WO2017063285A1 - 屏蔽罩、pcb板和终端设备 - Google Patents

屏蔽罩、pcb板和终端设备 Download PDF

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Publication number
WO2017063285A1
WO2017063285A1 PCT/CN2015/098904 CN2015098904W WO2017063285A1 WO 2017063285 A1 WO2017063285 A1 WO 2017063285A1 CN 2015098904 W CN2015098904 W CN 2015098904W WO 2017063285 A1 WO2017063285 A1 WO 2017063285A1
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WO
WIPO (PCT)
Prior art keywords
shield
heat
top wall
side wall
shell
Prior art date
Application number
PCT/CN2015/098904
Other languages
English (en)
French (fr)
Inventor
王东亮
王少杰
石莎莎
Original Assignee
小米科技有限责任公司
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Filing date
Publication date
Application filed by 小米科技有限责任公司 filed Critical 小米科技有限责任公司
Priority to KR1020167013601A priority Critical patent/KR101814159B1/ko
Priority to MX2016004868A priority patent/MX2016004868A/es
Priority to RU2016116336A priority patent/RU2649060C1/ru
Priority to JP2016533703A priority patent/JP2017537452A/ja
Publication of WO2017063285A1 publication Critical patent/WO2017063285A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0209—Thermal insulation, e.g. for fire protection or for fire containment or for high temperature environments
    • H05K5/0211—Thermal buffers, e.g. latent heat absorbers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20518—Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20427—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing having radiation enhancing surface treatment, e.g. black coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0052—Shielding other than Faraday cages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding

