MX2016004868A - Carcasa protectora, tablero de circuitos impresos y dispositivo terminal. - Google Patents
Carcasa protectora, tablero de circuitos impresos y dispositivo terminal.Info
- Publication number
- MX2016004868A MX2016004868A MX2016004868A MX2016004868A MX2016004868A MX 2016004868 A MX2016004868 A MX 2016004868A MX 2016004868 A MX2016004868 A MX 2016004868A MX 2016004868 A MX2016004868 A MX 2016004868A MX 2016004868 A MX2016004868 A MX 2016004868A
- Authority
- MX
- Mexico
- Prior art keywords
- shielding cover
- terminal equipment
- pcb board
- cover
- shielding
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0212—Printed circuits or mounted components having integral heating means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0209—Thermal insulation, e.g. for fire protection or for fire containment or for high temperature environments
- H05K5/0211—Thermal buffers, e.g. latent heat absorbers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20518—Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20427—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing having radiation enhancing surface treatment, e.g. black coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0052—Shielding other than Faraday cages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
Abstract
Se describe una carcasa protectora, un tablero de circuitos impresos (PCB) y un dispositivo terminal; la carcasa protectora incluye un primer cuerpo de carcasa protectora (1) y un segundo cuerpo de carcasa protectora (2) que están interconectados entre sí, en donde el segundo cuerpo de carcasa protectora (2) cubre al menos parcialmente una parte exterior del primer cuerpo de carcasa protectora (1), y un material de almacenamiento de calor (3) está integrado entre el cuerpo de carcasa protectora (1) y el segundo cuerpo de carcasa protectora (2).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510660841.XA CN105246314B (zh) | 2015-10-14 | 2015-10-14 | 屏蔽罩、pcb板和终端设备 |
PCT/CN2015/098904 WO2017063285A1 (zh) | 2015-10-14 | 2015-12-25 | 屏蔽罩、pcb板和终端设备 |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2016004868A true MX2016004868A (es) | 2017-05-04 |
Family
ID=55043720
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2016004868A MX2016004868A (es) | 2015-10-14 | 2015-12-25 | Carcasa protectora, tablero de circuitos impresos y dispositivo terminal. |
Country Status (8)
Country | Link |
---|---|
US (1) | US10117324B2 (es) |
EP (1) | EP3157317B1 (es) |
JP (1) | JP2017537452A (es) |
KR (1) | KR101814159B1 (es) |
CN (1) | CN105246314B (es) |
MX (1) | MX2016004868A (es) |
RU (1) | RU2649060C1 (es) |
WO (1) | WO2017063285A1 (es) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105916351A (zh) * | 2016-04-29 | 2016-08-31 | 广东欧珀移动通信有限公司 | 一种屏蔽罩和移动终端 |
CN105744822B (zh) * | 2016-04-29 | 2019-06-14 | Oppo广东移动通信有限公司 | 屏蔽罩、电路板和移动终端 |
CN107820359A (zh) * | 2016-09-14 | 2018-03-20 | 深圳市掌网科技股份有限公司 | 一种主pcba板 |
CN206472427U (zh) | 2016-09-28 | 2017-09-05 | 华为技术有限公司 | 电子设备散热结构及电子设备 |
KR102398672B1 (ko) * | 2017-05-18 | 2022-05-17 | 삼성전자주식회사 | 방열구조를 포함하는 전자 장치 |
CN108401410B (zh) * | 2018-04-11 | 2019-08-06 | 业成科技(成都)有限公司 | 适用于上方屏蔽罩与下方屏蔽罩的印刷电路板 |
US11089712B2 (en) | 2019-03-19 | 2021-08-10 | Microsoft Technology Licensing, Llc | Ventilated shield can |
EP3944010B1 (en) * | 2020-07-23 | 2023-02-15 | Ficosa Adas, S.L.U. | Display assembly for an imaging device |
CN113258228A (zh) * | 2021-06-29 | 2021-08-13 | 成都市克莱微波科技有限公司 | 一种多通道幅相一致微波组件 |
