JP2014063930A - 電子制御装置 - Google Patents

電子制御装置 Download PDF

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Publication number
JP2014063930A
JP2014063930A JP2012208927A JP2012208927A JP2014063930A JP 2014063930 A JP2014063930 A JP 2014063930A JP 2012208927 A JP2012208927 A JP 2012208927A JP 2012208927 A JP2012208927 A JP 2012208927A JP 2014063930 A JP2014063930 A JP 2014063930A
Authority
JP
Japan
Prior art keywords
heat
component
clearance
circuit board
exothermic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012208927A
Other languages
English (en)
Japanese (ja)
Inventor
Yoshio Kawai
義夫 河合
Hironori Ohashi
弘典 大橋
Yuichi Yanagisawa
有一 柳澤
Kumiko Yoshinaga
久美子 吉永
Eiji Ichikawa
英司 市川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Astemo Ltd
Original Assignee
Hitachi Automotive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Automotive Systems Ltd filed Critical Hitachi Automotive Systems Ltd
Priority to JP2012208927A priority Critical patent/JP2014063930A/ja
Priority to MX2015002743A priority patent/MX340396B/es
Priority to CN201380044996.XA priority patent/CN104663010B/zh
Priority to DE112013004625.3T priority patent/DE112013004625T5/de
Priority to IN1579DEN2015 priority patent/IN2015DN01579A/en
Priority to US14/424,099 priority patent/US9480189B2/en
Priority to PCT/JP2013/074678 priority patent/WO2014046004A1/ja
Publication of JP2014063930A publication Critical patent/JP2014063930A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2012208927A 2012-09-21 2012-09-21 電子制御装置 Pending JP2014063930A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2012208927A JP2014063930A (ja) 2012-09-21 2012-09-21 電子制御装置
MX2015002743A MX340396B (es) 2012-09-21 2013-09-12 Aparato de control electrónico.
CN201380044996.XA CN104663010B (zh) 2012-09-21 2013-09-12 电子控制装置
DE112013004625.3T DE112013004625T5 (de) 2012-09-21 2013-09-12 Elektronische Steuerungsvorrichtung
IN1579DEN2015 IN2015DN01579A (https=) 2012-09-21 2013-09-12
US14/424,099 US9480189B2 (en) 2012-09-21 2013-09-12 Electronic control apparatus
PCT/JP2013/074678 WO2014046004A1 (ja) 2012-09-21 2013-09-12 電子制御装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012208927A JP2014063930A (ja) 2012-09-21 2012-09-21 電子制御装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016196827A Division JP6419125B2 (ja) 2016-10-05 2016-10-05 電子制御装置

Publications (1)

Publication Number Publication Date
JP2014063930A true JP2014063930A (ja) 2014-04-10

Family

ID=50341318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012208927A Pending JP2014063930A (ja) 2012-09-21 2012-09-21 電子制御装置

Country Status (7)

Country Link
US (1) US9480189B2 (https=)
JP (1) JP2014063930A (https=)
CN (1) CN104663010B (https=)
DE (1) DE112013004625T5 (https=)
IN (1) IN2015DN01579A (https=)
MX (1) MX340396B (https=)
WO (1) WO2014046004A1 (https=)

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JP2017123439A (ja) * 2016-01-08 2017-07-13 株式会社デンソー 電子制御ユニット、および、これを用いた電動パワーステアリング装置
JP2017175064A (ja) * 2016-03-25 2017-09-28 株式会社デンソー 電子装置及びその製造方法

