JPWO2021059914A1 - - Google Patents

Info

Publication number
JPWO2021059914A1
JPWO2021059914A1 JP2021548740A JP2021548740A JPWO2021059914A1 JP WO2021059914 A1 JPWO2021059914 A1 JP WO2021059914A1 JP 2021548740 A JP2021548740 A JP 2021548740A JP 2021548740 A JP2021548740 A JP 2021548740A JP WO2021059914 A1 JPWO2021059914 A1 JP WO2021059914A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021548740A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021059914A1 publication Critical patent/JPWO2021059914A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
JP2021548740A 2019-09-25 2020-09-03 Pending JPWO2021059914A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019174323 2019-09-25
PCT/JP2020/033435 WO2021059914A1 (ja) 2019-09-25 2020-09-03 電子回路装置

Publications (1)

Publication Number Publication Date
JPWO2021059914A1 true JPWO2021059914A1 (https=) 2021-04-01

Family

ID=75166596

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021548740A Pending JPWO2021059914A1 (https=) 2019-09-25 2020-09-03

Country Status (3)

Country Link
JP (1) JPWO2021059914A1 (https=)
DE (1) DE112020004544T5 (https=)
WO (1) WO2021059914A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61134039U (https=) * 1986-01-16 1986-08-21
JPH08222671A (ja) * 1994-12-14 1996-08-30 Toshiba Corp 回路モジュールの冷却装置
JP2002344177A (ja) * 2001-05-17 2002-11-29 Denso Corp 電子装置
JP2010245174A (ja) * 2009-04-02 2010-10-28 Denso Corp 電子制御ユニット及びその製造方法
WO2014046004A1 (ja) * 2012-09-21 2014-03-27 日立オートモティブシステムズ株式会社 電子制御装置
JP2015047031A (ja) * 2013-08-29 2015-03-12 株式会社オートネットワーク技術研究所 回路構成体
JP2019067788A (ja) * 2017-09-28 2019-04-25 日本シイエムケイ株式会社 プリント配線板用放熱金属片素材と当該放熱金属片素材を用いたプリント配線板の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6208072B2 (ja) 2014-04-28 2017-10-04 日立オートモティブシステムズ株式会社 電子回路装置およびその製造方法
JP7191312B2 (ja) 2018-03-29 2022-12-19 シヤチハタ株式会社 識別タグ、その干渉波形検出方法及びその真贋判定方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61134039U (https=) * 1986-01-16 1986-08-21
JPH08222671A (ja) * 1994-12-14 1996-08-30 Toshiba Corp 回路モジュールの冷却装置
JP2002344177A (ja) * 2001-05-17 2002-11-29 Denso Corp 電子装置
JP2010245174A (ja) * 2009-04-02 2010-10-28 Denso Corp 電子制御ユニット及びその製造方法
WO2014046004A1 (ja) * 2012-09-21 2014-03-27 日立オートモティブシステムズ株式会社 電子制御装置
JP2015047031A (ja) * 2013-08-29 2015-03-12 株式会社オートネットワーク技術研究所 回路構成体
JP2019067788A (ja) * 2017-09-28 2019-04-25 日本シイエムケイ株式会社 プリント配線板用放熱金属片素材と当該放熱金属片素材を用いたプリント配線板の製造方法

Also Published As

Publication number Publication date
DE112020004544T5 (de) 2022-06-09
WO2021059914A1 (ja) 2021-04-01

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