CN104663010B - 电子控制装置 - Google Patents

电子控制装置 Download PDF

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Publication number
CN104663010B
CN104663010B CN201380044996.XA CN201380044996A CN104663010B CN 104663010 B CN104663010 B CN 104663010B CN 201380044996 A CN201380044996 A CN 201380044996A CN 104663010 B CN104663010 B CN 104663010B
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CN
China
Prior art keywords
heat
gap
component
generating
electronic control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201380044996.XA
Other languages
English (en)
Chinese (zh)
Other versions
CN104663010A (zh
Inventor
河合义夫
大桥弘典
柳泽有
柳泽有一
吉永久美子
市川英司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Astemo Ltd
Original Assignee
Hitachi Automotive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Automotive Systems Ltd filed Critical Hitachi Automotive Systems Ltd
Publication of CN104663010A publication Critical patent/CN104663010A/zh
Application granted granted Critical
Publication of CN104663010B publication Critical patent/CN104663010B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN201380044996.XA 2012-09-21 2013-09-12 电子控制装置 Active CN104663010B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012208927A JP2014063930A (ja) 2012-09-21 2012-09-21 電子制御装置
JP2012-208927 2012-09-21
PCT/JP2013/074678 WO2014046004A1 (ja) 2012-09-21 2013-09-12 電子制御装置

Publications (2)

Publication Number Publication Date
CN104663010A CN104663010A (zh) 2015-05-27
CN104663010B true CN104663010B (zh) 2018-02-09

Family

ID=50341318

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380044996.XA Active CN104663010B (zh) 2012-09-21 2013-09-12 电子控制装置

Country Status (7)

Country Link
US (1) US9480189B2 (https=)
JP (1) JP2014063930A (https=)
CN (1) CN104663010B (https=)
DE (1) DE112013004625T5 (https=)
IN (1) IN2015DN01579A (https=)
MX (1) MX340396B (https=)
WO (1) WO2014046004A1 (https=)

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DE102015221149A1 (de) 2015-10-29 2017-05-04 Robert Bosch Gmbh Steuervorrichtung für eine Getriebesteuerung eines Kraftfahrzeugs
JP2017098332A (ja) * 2015-11-19 2017-06-01 株式会社ジェイテクト 電子回路装置
CN105374769A (zh) * 2015-12-04 2016-03-02 重庆臻远电气有限公司 散热装置
US10164362B2 (en) * 2015-12-31 2018-12-25 Foxconn Interconnect Technology Limited Plug connecetor with a metallic enclosure having heat sink member thereon
JP6424839B2 (ja) * 2016-01-08 2018-11-21 株式会社デンソー 電子制御ユニット、および、これを用いた電動パワーステアリング装置
JP6113314B1 (ja) * 2016-02-01 2017-04-12 三菱電機株式会社 防水型制御装置
JP6565757B2 (ja) * 2016-03-25 2019-08-28 株式会社デンソー 電子装置
DE102017212968B4 (de) * 2016-08-05 2024-02-01 Robert Bosch Gmbh Gehäuseaufbau für eine elektronische steuereinheit und herstellungsverfahren
JP6499213B2 (ja) * 2017-02-17 2019-04-10 太陽誘電株式会社 カバー及びそれを用いたモジュール
US10638643B2 (en) * 2017-11-14 2020-04-28 Canon Kabushiki Kaisha Electronic device
US11375639B2 (en) * 2018-06-03 2022-06-28 Tcpoly Inc. Additive manufactured multi-layer thermally conductive parts
US10813240B2 (en) 2018-12-05 2020-10-20 Carrier Corporation Control box including a water resistant seal
JPWO2021059914A1 (https=) * 2019-09-25 2021-04-01
JP7439468B2 (ja) * 2019-11-20 2024-02-28 富士電機株式会社 プログラマブルコントローラモジュール及びプログラマブルコントローラシステム
TWI718980B (zh) * 2020-08-07 2021-02-11 新唐科技股份有限公司 整合式感測裝置與其製造方法
JP7536631B2 (ja) * 2020-12-18 2024-08-20 株式会社マキタ 電動作業機
DE102021000931A1 (de) 2021-02-22 2022-08-25 KSB SE & Co. KGaA Pumpe mit einem Elektronikgehäuse und wenigstens einem Kühlkörper
US12495511B2 (en) * 2021-03-10 2025-12-09 Hitachi Astemo, Ltd. Electronic control device
DE102021001714A1 (de) 2021-04-01 2022-10-06 KSB SE & Co. KGaA Kreiselpumpe mit Kühlung der Elektronik innerhalb eines Elektronikgehäuses
JP7606676B2 (ja) * 2021-06-11 2024-12-26 株式会社オートネットワーク技術研究所 回路構成体
JP2023130256A (ja) * 2022-03-07 2023-09-20 株式会社デンソーテン 電子機器
EP4734681A1 (en) * 2023-06-26 2026-04-29 Sekisui Chemical Co., Ltd. Housing structure and method for manufacturing same
CN121753545A (zh) * 2023-11-16 2026-03-27 安斯泰莫株式会社 电子控制装置

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JP5344182B2 (ja) * 2010-02-02 2013-11-20 株式会社安川電機 電力変換装置
JP4948613B2 (ja) * 2010-02-25 2012-06-06 三菱電機株式会社 樹脂封止形電子制御装置、及びその製造方法
JP5460397B2 (ja) * 2010-03-17 2014-04-02 日立オートモティブシステムズ株式会社 自動車用電子制御装置
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JP5614542B2 (ja) * 2011-03-28 2014-10-29 株式会社安川電機 モータ制御装置

Also Published As

Publication number Publication date
DE112013004625T5 (de) 2015-06-03
US9480189B2 (en) 2016-10-25
US20150216088A1 (en) 2015-07-30
JP2014063930A (ja) 2014-04-10
MX340396B (es) 2016-07-07
IN2015DN01579A (https=) 2015-07-03
CN104663010A (zh) 2015-05-27
WO2014046004A1 (ja) 2014-03-27
MX2015002743A (es) 2015-05-15

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Effective date of registration: 20210730

Address after: Ibaraki

Patentee after: Hitachi astemo Co.,Ltd.

Address before: Ibaraki

Patentee before: HITACHI AUTOMOTIVE SYSTEMS, Ltd.