Definitions

  • the present disclosure relates to shielding of electronic devices, and more particularly to a shield case, a PCB board using the same, and a terminal device using the same.
  • embodiments of the present disclosure provide a shield cover, a PCB board, and a terminal device.
  • a shield case including a first shield shell and a second shield shell that are connected to each other, the first shield shell having a first top wall and a first a second shielding shell having a second top wall and a second side wall, the second shielding shell being at least partially disposed outside the first shielding shell, and the first shielding shell And a heat storage material is accommodated between the second shield shell;
  • a PCB board including a board body and disposed on A heat generating device on the board body, the heat generating device is provided with a shield cover in the embodiment of the present disclosure, and the shield cover is connected to the board body.
  • the upper cover of the heat generating device is provided with a first shielding cover body, and the outer side cover of the first shielding cover body is provided with a second shielding cover body, and the first shielding cover body and the second shielding cover body are respectively connected to The plate body and the heat storage material are accommodated between the first shield shell and the second shield shell.
  • a terminal device in which a PCB board is provided, the PCB board being a PCB board in the disclosed embodiment.
  • the technical solution provided by the embodiment of the present disclosure may include the following effects: the heat dissipated by the heat generating device may be occluded by the heat storage material accommodated in the two-layer shield shell, and then gradually evaporated. Therefore, the heat of the heat-generating device can be dissipated at a high speed, and the large amount of heat dissipated can be directly transmitted to the terminal device to affect the user experience.
  • the two-layer structure itself has a surface area that absorbs heat much, and enhances the control effect on heat.
  • FIG. 1 is a cross-sectional structural view showing a PCB board according to a first exemplary embodiment
  • FIG. 2 is a cross-sectional structural view showing a PCB board according to a second exemplary embodiment
  • FIG. 3 is a cross-sectional structural view showing a PCB board according to a third exemplary embodiment
  • FIG. 4 is a perspective structural schematic view of a shield case according to a first exemplary embodiment.
  • orientation words used such as “up, down, left, and right" are generally based on the direction of the drawing of the corresponding drawing, and specifically, the direction of the drawing shown in FIGS. 1 to 3 can be referred to.
  • “Inside and outside” refers to the inside and outside of the contour of the corresponding component.
  • an exemplary embodiment of the present disclosure provides a shield cover, a PCB board, and a terminal device, wherein the terminal device may be a device that a user, such as a mobile phone, a tablet computer, or the like often needs to hold.
  • An important heat source in the terminal device is a heat generating device 5 on the PCB, such as a main chip.
  • a heat generating device 5 releases a large amount of heat while operating at a high speed, and the exemplary embodiment of the present disclosure can effectively control the influence of heat dissipation of the heat generating device 5 on the user experience.
  • a PCB board including the board body 4 and the heat generated on the board body 4 is provided.
  • a shield can be placed over the heat generating component 5, and the shield can be attached to the plate 4, for example to the plate 4.
  • the shielding cover itself has the radiation effect of shielding high-speed running components such as the heat-generating component 5 to avoid interference with other components, and the material thereof can be made of a shielding material such as stainless steel or white copper.
  • the shield case in each exemplary embodiment of the present disclosure includes a first shield case 1 and a second shield case 2 that are connected to each other, and the first shield case 1 has a first top wall 11 And the first side wall 12, the second shield shell 2 has a second top wall 21 and a second side wall 22, wherein the side walls of the two shield shells may extend vertically downward from the top wall, or may be slightly angled The slope extends to form a hood structure.
  • the second shield shell 2 is at least partially disposed outside the first shield shell 1 , and the heat storage material 3 is accommodated between the first shield shell 1 and the second shield shell 2 .
  • the heat dissipated by the heat generating device 5 can be absorbed and stored by the heat storage material 3 accommodated in the two-layer shield case, and then gradually dissipated. Thereby achieving high speed operation
  • the heat dissipation of the heating device 5 can prevent the large amount of heat dissipated from being directly distributed to the terminal device and affecting the user experience.
  • the two-layer structure itself has a surface area that absorbs heat much, and enhances the control effect on heat.
  • the shield can also be more layers, which can be determined by weighing the volume of the terminal device and controlling the heat.
  • the heat storage material 3 may be made of a material having a low thermal conductivity, such as a silica material having a low thermal conductivity.
  • the second shield case 2 is disposed outside the first top wall 11.
  • the first top wall 11 having a larger area in the first shield case 1 is used to carry the heat storage material 3, and the process of assembling onto the board 4 of the PCB board is simple, and only the bottom of the first side wall 12 is required. It can be welded to the plate body 4.
  • the two shielding shells can be stamped separately and then welded to each other.
  • the cross-sectional area of the second shielding shell 2 is smaller than the cross-sectional area of the first shielding shell 1 .
  • the bottom end of the second side wall 22 of the smaller second shield shell 2 can be more conveniently welded to the first top wall 11 of the first shield shell 1.
  • the cross-sectional areas of the two covers may be the same.
  • the two covers and the plate 4 can also be detachably connected by snapping, plugging or the like.
  • the second shield case 2 is simultaneously covered on the first top wall 11 and the first side wall.
  • the second shield shell 2 is connected to the first shield shell 1 by a plurality of connecting columns 23 arranged at intervals in the circumferential direction, the joint pillars 23
  • the inner end is connected to a corner between the first top wall and the first side wall
  • the outer end is connected to a corner between the second top wall and the second side wall, such that the heat storage material 3 can include the first top wall and the second A first heat storage material 31 between the top walls, such as a heat storage material of a plate structure.
  • a second heat storage material 32 between the first side wall and the second side wall such as a heat storage material of a ring structure.
  • the first storage material 31 and the second heat storage material 32 may be a unitary structure, that is, a through-hole interface through which the connecting post 23 is formed may be formed, and the two may also be independent structures, that is, respectively assembled to two shields. Between the top walls and between the side walls.
  • the two shield shells may also be connected by a connecting ring located at a corner, and the connecting post may be disposed at the top wall and the side wall.
  • the shield shells are each a unitary structure, and as shown in FIG. 3, in the third exemplary embodiment of the present disclosure, between the two shield shells
  • the first shield shell 1 is disposed on the outer surface of the first shield shell 1
  • the first shield shell 1 and the second shield are disposed on the outer side of the first shield shell 1 .
  • the cover bodies 2 are respectively connected to the plate body 4, for example by welding, and the heat storage material 3 is accommodated between the first shield case body 1 and the second shield case body 2.
  • This third embodiment is also capable of performing heat control of the heat generating device 5 by the heat storage material between the two shield covers.
  • the structure of the two shield shells in the third exemplary embodiment may be the same as or similar to the two shield shells in the second embodiment, wherein the heat storage material 3 between the two may be simultaneously disposed on the top wall. Between the and between the side walls, in other possible embodiments, it may also be provided only between the top walls.
  • the second shield case 2 is formed with a plurality of spaced-apart heat dissipation holes 24, so that the heat dissipation holes can be used to facilitate storage of the heat storage material.
  • the gradual heat dissipation after heat reduces the heat absorption load of the heat storage material.
  • similar heat dissipation holes 24 may be disposed on the second shield case 2 in other embodiments.
  • the specific shape of the shield can be determined according to the number and layout of the electronic components to be covered.
  • the heat dissipated by the heat generating device can be absorbed and stored by the heat storage material accommodated in the two shield shells, and then gradually dissipated. Therefore, the heat of the heat-generating device can be dissipated at a high speed, and the large amount of heat dissipated can be directly transmitted to the terminal device to affect the user experience.
  • the two-layer structure itself has a surface area that absorbs heat much, and enhances the control effect on heat.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Signal Processing (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Telephone Set Structure (AREA)
  • Casings For Electric Apparatus (AREA)
  • Details Of Aerials (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Distribution Board (AREA)

