JP2013527325A5 - - Google Patents
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- JP2013527325A5 JP2013527325A5 JP2013513029A JP2013513029A JP2013527325A5 JP 2013527325 A5 JP2013527325 A5 JP 2013527325A5 JP 2013513029 A JP2013513029 A JP 2013513029A JP 2013513029 A JP2013513029 A JP 2013513029A JP 2013527325 A5 JP2013527325 A5 JP 2013527325A5
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- JP
- Japan
- Prior art keywords
- composition according
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- compound
- additive
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US35004510P | 2010-06-01 | 2010-06-01 | |
| US61/350,045 | 2010-06-01 | ||
| PCT/IB2011/052385 WO2011151785A1 (en) | 2010-06-01 | 2011-05-31 | Composition for metal electroplating comprising leveling agent |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013527325A JP2013527325A (ja) | 2013-06-27 |
| JP2013527325A5 true JP2013527325A5 (enExample) | 2015-09-17 |
| JP5933532B2 JP5933532B2 (ja) | 2016-06-15 |
Family
ID=45066252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013513029A Active JP5933532B2 (ja) | 2010-06-01 | 2011-05-31 | レベリング剤を含有する金属電解めっき用組成物 |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US9683302B2 (enExample) |
| EP (1) | EP2576696B1 (enExample) |
| JP (1) | JP5933532B2 (enExample) |
| KR (3) | KR101955869B1 (enExample) |
| CN (1) | CN102939339B (enExample) |
| IL (1) | IL223183B (enExample) |
| MY (1) | MY164464A (enExample) |
| RU (1) | RU2603675C2 (enExample) |
| SG (2) | SG185736A1 (enExample) |
| TW (1) | TWI539036B (enExample) |
| WO (1) | WO2011151785A1 (enExample) |
Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2655457B1 (en) | 2010-12-21 | 2019-04-10 | Basf Se | Composition for metal electroplating comprising leveling agent |
| US9243339B2 (en) * | 2012-05-25 | 2016-01-26 | Trevor Pearson | Additives for producing copper electrodeposits having low oxygen content |
| JP6211185B2 (ja) | 2013-11-06 | 2017-10-11 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ | レベラーとしての窒素含有ポリマー |
| JP2017524055A (ja) * | 2014-08-06 | 2017-08-24 | ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ | 高分子量のイオン性ポリマーイミダゾリウム化合物の製造方法 |
| WO2016020216A1 (en) * | 2014-08-06 | 2016-02-11 | Basf Se | Improved process for preparing polymeric, ionic imidazolium compounds |
| WO2016172851A1 (en) | 2015-04-28 | 2016-11-03 | Rohm And Haas Electronic Materials Llc | Reaction products of bisanhydrids and diamines as additives for electroplating baths |
| US9932684B2 (en) | 2015-08-06 | 2018-04-03 | Rohm And Haas Electronic Materials Llc | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides |
| US10100421B2 (en) * | 2015-08-06 | 2018-10-16 | Dow Global Technologies Llc | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds |
| TWI608132B (zh) | 2015-08-06 | 2017-12-11 | 羅門哈斯電子材料有限公司 | 自含有吡啶基烷基胺及雙環氧化物之反應產物的銅電鍍覆浴液電鍍覆光阻劑限定之特徵的方法 |
| US10006136B2 (en) | 2015-08-06 | 2018-06-26 | Dow Global Technologies Llc | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds |
| US20170067173A1 (en) * | 2015-09-09 | 2017-03-09 | Rohm And Haas Electronic Materials Llc | Acid copper electroplating bath and method for electroplating low internal stress and good ductility copper deposits |
| BR112018010046A2 (pt) * | 2015-11-20 | 2018-11-21 | Hexion Inc | composição, e, método para tratar incrustação |
| US10100420B2 (en) | 2015-12-29 | 2018-10-16 | Hong Kong Applied Science and Technology Research Institute Company Limtied | Plating leveler for electrodeposition of copper pillar |
| US10519557B2 (en) * | 2016-02-12 | 2019-12-31 | Macdermid Enthone Inc. | Leveler compositions for use in copper deposition in manufacture of microelectronics |
