JP2014225695A - 基板ローディングデバイス - Google Patents
基板ローディングデバイス Download PDFInfo
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H1/00—Supports or magazines for piles from which articles are to be separated
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/34—Devices for discharging articles or materials from conveyor
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract
Description
ュールは、望まれるように、フロント部の他の側面に配置され得る。さらに別の実施例においては、ロードポートモジュールはフロント部12の2つ以上の側面に配置され得る。図2において見て取れるように、この例示的な実施例におけるロードポートモジュール24は、ロードポートモジュール24のベースプレートから外側に突出する伸長ゾーン38を有し得る。
Claims (16)
- 基板ローディングデバイスであって、
前記デバイスを基板プロセス装置に接続し、前記デバイスとプロセス装置との間で基板が搬送される際に前記基板が通過する搬送開口部を有するフレームと、
基板搬送コンテナを保持し、前記フレームに移動自在に接続される少なくとも1つの搬送コンテナシャトルと、を含み、
前記シャトルは、前記フレームに対して、第1終端位置と第2終端位置との間を移動自在であり、異なった複数の搬送コンテナが前記シャトルにより前記第2終端位置に搬送されるとき、前記第2終端位置は、前記少なくとも1つの搬送コンテナシャトル上の前記搬送コンテナの表面とフレーム表面との間の所定の隙間を維持するために変更可能であることを特徴とする基板ローディングデバイス。 - 請求項1に記載の基板ローディングデバイスであって、前記シャトルの前記第2の終端位置を検出する検出システムをさらに含むことを特徴とする基板ローディングデバイス。
- 請求項2に記載の基板ローディングデバイスであって、前記検出システムに通信可能に接続され、前記検出システムからの信号を受信するコントローラを更に含み、前記コントローラは前記搬送コンテナとともに前記少なくとも1つの搬送コンテナシャトルを前記第2の終端位置に停止させるために前記信号を使用するようにプログラムされていることを特徴とする基板ローディングデバイス。
- 請求項2に記載の基板ローディングデバイスであって、前記検出システムはビームセンサを含むことを特徴とする基板ローディングデバイス。
- 請求項4に記載の基板ローディングデバイスであって、前記センサは前記基板搬送コンテナの特徴部分を検出することを特徴とする基板ローディングデバイス。
- 請求項4に記載の基板ローディングデバイスであって、前記センサは前記基板搬送コンテナの基準面を検出して、基板搬送コンテナ間の寸法変化に依らずに前記第2の終端位置を規定することを特徴とする基板ローディングデバイス。
- 請求項4に記載の基板ローディングデバイスであって、前記センサは前記基板搬送コンテナの前面を検出することを特徴とする基板ローディングデバイス。
- 請求項4に記載の基板ローディングデバイスであって、前記少なくとも1つの搬送コンテナシャトルは2以上の搬送コンテナシャトルを含み、前記基板ローディングデバイスは前記搬送コンテナシャトルの各々に対するセンサをさらに含むことを特徴とする基板ローディングデバイス。
- 請求項2に記載の基板ローディングデバイスであって、前記少なくとも1つの搬送コンテナシャトルは複数の搬送コンテナシャトルを含み、前記複数の搬送コンテナシャトルの各々は前記検出システムによって独立的に検出されることを特徴とする基板ローディングデバイス。
- 基板ローディングデバイスであって、
前記基板ローディングデバイスを基板プロセス装置に接続し、前記基板ローディングデバイスと前記基板プロセス装置との間で基板が搬送される際に前記基板が通過する搬送開口部を有するフレームと、
基板搬送コンテナを保持しかつ前記フレームに移動自在に接続され、第1の終端位置と第2の終端位置との間で前記フレームに対して移動自在な少なくとも1つの搬送コンテナシャトルと、
前記フレームに接続され、前記少なくとも1つの搬送コンテナシャトルによって前記基板搬送コンテナが移動させられる際に前記搬送コンテナの特徴部分を遠隔的に検出して、前記フレームに対する前記特徴部分の位置を判定するセンサと、
を含むことを特徴とする基板ローディングデバイス。 - 請求項10に記載の基板ローディングデバイスであって、前記センサに通信可能に接続されて前記センサからの信号を受信するコントローラをさらに含み、前記コントローラは前記信号を用いて前記少なくとも1つの搬送コンテナシャトルの終端位置を計算するようにプログラミングされていることを特徴とする基板ローディングデバイス。
- 請求項10に記載の基板ローディングデバイスであって、前記センサがビームセンサを含むことを特徴とする基板ローディングデバイス。
- 請求項10に記載の基板ローディングデバイスであって、前記センサが前記基板搬送コンテナの基準面を検出して、基板搬送コンテナ間の寸法の差異に依らずに前記第2の終端位置を規定することを特徴とする基板ローディングデバイス。
- 請求項10に記載の基板ローディングデバイスであって、前記センサは前記基板搬送コンテナの前面を検出することを特徴とする基板ローディングデバイス。