Abstract

本公开实施例是关于一种屏蔽罩、PCB板和终端设备，该屏蔽罩包括相互连接的第一屏蔽罩体（1）和第二屏蔽罩体（2），所述第二屏蔽罩体（2）至少部分地罩设在该第一屏蔽罩体（1）外侧，并且所述第一屏蔽罩体（1）和所述第二屏蔽罩体（2）之间容纳有储热材料（3）。

Description

屏蔽罩、PCB板和终端设备
相关申请的交叉引用
本申请基于申请号为201510660841.X、申请日为2015年10月14日的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此引入本申请作为参考。
技术领域
本公开涉及电子器件的屏蔽，尤其涉及一种屏蔽罩、使用该屏蔽罩的PCB板和使用该PCB板的终端设备。
背景技术
随着经济和社会发展，人们对手机等终端设备的性能的要求越来越高，随之电子器件功耗相应的也越来越大，散热问题就成为各个厂商必须要面临的问题。
发明内容
为克服相关技术中存在的问题，本公开实施例提供一种屏蔽罩、PCB板和终端设备。
根据本公开实施例的第一方面，提供一种屏蔽罩，该屏蔽罩包括相互连接的第一屏蔽罩体和第二屏蔽罩体，所述第一屏蔽罩体具有第一顶壁和第一侧壁，所述第二屏蔽罩体具有第二顶壁和第二侧壁，所述第二屏蔽罩体至少部分地罩设在该第一屏蔽罩体外侧，并且所述第一屏蔽罩体和所述第二屏蔽罩体之间容纳有储热材料；
根据本公开实施例的第二方面，提供一种PCB板，包括板体和设置在 板体上的发热器件，所述发热器件上罩设有本公开实施例中的屏蔽罩，所述屏蔽罩连接到所述板体上。或者，所述发热器件上罩设有第一屏蔽罩体，该第一屏蔽罩体外侧罩设有第二屏蔽罩体，所述第一屏蔽罩体和所述第二屏蔽罩体分别连接到所述板体上，并且所述第一屏蔽罩体和所述第二屏蔽罩体之间容纳有储热材料。
根据本公开实施例的第三方面，提供一种终端设备，该终端设备内设置有PCB板，所述PCB板为本公开实施例中的PCB板。
本公开的实施例提供的技术方案可以包括以下有益效果：通过容纳在两层屏蔽罩体中的储热材料，可以对由发热器件散发的热量进行吸储，然后再逐渐散发而出。从而既可以实现高速运转的发热器件热量的散发，又可以避免所散发的大量热量直接散发到终端设备外而影响用户体验。另外，双层结构本身也具有较大吸收热量的表面积，增强对热量的控制效果。
应当理解的是，以上的一般描述和后文的细节描述仅是示例性和解释性的，并不能限制本公开。
附图说明
此处的附图被并入说明书中并构成本说明书的一部分，示出了符合本公开的实施例，并与说明书一起用于解释本公开的原理。
图1是根据第一示例性实施例示出的PCB板的剖视结构示意图；
图2是根据第二示例性实施例示出的PCB板的剖视结构示意图；
图3是根据第三示例性实施例示出的PCB板的剖视结构示意图；
图4是根据第一示例性实施例示出的屏蔽罩的立体结构示意图。
具体实施方式
这里将详细地对示例性实施例进行说明，其示例表示在附图中。下面的描述涉及附图时，除非另有表示，不同附图中的相同数字表示相同或相 似的要素。以下示例性实施例中所描述的实施方式并不代表与本公开实施例相一致的所有实施方式。相反，它们仅是与如所附权利要求书中所详述的、本公开实施例的一些方面相一致的装置和方法的例子。
在未作相反说明的情况下，使用的方位词如“上、下、左、右”通常以相应附图的图面方向为基准，具体地可参考图1至图3所示的图面方向，“内、外”则是指相应部件轮廓的内和外。
如图1至图3所示，本公开的示例性实施例提供了一种屏蔽罩、PCB板和终端设备，其中终端设备可以为手机、平板电脑等用户经常需要手持的设备。其中终端设备中的重要热源为PCB板上的发热器件5，例如主芯片。其中，此类发热器件5在高速运转的同时会释放大量热量，本公开的示例性实施例能够有效控制发热器件5的散热对用户体验的影响。
为了改善终端设备的散热性能，如图1和图2所示，在本公开第一、第二示例性实施例中，提供一种PCB板，包括板体4和设置在板体4上的发热器件5，其中，可以在发热器件5上罩设有屏蔽罩，屏蔽罩连接到板体4上，例如焊接到板体4上。其中屏蔽罩本身具有屏蔽高速运转元件如发热器件5的辐射作用，以避免对其他元件的干扰，其材质可以使用不锈钢或洋白铜等具有屏蔽作用的材料制成。
为了控制发热器件5的散热，本公开的各示例性实施例中的屏蔽罩包括相互连接的第一屏蔽罩体1和第二屏蔽罩体2，第一屏蔽罩体1具有第一顶壁11和第一侧壁12，第二屏蔽罩体2具有第二顶壁21和第二侧壁22，其中两个屏蔽罩体中的侧壁可以从顶壁垂直向下延伸，也可以略带角度倾斜延伸，以形成罩状结构。第二屏蔽罩体2至少部分地罩设在该第一屏蔽罩体1外侧，并且第一屏蔽罩体1和第二屏蔽罩体2之间容纳有储热材料3。
