JP2014072533A5 - - Google Patents

Download PDF

Info

Publication number
JP2014072533A5
JP2014072533A5 JP2013212623A JP2013212623A JP2014072533A5 JP 2014072533 A5 JP2014072533 A5 JP 2014072533A5 JP 2013212623 A JP2013212623 A JP 2013212623A JP 2013212623 A JP2013212623 A JP 2013212623A JP 2014072533 A5 JP2014072533 A5 JP 2014072533A5
Authority
JP
Japan
Prior art keywords
crystal
semiconductor device
semiconductor layer
insulating film
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013212623A
Other languages
English (en)
Japanese (ja)
Other versions
JP6067532B2 (ja
JP2014072533A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2013212623A priority Critical patent/JP6067532B2/ja
Priority claimed from JP2013212623A external-priority patent/JP6067532B2/ja
Publication of JP2014072533A publication Critical patent/JP2014072533A/ja
Publication of JP2014072533A5 publication Critical patent/JP2014072533A5/ja
Application granted granted Critical
Publication of JP6067532B2 publication Critical patent/JP6067532B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2013212623A 2013-10-10 2013-10-10 半導体装置 Active JP6067532B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013212623A JP6067532B2 (ja) 2013-10-10 2013-10-10 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013212623A JP6067532B2 (ja) 2013-10-10 2013-10-10 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2013131172A Division JP5397795B1 (ja) 2013-06-21 2013-06-21 半導体装置及びその製造方法、結晶及びその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016247779A Division JP6281145B2 (ja) 2016-12-21 2016-12-21 半導体装置

Publications (3)

Publication Number Publication Date
JP2014072533A JP2014072533A (ja) 2014-04-21
JP2014072533A5 true JP2014072533A5 (enExample) 2015-10-08
JP6067532B2 JP6067532B2 (ja) 2017-01-25

Family

ID=50747411

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013212623A Active JP6067532B2 (ja) 2013-10-10 2013-10-10 半導体装置

Country Status (1)