| US10190228B2 (en) * | 2016-03-29 | 2019-01-29 | Rohm And Haas Electronic Materials Llc | Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features |
| JP7123942B2 (ja) * | 2016-09-22 | 2022-08-23 | マクダーミッド エンソン インコーポレイテッド | 集積回路のウェハレベルパッケージングにおける銅堆積 |
| WO2018073011A1 (en) | 2016-10-20 | 2018-04-26 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| KR102457310B1 (ko) | 2016-12-20 | 2022-10-20 | 바스프 에스이 | 무-보이드 충전을 위한 억제 작용제를 포함하는 금속 도금용 조성물 |
| CN110678583B (zh) * | 2017-06-01 | 2022-09-30 | 巴斯夫欧洲公司 | 包含流平剂的锡合金电镀组合物 |
| EP3679179B1 (en) | 2017-09-04 | 2023-10-11 | Basf Se | Composition for metal electroplating comprising leveling agent |
| EP3511444B1 (en) * | 2018-01-16 | 2020-07-22 | ATOTECH Deutschland GmbH | Metal or metal alloy deposition composition and plating compound |
| KR102483615B1 (ko) * | 2018-01-24 | 2023-01-03 | 삼성전기주식회사 | 비스-아릴 암모늄 화합물을 포함하는 도금용 평탄제 및 이를 이용한 구리 도금 방법 |
| CN119121333A (zh) * | 2018-04-19 | 2024-12-13 | 巴斯夫欧洲公司 | 用于钴或钴合金电镀的组合物 |
| KR102662397B1 (ko) * | 2018-10-23 | 2024-05-02 | 솔브레인 주식회사 | 전기도금 조성물 및 전기도금 방법 |
| WO2021058334A1 (en) | 2019-09-27 | 2021-04-01 | Basf Se | Composition for copper bump electrodeposition comprising a leveling agent |
| EP4034697A1 (en) | 2019-09-27 | 2022-08-03 | Basf Se | Composition for copper bump electrodeposition comprising a leveling agent |
| CN110938847B (zh) * | 2019-10-30 | 2021-11-12 | 苏州清飙科技有限公司 | 电镀铜整平剂及其制备方法、以及电镀液 |
| IL296980A (en) | 2020-04-03 | 2022-12-01 | Basf Se | The composition for electrodeposition of copper bumps containing a polyaminoamide compensator |
| EP3922662A1 (en) | 2020-06-10 | 2021-12-15 | Basf Se | Polyalkanolamine |
| JP7781850B2 (ja) | 2020-07-13 | 2025-12-08 | ビーエーエスエフ ソシエタス・ヨーロピア | コバルトシード上の銅電気メッキ用組成物 |
| KR102339868B1 (ko) * | 2021-07-30 | 2021-12-16 | 와이엠티 주식회사 | 레벨링제 및 이를 포함하는 비아홀 충진을 위한 전기도금 조성물 |
| EP4409058B1 (en) | 2021-10-01 | 2025-11-05 | Basf Se | Composition for copper electrodeposition comprising a polyaminoamide type leveling agent |
| EP4551742A1 (en) | 2022-07-07 | 2025-05-14 | Basf Se | Use of a composition comprising a polyaminoamide type compound for copper nanotwin electrodeposition |
| KR20250124348A (ko) | 2022-12-19 | 2025-08-19 | 바스프 에스이 | 구리 나노트윈 전착용 조성물 |
| KR20260046113A (ko) | 2023-08-03 | 2026-04-06 | 바스프 에스이 | 금속 시드 상의 구리 전기도금을 위한 조성물 |
| WO2026037751A1 (en) | 2024-08-16 | 2026-02-19 | Basf Se | Composition for metal electroplating comprising an additive for defect-free filling of features on electronic substrates |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3108006A (en) * | 1959-07-13 | 1963-10-22 | M & T Chemicals Inc | Plating on aluminum |
| JPS55122892A (en) * | 1979-03-16 | 1980-09-20 | Furukawa Electric Co Ltd:The | Plating bath for tin, tin-lead alloy |
| US5077414A (en) * | 1990-03-29 | 1991-12-31 | E. I. Du Pont De Nemours And Company | Preparation of 1,3-disubstituted imidazolium salts |
| JPH04202305A (ja) * | 1990-11-29 | 1992-07-23 | Sanyo Chem Ind Ltd | ４級塩変性スチレン系樹脂 |
| JPH0754188A (ja) * | 1993-08-06 | 1995-02-28 | Nippon Steel Corp | アルミ−クロム合金めっき鋼板の製造法 |
| US5607570A (en) * | 1994-10-31 | 1997-03-04 | Rohbani; Elias | Electroplating solution |
| JP3655388B2 (ja) | 1996-04-08 | 2005-06-02 | ディップソール株式会社 | 錫めっき及び錫−鉛合金めっき用非酸性浴、及び該めっき浴を用いためっき方法 |
| US6024857A (en) | 1997-10-08 | 2000-02-15 | Novellus Systems, Inc. | Electroplating additive for filling sub-micron features |
| FR2773991B1 (fr) | 1998-01-26 | 2000-05-26 | Oreal | Utilisation a titre d'agent protecteur des fibres keratiniques de polymeres de polyammonium quaternaire heterocyclique et compositions cosmetiques |