这样，通过容纳在两层屏蔽罩体中的储热材料3，可以对由发热器件5散发的热量进行吸储，然后再逐渐散发而出。从而既可以实现高速运转的 发热器件5热量的散发，又可以避免所散发的大量热量直接散发到终端设备外而影响用户体验。另外，双层结构本身也具有较大吸收热量的表面积，增强对热量的控制效果。在其他可能的实施例中，屏蔽罩体还可以为更多层，这可以通过权衡终端设备的体积和控制热量的效果而定。另外，在本公开的示例性实施例中，储热材料3可以采用导热系数低的材料，例如低导热系数的硅胶材料制成。
如图1和图4所示，在本公开第一示例性实施例中，第二屏蔽罩体2罩设在第一顶壁11外侧。从而利用第一屏蔽罩体1中的面积较大的第一顶壁11来承载储热材料3，并且装配到PCB板的板体4上的工艺简单，只需将第一侧壁12的底部焊接到板体4上即可。其中，两个屏蔽罩体可以分别冲压而成然后在相互焊接，为了更好地连接两个屏蔽罩体，第二屏蔽罩体2的横截面积小于第一屏蔽罩体1的横截面积，较小的第二屏蔽罩体2的第二侧壁22的底端可以较为方便地焊接到第一屏蔽罩体1的第一顶壁11上。在其他可能的实施例中，两个罩体的横截面积可以相同。两个罩体之间、以及与板体4之间也可以采用卡接、插接等可拆卸地方式相连。
如图2所示，在本公开的第二示例性实施例中，不同于如图1中的第一实施例，第二屏蔽罩体2同时罩设在第一顶壁11和第一侧壁12的外侧。这样，在发热器件5工作时，发热器件5所散发的热量不进可以从顶部还可以从侧壁得到吸储，从而控制终端设备的热量。
其中为了连接两个屏蔽罩体，在第二示例性实施例中，第二屏蔽罩体2通过沿周向间隔设置的多个连接柱23与第一屏蔽罩体1相连，该连接柱23的内端连接第一顶壁和第一侧壁之间的拐角，外端连接第二顶壁和第二侧壁之间的拐角，这样，储热材料3可以包括位于第一顶壁和第二顶壁之间的第一储热材料31，例如板状结构的储热材料。和位于第一侧壁和第二侧壁之间的第二储热材料32，例如环状结构的储热材料。而又因为多个连接 柱23之间具有间隙，可以使得两个屏蔽罩体之间的空间相互连通，使得两部分储热材料3之间相互配合，更好地在发热器件5的顶部和侧壁完成对热量的吸储。
其中，第一储存材料31和第二储热材料32可以为一体结构，即其中形成有供连接柱23穿过的通孔接口，二者也可以为独立结构，即分别装配到两个屏蔽罩的顶壁之间和侧壁之间。在一些可能的实施例中，两个屏蔽罩体还可以通过位于拐角处的连接环相连，连接柱的设置位置也可以为顶壁和侧壁上。
上述的第一和第二示例性实施例中，屏蔽罩体均为一个相连的整体结构，而如图3所示，在本公开第三示例性实施例中，两个屏蔽罩体之间还可以不设连接关系，这样，发热器件5上罩设有第一屏蔽罩体1，该第一屏蔽罩体1外侧罩设有第二屏蔽罩体2，第一屏蔽罩体1和第二屏蔽罩体2分别连接到板体4上，例如采用焊接方式，并且第一屏蔽罩体1和第二屏蔽罩体2之间容纳有储热材料3。该第三实施例同样能够通过两个屏蔽罩体之间的储热材料完成对发热器件5的热量控制。其中在第三示例性实施例中的两个屏蔽罩体本身结构可以与第二实施例中的两个屏蔽罩体相同或类似，其中二者之间的储热材料3可以同时设置在顶壁之间和侧壁之间，在其他可能的实施例中，也可以仅设置在顶壁之间。
另外，如图4所示，本公开第一示例性实施例中第二屏蔽罩体2上形成由多个间隔分布的散热孔24，因此通过这些散热孔可以有助于在储热材料在吸储热量后的逐步散热，减轻储热材料的吸热负荷。同理其他几个实施例中的第二屏蔽罩体2上也可以设置类似的散热孔24。另外，对于屏蔽罩的具体形状可以根据要罩盖的电子元件的数量和布局而定。
本领域技术人员在考虑说明书及实践本公开实施例后，将容易想到本公开实施例的其它实施方案。本申请旨在涵盖本公开实施例的任何变型、 用途或者适应性变化，这些变型、用途或者适应性变化遵循本公开实施例的一般性原理并包括本公开实施例未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本公开实施例的真正范围和精神由下面的权利要求指出。
应当理解的是，本公开实施例并不局限于上面已经描述并在附图中示出的精确结构，并且可以在不脱离其范围进行各种修改和改变。本公开实施例的范围仅由所附的权利要求来限制。
工业实用性
通过容纳在两层屏蔽罩体中的储热材料，可以对由发热器件散发的热量进行吸储，然后再逐渐散发而出。从而既可以实现高速运转的发热器件热量的散发，又可以避免所散发的大量热量直接散发到终端设备外而影响用户体验。另外，双层结构本身也具有较大吸收热量的表面积，增强对热量的控制效果。