Country Link
JP (1) JP6067532B2 (enExample)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9590050B2 (en) * 2014-05-08 2017-03-07 Flosfia, Inc. Crystalline multilayer structure and semiconductor device
JP6230196B2 (ja) * 2014-07-08 2017-11-15 株式会社Flosfia 結晶性半導体膜および半導体装置
JP6281146B2 (ja) 2014-07-22 2018-02-21 株式会社Flosfia 結晶性半導体膜および板状体ならびに半導体装置
JP6390052B2 (ja) * 2014-08-29 2018-09-19 高知県公立大学法人 量子井戸構造および半導体装置
JP2016051824A (ja) * 2014-08-29 2016-04-11 高知県公立大学法人 エピタキシャル成長方法および成長装置ならびに量子井戸構造の作製方法
CN106796891B (zh) 2014-09-02 2020-07-17 株式会社Flosfia 层叠结构体及其制造方法、半导体装置、以及晶体膜
JP6478425B2 (ja) * 2017-07-07 2019-03-06 株式会社Flosfia 結晶性半導体膜および半導体装置
CN109423694B (zh) 2017-08-21 2022-09-09 株式会社Flosfia 结晶膜、包括结晶膜的半导体装置以及制造结晶膜的方法
CN112368429A (zh) 2018-06-26 2021-02-12 株式会社Flosfia 成膜方法及结晶性层叠结构体
JP7741487B2 (ja) 2018-06-26 2025-09-18 株式会社Flosfia 結晶性酸化物膜
JP7315136B2 (ja) 2018-12-26 2023-07-26 株式会社Flosfia 結晶性酸化物半導体
JP7315137B2 (ja) 2018-12-26 2023-07-26 株式会社Flosfia 結晶性酸化物膜
JP7124207B2 (ja) 2019-03-28 2022-08-23 日本碍子株式会社 下地基板
JP7176099B2 (ja) * 2019-03-28 2022-11-21 日本碍子株式会社 半導体膜
WO2020194803A1 (ja) 2019-03-28 2020-10-01 日本碍子株式会社 下地基板及びその製造方法
EP3960915A4 (en) 2019-04-24 2022-12-21 NGK Insulators, Ltd. SEMICONDUCTOR FILM
EP3960914A4 (en) 2019-04-24 2022-12-28 NGK Insulators, Ltd. Semiconductor film
WO2021044489A1 (ja) 2019-09-02 2021-03-11 日本碍子株式会社 半導体膜
CN114270531A (zh) 2019-09-03 2022-04-01 株式会社Flosfia 结晶膜、包含结晶膜的半导体装置以及结晶膜的制造方法
WO2021048950A1 (ja) 2019-09-11 2021-03-18 日本碍子株式会社 半導体膜
KR102849602B1 (ko) 2019-09-30 2025-08-21 가부시키가이샤 플로스피아 적층 구조체 및 반도체 장치
JP7290740B2 (ja) 2019-09-30 2023-06-13 日本碍子株式会社 α-Ga2O3系半導体膜
CN114503285A (zh) * 2019-10-03 2022-05-13 株式会社Flosfia 半导体元件
CN114585776B (zh) 2019-11-05 2025-06-03 日本碍子株式会社 氧化镓结晶的制法
WO2021153609A1 (ja) 2020-01-27 2021-08-05 株式会社Flosfia 半導体装置および半導体装置の製造方法
US11694894B2 (en) 2020-04-24 2023-07-04 Flosfia Inc. Crystalline film containing a crystalline metal oxide and method for manufacturing the same under partial pressure
US11804519B2 (en) 2020-04-24 2023-10-31 Flosfia Inc. Crystalline multilayer structure, semiconductor device, and method of manufacturing crystalline structure
JP7061214B2 (ja) * 2020-08-06 2022-04-27 信越化学工業株式会社 半導体積層体、半導体素子および半導体素子の製造方法
KR20230048008A (ko) * 2020-08-06 2023-04-10 신에쓰 가가꾸 고교 가부시끼가이샤 반도체 적층체, 반도체 소자 및 반도체 소자의 제조방법
JP7681039B2 (ja) 2020-10-08 2025-05-21 日本碍子株式会社 酸化ガリウム単結晶粒子及びその製法
US20230074175A1 (en) * 2021-09-09 2023-03-09 The Regents Of The University Of Michigan Doped Aluminum-Alloyed Gallium Oxide And Ohmic Contacts
KR20240063901A (ko) 2021-09-22 2024-05-10 신에쓰 가가꾸 고교 가부시끼가이샤 성막방법, 성막장치 및 결정성 산화물막
EP4411021A1 (en) 2021-09-30 2024-08-07 Shin-Etsu Chemical Co., Ltd. Laminated structure, semiconductor device, and method for forming crystalline oxide film
JPWO2023238587A1 (enExample) 2022-06-08 2023-12-14
US12402381B2 (en) 2022-07-12 2025-08-26 Flosfia, Inc. Semiconductor device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4083396B2 (ja) * 2000-07-10 2008-04-30 独立行政法人科学技術振興機構 紫外透明導電膜とその製造方法
US8569754B2 (en) * 2010-11-05 2013-10-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US8809852B2 (en) * 2010-11-30 2014-08-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor film, semiconductor element, semiconductor device, and method for manufacturing the same

Similar Documents

Publication Publication Date Title
JP2014072533A5 (enExample)
JP2012134467A5 (ja) 半導体装置の作製方法
JP2014232869A5 (enExample)
JP2016184731A5 (ja) 半導体装置
EP2696365A3 (en) Semiconductor buffer structure, semiconductor device including the same, and method of manufacturing semiconductor device using semiconductor buffer structure
JP2013234106A5 (enExample)
JP2018002544A5 (enExample)
EP2937322A3 (en) Lead-free piezo-electric porcelain composition, piezo-electric element using the same, and method for producing lead-free piezo-electric porcelain composition
JP2017085071A5 (ja) 酸化物半導体膜
WO2018007337A3 (de) Elektronisches schaltelement
JP2010134466A5 (ja) 液晶表示装置の作製方法
JP2013077836A5 (enExample)
WO2015039043A3 (en) Microelectronic element with bond elements and compliant material layer
JP2014135478A5 (ja) 半導体装置の作製方法
JP2015017027A5 (enExample)
JP2015079947A5 (ja) 半導体装置
WO2015184152A3 (en) Wire bond support structure and microelectronic package including wire bonds therefrom
JP2013035740A5 (ja) 酸化物膜
JP2015025200A5 (ja) 酸化物半導体膜
JPWO2019175698A5 (ja) 金属酸化物
EP2642510A3 (en) Composition for forming ferroelectric thin film, method for forming ferroelectric thin film, ferroelectric thin film, and complex electronic component
JP2014187359A5 (enExample)
WO2013188574A3 (en) Multilayer substrate structure
JP2014116591A5 (enExample)
JP2017529692A5 (enExample)