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WO2014093549A1 (en) * 2012-12-11 2014-06-19 Hzo, Inc. Vapor ports for electronic devices
JP6398849B2 (ja) * 2015-04-06 2018-10-03 株式会社デンソー 電子制御装置
DE102015107645A1 (de) 2015-05-15 2016-11-17 Hella Kgaa Hueck & Co. Sensorgehäuse für einen Radardensor und Radarsensor
DE102015212616A1 (de) * 2015-07-06 2017-01-12 Zf Friedrichshafen Ag Schutzgehäuse zur flexiblen Bauteilfixierung und Leiterplatte mit Schutzgehäuse
CN105163544A (zh) * 2015-09-22 2015-12-16 武汉菱电汽车电控系统股份有限公司 多功能汽车电子控制单元封装盒
JP6453195B2 (ja) * 2015-09-29 2019-01-16 日立オートモティブシステムズ株式会社 車載制御装置
DE102015221149A1 (de) 2015-10-29 2017-05-04 Robert Bosch Gmbh Steuervorrichtung für eine Getriebesteuerung eines Kraftfahrzeugs
JP2017098332A (ja) * 2015-11-19 2017-06-01 株式会社ジェイテクト 電子回路装置
CN105374769A (zh) * 2015-12-04 2016-03-02 重庆臻远电气有限公司 散热装置
US10164362B2 (en) * 2015-12-31 2018-12-25 Foxconn Interconnect Technology Limited Plug connecetor with a metallic enclosure having heat sink member thereon
JP6113314B1 (ja) * 2016-02-01 2017-04-12 三菱電機株式会社 防水型制御装置
DE102017212968B4 (de) * 2016-08-05 2024-02-01 Robert Bosch Gmbh Gehäuseaufbau für eine elektronische steuereinheit und herstellungsverfahren
JP6499213B2 (ja) * 2017-02-17 2019-04-10 太陽誘電株式会社 カバー及びそれを用いたモジュール
US10638643B2 (en) * 2017-11-14 2020-04-28 Canon Kabushiki Kaisha Electronic device
US11375639B2 (en) * 2018-06-03 2022-06-28 Tcpoly Inc. Additive manufactured multi-layer thermally conductive parts
US10813240B2 (en) 2018-12-05 2020-10-20 Carrier Corporation Control box including a water resistant seal
JPWO2021059914A1 (https=) * 2019-09-25 2021-04-01
JP7439468B2 (ja) * 2019-11-20 2024-02-28 富士電機株式会社 プログラマブルコントローラモジュール及びプログラマブルコントローラシステム
TWI718980B (zh) * 2020-08-07 2021-02-11 新唐科技股份有限公司 整合式感測裝置與其製造方法
JP7536631B2 (ja) * 2020-12-18 2024-08-20 株式会社マキタ 電動作業機
DE102021000931A1 (de) 2021-02-22 2022-08-25 KSB SE & Co. KGaA Pumpe mit einem Elektronikgehäuse und wenigstens einem Kühlkörper
US12495511B2 (en) * 2021-03-10 2025-12-09 Hitachi Astemo, Ltd. Electronic control device
DE102021001714A1 (de) 2021-04-01 2022-10-06 KSB SE & Co. KGaA Kreiselpumpe mit Kühlung der Elektronik innerhalb eines Elektronikgehäuses
JP7606676B2 (ja) * 2021-06-11 2024-12-26 株式会社オートネットワーク技術研究所 回路構成体
JP2023130256A (ja) * 2022-03-07 2023-09-20 株式会社デンソーテン 電子機器
EP4734681A1 (en) * 2023-06-26 2026-04-29 Sekisui Chemical Co., Ltd. Housing structure and method for manufacturing same
CN121753545A (zh) * 2023-11-16 2026-03-27 安斯泰莫株式会社 电子控制装置

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Publication number Priority date Publication date Assignee Title
JP2009054701A (ja) * 2007-08-24 2009-03-12 Hitachi Kokusai Electric Inc 電子部品放熱構造
WO2010067725A1 (ja) * 2008-12-12 2010-06-17 株式会社 村田製作所 回路モジュール
JP2011192937A (ja) * 2010-03-17 2011-09-29 Hitachi Automotive Systems Ltd 自動車用電子制御装置

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JP4410242B2 (ja) * 2006-12-27 2010-02-03 三菱電機株式会社 電子制御装置及びその製造方法
JP4278680B2 (ja) * 2006-12-27 2009-06-17 三菱電機株式会社 電子制御装置
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JP4385058B2 (ja) * 2007-05-07 2009-12-16 三菱電機株式会社 電子制御装置
DE112008000873T5 (de) * 2007-05-28 2010-04-29 Aisin Aw Co., Ltd. Kühlvorrichtung für eine Steuereinheit für ein Automatikgetriebe
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JP5344182B2 (ja) * 2010-02-02 2013-11-20 株式会社安川電機 電力変換装置
JP4948613B2 (ja) * 2010-02-25 2012-06-06 三菱電機株式会社 樹脂封止形電子制御装置、及びその製造方法
DE102011012673A1 (de) * 2010-03-17 2011-09-22 Hitachi Automotive Systems, Ltd. Elektronische Steuereinrichtung für Fahrzeuge
JP5557585B2 (ja) * 2010-04-26 2014-07-23 日立オートモティブシステムズ株式会社 パワーモジュール
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JP2009054701A (ja) * 2007-08-24 2009-03-12 Hitachi Kokusai Electric Inc 電子部品放熱構造
WO2010067725A1 (ja) * 2008-12-12 2010-06-17 株式会社 村田製作所 回路モジュール
JP2011192937A (ja) * 2010-03-17 2011-09-29 Hitachi Automotive Systems Ltd 自動車用電子制御装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017123439A (ja) * 2016-01-08 2017-07-13 株式会社デンソー 電子制御ユニット、および、これを用いた電動パワーステアリング装置
JP2017175064A (ja) * 2016-03-25 2017-09-28 株式会社デンソー 電子装置及びその製造方法

Also Published As

Publication number Publication date
DE112013004625T5 (de) 2015-06-03
US9480189B2 (en) 2016-10-25
US20150216088A1 (en) 2015-07-30
MX340396B (es) 2016-07-07
CN104663010B (zh) 2018-02-09
IN2015DN01579A (https=) 2015-07-03
CN104663010A (zh) 2015-05-27
WO2014046004A1 (ja) 2014-03-27
MX2015002743A (es) 2015-05-15

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