Claims (10)

  1. 一种屏蔽罩，该屏蔽罩包括相互连接的第一屏蔽罩体(1)和第二屏蔽罩体(2)，所述第一屏蔽罩体(1)具有第一顶壁(11)和第一侧壁(12)，所述第二屏蔽罩体(2)具有第二顶壁(21)和第二侧壁(22)，所述第二屏蔽罩体(2)至少部分地罩设在该第一屏蔽罩体(1)外侧，并且所述第一屏蔽罩体(1)和所述第二屏蔽罩体(2)之间容纳有储热材料(3)。
  2. 根据权利要求1所述的屏蔽罩，其中，所述第二屏蔽罩体(2)罩设在所述第一顶壁(11)外侧。
  3. 根据权利要求2所述的屏蔽罩，其中，所述第二屏蔽罩体(2)的横截面积小于所述第一屏蔽罩体(1)的横截面积，并且所述第二侧壁(22)的底端焊接到所述第一顶壁(11)上。
  4. 根据权利要求1所述的屏蔽罩，其中，所述第二屏蔽罩体(2)同时罩设在所述第一顶壁(11)和第二侧壁(12)的外侧。
  5. 根据权利要求4所述的屏蔽罩，其中，所述第二屏蔽罩体(2)通过沿周向间隔设置的多个连接柱(23)与所述第一屏蔽罩体(1)相连，该连接柱(23)的内端连接所述第一顶壁(11)和第一侧壁(12)之间的拐角，外端连接所述第二顶壁(21)和第二侧壁(22)之间的拐角，并且所述储热材料(3)包括位于所述第一顶壁(11)和所述第二顶壁(21)之间的第一储热材料(31)，和位于所述第一侧壁(12)和所述第二侧壁(22)之间的第二储热材料(32)。
  6. 根据权利要求1至4中任意一项所述的屏蔽罩，其中，所述第二屏蔽罩体(2)上形成由多个间隔分布的散热孔(24)。
  7. 一种PCB板，包括板体(4)和设置在板体(4)上的发热器件(5)，所述发热器件(5)上罩设有根据权利要求1-6中任意一项所述的屏蔽罩， 所述屏蔽罩连接到所述板体(4)上。
  8. 一种PCB板，包括板体(4)和设置在板体(4)上的发热器件(5)，所述发热器件(5)上罩设有第一屏蔽罩体(1)，该第一屏蔽罩体(1)外侧罩设有第二屏蔽罩体(2)，所述第一屏蔽罩体(1)和所述第二屏蔽罩体(2)分别连接到所述板体(4)上，并且所述第一屏蔽罩体(1)和所述第二屏蔽罩体(2)之间容纳有储热材料(3)。
  9. 一种终端设备，该终端设备内设置有PCB板，所述PCB板为根据权利要求7或8中任意一项所述的PCB板。
  10. 根据权利要求9所述的终端设备，其中，所述终端设备为手机或平板电脑。
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