DE112020004544T5 - Elektronische Schaltungsvorrichtung - Google Patents

Elektronische Schaltungsvorrichtung Download PDF

Info

Publication number
DE112020004544T5
DE112020004544T5 DE112020004544.7T DE112020004544T DE112020004544T5 DE 112020004544 T5 DE112020004544 T5 DE 112020004544T5 DE 112020004544 T DE112020004544 T DE 112020004544T DE 112020004544 T5 DE112020004544 T5 DE 112020004544T5
Authority
DE
Germany
Prior art keywords
heat
electronic circuit
circuit device
wall portions
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112020004544.7T
Other languages
German (de)
English (en)
Inventor
Nagamori Hiraki
Haruhiko Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Astemo Ltd
Original Assignee
Hitachi Astemo Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Astemo Ltd filed Critical Hitachi Astemo Ltd
Publication of DE112020004544T5 publication Critical patent/DE112020004544T5/de
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE112020004544.7T 2019-09-25 2020-09-03 Elektronische Schaltungsvorrichtung Withdrawn DE112020004544T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-174323 2019-09-25
JP2019174323 2019-09-25
PCT/JP2020/033435 WO2021059914A1 (ja) 2019-09-25 2020-09-03 電子回路装置

Publications (1)

Publication Number Publication Date
DE112020004544T5 true DE112020004544T5 (de) 2022-06-09

Family

ID=75166596

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112020004544.7T Withdrawn DE112020004544T5 (de) 2019-09-25 2020-09-03 Elektronische Schaltungsvorrichtung

Country Status (3)

Country Link
JP (1) JPWO2021059914A1 (https=)
DE (1) DE112020004544T5 (https=)
WO (1) WO2021059914A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015211144A (ja) 2014-04-28 2015-11-24 日立オートモティブシステムズ株式会社 電子回路装置およびその製造方法
JP2019174323A (ja) 2018-03-29 2019-10-10 シヤチハタ株式会社 識別タグ、その干渉波形検出方法及びその真贋判定方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6211014Y2 (https=) * 1986-01-16 1987-03-16
JP3281220B2 (ja) * 1994-12-14 2002-05-13 株式会社東芝 回路モジュールの冷却装置
JP2002344177A (ja) * 2001-05-17 2002-11-29 Denso Corp 電子装置
JP2010245174A (ja) * 2009-04-02 2010-10-28 Denso Corp 電子制御ユニット及びその製造方法
JP2014063930A (ja) * 2012-09-21 2014-04-10 Hitachi Automotive Systems Ltd 電子制御装置
JP2015047031A (ja) * 2013-08-29 2015-03-12 株式会社オートネットワーク技術研究所 回路構成体
JP6894816B2 (ja) * 2017-09-28 2021-06-30 日本シイエムケイ株式会社 放熱金属片素材を用いたプリント配線板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015211144A (ja) 2014-04-28 2015-11-24 日立オートモティブシステムズ株式会社 電子回路装置およびその製造方法
JP2019174323A (ja) 2018-03-29 2019-10-10 シヤチハタ株式会社 識別タグ、その干渉波形検出方法及びその真贋判定方法

Also Published As

Publication number Publication date
WO2021059914A1 (ja) 2021-04-01
JPWO2021059914A1 (https=) 2021-04-01

Similar Documents

Publication Publication Date Title
EP0558712B1 (de) Elektrisches gerät, insbesondere schalt- und steuergerät für kraftfahrzeuge
DE69300143T2 (de) Geschichtetes Elektronikmodul.
DE102018206431A1 (de) Leiterplattenmodul und elektronische vorrichtung
DE2603575C2 (de) Einsteckmodul für eine elektronische Einrichtung
DE112016004646B4 (de) Elektrischer verteilerkasten
DE102008023451A1 (de) Elektrische Verbindungsanordnung
DE102007057533A1 (de) Kühlkörper und Verfahren zur Herstellung eines Kühlkörpers
DE102016203527A1 (de) Elektronische Schaltungseinheit
DE112019002130T5 (de) Leistungswandlervorrichtung
DE4332115B4 (de) Anordnung zur Kühlung mindestens einen Kühlkörper aufweisenden Leiterplatte
WO2012076166A1 (de) Leiterplatte
DE102020122820B4 (de) Schaltungseinheit, elektrischer Verteilerkasten und Herstellungsverfahren für eine Schaltungseinheit
DE112019002582T5 (de) Schaltungsvorrichtung
DE112018001582T5 (de) Elektrischer Verteilerkasten
DE102012206505A1 (de) Elektronische vorrichtung mit einer leiterplatte mit wärmeabführungsstruktur
EP0881866A1 (de) Steuergerät
DE102014102899A1 (de) Leistungshalbleiter-Zusammenbau und -Modul
DE102006008807B4 (de) Anordnung mit einem Leistungshalbleitermodul und einem Kühlbauteil
DE2536957C2 (de) Elektronisches Bauelement
DE102008015785B4 (de) Elektroniksubstrat-Montagestruktur
DE102013111073A1 (de) Elektronische Schaltung
DE102017123109B4 (de) Leistungselektronikmodul
DE112019003853T5 (de) Elektrischer Verteilerkasten
DE112020004544T5 (de) Elektronische Schaltungsvorrichtung
DE102007039618A1 (de) Modul für eine integrierte Steuerelektronik mit vereinfachtem Aufbau

Legal Events

Date Code Title Description
R012 Request for examination validly filed
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee