MX340396B - Aparato de control electrónico. - Google Patents

Aparato de control electrónico.

Info

Publication number
MX340396B
MX340396B MX2015002743A MX2015002743A MX340396B MX 340396 B MX340396 B MX 340396B MX 2015002743 A MX2015002743 A MX 2015002743A MX 2015002743 A MX2015002743 A MX 2015002743A MX 340396 B MX340396 B MX 340396B
Authority
MX
Mexico
Prior art keywords
case
control apparatus
electronic control
heat generating
recessed section
Prior art date
Application number
MX2015002743A
Other languages
English (en)
Other versions
MX2015002743A (es
Inventor
Kawai Yoshio
Ohhashi Hironori
Yanagisawa Yuuichi
Yoshinaga Kumiko
Ichikawa Eiji
Original Assignee
Hitachi Automotive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Automotive Systems Ltd filed Critical Hitachi Automotive Systems Ltd
Publication of MX2015002743A publication Critical patent/MX2015002743A/es
Publication of MX340396B publication Critical patent/MX340396B/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Un componente (3) de generación de calor se monta en una superficie (4b), en un lado de una carcasa (12), de una tarjeta (4) de circuito. Una porción (5) rebajada se forma en una posición que confronta el componente (3) de generación de calor, en un lado de superficie (12e) de pared inferior de una pared (l2a) interior de la carcasa (12). Entre una superficie (5a) de pared interior de esta porción (5) rebajada y el componente (3) de generación de calor, un espacio libre (Ca) de componente de tamaño predeterminado se proporciona, y un miembro (6) de irradiación de calor se interpone en una posición del espacio libre (Ca) de componente. Un espacio libre (Cb) periférico se proporciona entre la superficie (4b), en el lado de la carcasa (12) , de la tarjeta (4) de circuito y la superficie (12e) de pared interior de la pared (l2a) inferior de la carcasa (12) en un lado de borde periférico de la porción (5) rebajada.
MX2015002743A 2012-09-21 2013-09-12 Aparato de control electrónico. MX340396B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012208927A JP2014063930A (ja) 2012-09-21 2012-09-21 電子制御装置
PCT/JP2013/074678 WO2014046004A1 (ja) 2012-09-21 2013-09-12 電子制御装置

Publications (2)

Publication Number Publication Date
MX2015002743A MX2015002743A (es) 2015-05-15
MX340396B true MX340396B (es) 2016-07-07

Family

ID=50341318

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2015002743A MX340396B (es) 2012-09-21 2013-09-12 Aparato de control electrónico.

Country Status (7)

Country Link
US (1) US9480189B2 (es)
JP (1) JP2014063930A (es)
CN (1) CN104663010B (es)
DE (1) DE112013004625T5 (es)
IN (1) IN2015DN01579A (es)
MX (1) MX340396B (es)
WO (1) WO2014046004A1 (es)

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DE102015212616A1 (de) * 2015-07-06 2017-01-12 Zf Friedrichshafen Ag Schutzgehäuse zur flexiblen Bauteilfixierung und Leiterplatte mit Schutzgehäuse
CN105163544A (zh) * 2015-09-22 2015-12-16 武汉菱电汽车电控系统股份有限公司 多功能汽车电子控制单元封装盒
JP6453195B2 (ja) * 2015-09-29 2019-01-16 日立オートモティブシステムズ株式会社 車載制御装置
DE102015221149A1 (de) * 2015-10-29 2017-05-04 Robert Bosch Gmbh Steuervorrichtung für eine Getriebesteuerung eines Kraftfahrzeugs
JP2017098332A (ja) * 2015-11-19 2017-06-01 株式会社ジェイテクト 電子回路装置
CN105374769A (zh) * 2015-12-04 2016-03-02 重庆臻远电气有限公司 散热装置
US10164362B2 (en) * 2015-12-31 2018-12-25 Foxconn Interconnect Technology Limited Plug connecetor with a metallic enclosure having heat sink member thereon
JP6424839B2 (ja) * 2016-01-08 2018-11-21 株式会社デンソー 電子制御ユニット、および、これを用いた電動パワーステアリング装置
JP6113314B1 (ja) * 2016-02-01 2017-04-12 三菱電機株式会社 防水型制御装置
JP6565757B2 (ja) * 2016-03-25 2019-08-28 株式会社デンソー 電子装置
DE102017212968B4 (de) * 2016-08-05 2024-02-01 Robert Bosch Gmbh Gehäuseaufbau für eine elektronische steuereinheit und herstellungsverfahren
JP6499213B2 (ja) * 2017-02-17 2019-04-10 太陽誘電株式会社 カバー及びそれを用いたモジュール
US10638643B2 (en) * 2017-11-14 2020-04-28 Canon Kabushiki Kaisha Electronic device
US11375639B2 (en) * 2018-06-03 2022-06-28 Tcpoly Inc. Additive manufactured multi-layer thermally conductive parts
US10813240B2 (en) 2018-12-05 2020-10-20 Carrier Corporation Control box including a water resistant seal
DE112020004544T5 (de) * 2019-09-25 2022-06-09 Hitachi Astemo, Ltd. Elektronische Schaltungsvorrichtung
JP7439468B2 (ja) * 2019-11-20 2024-02-28 富士電機株式会社 プログラマブルコントローラモジュール及びプログラマブルコントローラシステム
TWI718980B (zh) * 2020-08-07 2021-02-11 新唐科技股份有限公司 整合式感測裝置與其製造方法
DE102021000931A1 (de) 2021-02-22 2022-08-25 KSB SE & Co. KGaA Pumpe mit einem Elektronikgehäuse und wenigstens einem Kühlkörper
DE102021001714A1 (de) 2021-04-01 2022-10-06 KSB SE & Co. KGaA Kreiselpumpe mit Kühlung der Elektronik innerhalb eines Elektronikgehäuses

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JP5614542B2 (ja) * 2011-03-28 2014-10-29 株式会社安川電機 モータ制御装置

Also Published As

Publication number Publication date
WO2014046004A1 (ja) 2014-03-27
CN104663010A (zh) 2015-05-27
US20150216088A1 (en) 2015-07-30
CN104663010B (zh) 2018-02-09
DE112013004625T5 (de) 2015-06-03
JP2014063930A (ja) 2014-04-10
IN2015DN01579A (es) 2015-07-03
US9480189B2 (en) 2016-10-25
MX2015002743A (es) 2015-05-15

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Legal Events

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