser
CN110039188B (zh) * 2019-05-06 2021-12-07 深圳市万普拉斯科技有限公司 镭雕方法
TWI704999B (zh) * 2019-12-24 2020-09-21 茂林光學股份有限公司 具保護膜之導光板之加工方法、加工設備及其導光板
KR20220139188A (ko) * 2021-04-07 2022-10-14 주식회사 엘지에너지솔루션 분리막 커팅 장치 및 이를 포함하는 전극셀 제조 시스템
JP7220764B1 (ja) 2021-11-02 2023-02-10 住友化学株式会社 貫通孔付きフィルムの製造方法、及び、円偏光板
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