CN113784605B (zh) * | 2021-09-14 | 2024-04-02 | 万安裕维电子有限公司 | 一种自带屏蔽结构的pcb板 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0613198U (ja) * | 1992-07-24 | 1994-02-18 | 三洋電機株式会社 | 多重シールド構造 |
JPH0946080A (ja) | 1995-07-28 | 1997-02-14 | Aichi Corp | 電子装置のシールド装置 |
JPH1041678A (ja) | 1996-07-25 | 1998-02-13 | Hitachi Ltd | 光受信器 |
US5717577A (en) * | 1996-10-30 | 1998-02-10 | Ericsson, Inc. | Gasketed shield can for shielding emissions of electromagnetic energy |
JP2000124623A (ja) * | 1998-10-13 | 2000-04-28 | Sony Corp | 電子機器 |
JP2000286584A (ja) * | 1999-03-30 | 2000-10-13 | Kokusai Electric Co Ltd | 携帯型通信機のシールド構造 |
JP3791686B2 (ja) | 2003-03-19 | 2006-06-28 | 株式会社タムラ製作所 | シールドケース |
JP2005236036A (ja) * | 2004-02-19 | 2005-09-02 | Denso Corp | 車両用電子制御装置 |
US7623360B2 (en) * | 2006-03-09 | 2009-11-24 | Laird Technologies, Inc. | EMI shielding and thermal management assemblies including frames and covers with multi-position latching |
JP5196728B2 (ja) * | 2006-03-20 | 2013-05-15 | 株式会社東芝 | X線ct装置 |
US8077479B2 (en) * | 2008-02-20 | 2011-12-13 | Apple Inc. | Apparatus for reducing electromagnetic interference and spreading heat |
WO2009107303A1 (ja) * | 2008-02-28 | 2009-09-03 | 日本電気株式会社 | 電磁シールド構造およびそれを用いた無線装置、電磁シールドの製造方法 |
DE102009014852A1 (de) * | 2009-03-30 | 2010-10-07 | Jl Goslar Gmbh & Co. Kg | Baugruppe mit einem Kühlelement, Kühlelement für eine derartige Baugruppe und Verfahren zur Herstellung eines derartigen Kühlelements |
TWI495423B (zh) * | 2010-09-21 | 2015-08-01 | Foxconn Tech Co Ltd | 散熱模組及採用該散熱模組之電子裝置 |
KR101052559B1 (ko) * | 2011-02-25 | 2011-07-29 | 김선기 | 전자파 차폐 및 보호용 실드케이스 |
US20130077282A1 (en) * | 2011-09-09 | 2013-03-28 | Apple Inc. | Integrated thermal and emi shields and methods for making the same |
JP2013157573A (ja) * | 2012-01-31 | 2013-08-15 | Toshiba Corp | 蓄熱冷却器 |
TWI497656B (zh) * | 2012-06-08 | 2015-08-21 | Foxconn Tech Co Ltd | 電子裝置 |
US9210832B2 (en) * | 2012-08-13 | 2015-12-08 | Asustek Computer Inc. | Thermal buffering element |
CN103796479B (zh) * | 2012-10-31 | 2017-05-31 | 英业达科技有限公司 | 电子装置 |
CN203136420U (zh) * | 2013-03-06 | 2013-08-14 | 惠州Tcl移动通信有限公司 | 具有散热结构的终端和屏蔽罩 |
CN103260388A (zh) * | 2013-04-24 | 2013-08-21 | 常州碳元科技发展有限公司 | 具有屏蔽罩功能的高导热石墨膜结构 |
KR20160018236A (ko) * | 2014-08-08 | 2016-02-17 | 삼성전자주식회사 | 인쇄회로기판 어셈블리 및 그 제조방법 |
CN106717141B (zh) * | 2014-09-30 | 2020-12-22 | 汉高知识产权控股有限责任公司 | 使用电磁干扰罐内相变材料进行温度调节 |
CN204408625U (zh) * | 2015-01-21 | 2015-06-17 | 瑞声声学科技(深圳)有限公司 | Mems麦克风 |
CN204392756U (zh) * | 2015-02-12 | 2015-06-10 | 中兴通讯股份有限公司 | 散热屏蔽装置及终端 |
CN104902041A (zh) * | 2015-06-11 | 2015-09-09 | 宁波绿凯节能科技有限公司 | 一种相变控温手机壳 |
-
2015
- 2015-10-14 CN CN201510660841.XA patent/CN105246314B/zh active Active
- 2015-12-25 JP JP2016533703A patent/JP2017537452A/ja active Pending
- 2015-12-25 WO PCT/CN2015/098904 patent/WO2017063285A1/zh active Application Filing
- 2015-12-25 RU RU2016116336A patent/RU2649060C1/ru active
- 2015-12-25 KR KR1020167013601A patent/KR101814159B1/ko active IP Right Grant
- 2015-12-25 MX MX2016004868A patent/MX2016004868A/es unknown
-
2016
- 2016-03-03 EP EP16158530.2A patent/EP3157317B1/en active Active
- 2016-03-22 US US15/077,868 patent/US10117324B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN105246314B (zh) | 2018-09-04 |
US20170111989A1 (en) | 2017-04-20 |
KR101814159B1 (ko) | 2018-01-02 |
WO2017063285A1 (zh) | 2017-04-20 |
US10117324B2 (en) | 2018-10-30 |
EP3157317B1 (en) | 2018-12-26 |
KR20170055009A (ko) | 2017-05-18 |
JP2017537452A (ja) | 2017-12-14 |
RU2649060C1 (ru) | 2018-03-29 |
EP3157317A1 (en) | 2017-04-19 |
CN105246314A (zh) | 2016-01-13 |
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