- 請求項10に記載の基板ローディングデバイスであって、前記少なくとも1つの搬送コンテナシャトルは2以上の搬送コンテナシャトルを含み、前記基板ローディングデバイスは前記搬送コンテナシャトルの各々に対するセンサを含むことを特徴とする基板ローディングデバイス。
- 請求項10に記載の基板ローディングデバイスであって、前記少なくとも1つの搬送コンテナシャトルは複数の搬送コンテナシャトルを含み、前記複数の搬送コンテナシャトルの各々は前記センサによって独立的に検出されることを特徴とする基板ローディングデバイス。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/178,836 US8821099B2 (en) | 2005-07-11 | 2005-07-11 | Load port module |
US11/178,836 | 2005-07-11 |
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JP2013050751A Division JP5732698B2 (ja) | 2005-07-11 | 2013-03-13 | ロードポートモジュール |
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JP2014225695A true JP2014225695A (ja) | 2014-12-04 |
JP5978261B2 JP5978261B2 (ja) | 2016-08-24 |
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JP2008521470A Active JP5657203B2 (ja) | 2005-07-11 | 2006-07-10 | ロードポートモジュール |
JP2013050751A Active JP5732698B2 (ja) | 2005-07-11 | 2013-03-13 | ロードポートモジュール |
JP2014158904A Active JP5978261B2 (ja) | 2005-07-11 | 2014-08-04 | 基板ローディングデバイス |
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JP2008521470A Active JP5657203B2 (ja) | 2005-07-11 | 2006-07-10 | ロードポートモジュール |
JP2013050751A Active JP5732698B2 (ja) | 2005-07-11 | 2013-03-13 | ロードポートモジュール |
Country Status (7)
Country | Link |
---|---|
US (2) | US8821099B2 (ja) |
EP (1) | EP1901983B1 (ja) |
JP (3) | JP5657203B2 (ja) |
KR (1) | KR101313231B1 (ja) |
CN (1) | CN101511713B (ja) |
TW (1) | TWI433248B (ja) |
WO (1) | WO2007008677A2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2022510300A (ja) * | 2018-11-28 | 2022-01-26 | ブルックス オートメーション インコーポレイテッド | ロードポートモジュール |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2007287979A (ja) * | 2006-04-18 | 2007-11-01 | Shinko Electric Co Ltd | ロードポート装置、及びベースカバー体 |
JP4713424B2 (ja) * | 2006-08-24 | 2011-06-29 | 川崎重工業株式会社 | オープナ側ドア駆動機構 |
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JP5657203B2 (ja) | 2015-01-21 |
EP1901983B1 (en) | 2015-03-04 |
JP5732698B2 (ja) | 2015-06-10 |
EP1901983A2 (en) | 2008-03-26 |
TWI433248B (zh) | 2014-04-01 |
US8821099B2 (en) | 2014-09-02 |
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JP2009509316A (ja) | 2009-03-05 |
US11121017B2 (en) | 2021-09-14 |
WO2007008677A2 (en) | 2007-01-18 |
US20070009345A1 (en) | 2007-01-11 |
JP2013153188A (ja) | 2013-08-08 |
JP5978261B2 (ja) | 2016-08-24 |
CN101511713A (zh) | 2009-08-19 |
KR101313231B1 (ko) | 2013-09-30 |
TW200733289A (en) | 2007-09-01 |
EP1901983A4 (en) | 2009-12-30 |
CN101511713B (zh) | 2013-07-17 |
KR20080033355A (ko) | 2008-04-16 |
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