| JP2001073182A (ja) | 1999-07-15 | 2001-03-21 | Boc Group Inc:The | 改良された酸性銅電気メッキ用溶液 |
| US20050006245A1 (en) * | 2003-07-08 | 2005-01-13 | Applied Materials, Inc. | Multiple-step electrodeposition process for direct copper plating on barrier metals |
| WO2001096632A2 (en) * | 2000-06-15 | 2001-12-20 | Applied Materials, Inc. | A method and apparatus for conditioning electrochemical baths in plating technology |
| US6610192B1 (en) | 2000-11-02 | 2003-08-26 | Shipley Company, L.L.C. | Copper electroplating |
| US8002962B2 (en) | 2002-03-05 | 2011-08-23 | Enthone Inc. | Copper electrodeposition in microelectronics |
| US7316772B2 (en) | 2002-03-05 | 2008-01-08 | Enthone Inc. | Defect reduction in electrodeposited copper for semiconductor applications |
| US20030201191A1 (en) * | 2002-04-29 | 2003-10-30 | Applied Materials, Inc. | Electrochemical method for direct organic additives analysis in copper baths |
| JP2004217565A (ja) | 2003-01-15 | 2004-08-05 | Shikoku Chem Corp | 殺菌剤及び活性汚泥のバルキングならびにスカム解消方法 |
| US7128822B2 (en) | 2003-06-04 | 2006-10-31 | Shipley Company, L.L.C. | Leveler compounds |
| DE10333239A1 (de) * | 2003-07-21 | 2005-03-10 | Basf Ag | Verfahren zur Herstellung von gereinigten 1,3- substituierten Imidazoliumsalzen |
| TW200613586A (en) * | 2004-07-22 | 2006-05-01 | Rohm & Haas Elect Mat | Leveler compounds |
| JP4973829B2 (ja) * | 2004-07-23 | 2012-07-11 | 上村工業株式会社 | 電気銅めっき浴及び電気銅めっき方法 |
| US7771579B2 (en) | 2004-12-03 | 2010-08-10 | Taiwan Semiconductor Manufacturing Co. | Electro chemical plating additives for improving stress and leveling effect |
| US7662981B2 (en) * | 2005-07-16 | 2010-02-16 | Rohm And Haas Electronic Materials Llc | Leveler compounds |
| KR101223386B1 (ko) * | 2006-09-25 | 2013-01-16 | 에스케이종합화학 주식회사 | 이미다졸린계 부식억제제 조성물 |
| RU2334831C2 (ru) * | 2006-10-31 | 2008-09-27 | Федеральное государственное унитарное предприятие "Калужский научно-исследовательский институт телемеханических устройств" | Электролит меднения |
| JP2008195990A (ja) * | 2007-02-09 | 2008-08-28 | Dipsol Chem Co Ltd | 電気アルミニウムめっき浴及びそれを用いためっき方法 |
| WO2009074535A2 (de) * | 2007-12-12 | 2009-06-18 | Basf Se | Verfahren zur herstellung von disubstituierten imidazoliumsalzen |
| EP2093278A1 (de) * | 2008-02-05 | 2009-08-26 | Evonik Goldschmidt GmbH | Performance-Additive zur Verbesserung der Benetzungseigenschaften von ionischen Flüssigkeiten auf festen Oberflächen |
| EP2199315B1 (en) | 2008-12-19 | 2013-12-11 | Basf Se | Composition for metal electroplating comprising leveling agent |
| WO2010072571A1 (de) | 2008-12-22 | 2010-07-01 | Basf Se | Verfahren zur herstellung von polymeren, ionischen imidazoliumverbindungen |
-
2011
- 2011-05-31 EP EP11789339.6A patent/EP2576696B1/en active Active
- 2011-05-31 KR KR1020187023375A patent/KR101955869B1/ko active Active
- 2011-05-31 TW TW100119130A patent/TWI539036B/zh active
- 2011-05-31 MY MYPI2012005096A patent/MY164464A/en unknown
- 2011-05-31 SG SG2012086377A patent/SG185736A1/en unknown
- 2011-05-31 KR KR1020137000075A patent/KR101829866B1/ko active Active
- 2011-05-31 RU RU2012157535/05A patent/RU2603675C2/ru not_active IP Right Cessation
- 2011-05-31 SG SG10201504251WA patent/SG10201504251WA/en unknown
- 2011-05-31 US US13/701,217 patent/US9683302B2/en active Active
- 2011-05-31 CN CN201180027324.9A patent/CN102939339B/zh active Active
- 2011-05-31 JP JP2013513029A patent/JP5933532B2/ja active Active
- 2011-05-31 KR KR1020187004069A patent/KR101891473B1/ko active Active
- 2011-05-31 WO PCT/IB2011/052385 patent/WO2011151785A1/en not_active Ceased
-
2012
- 2012-11-22 IL IL223183A patent/IL223183B/en active IP Right Grant
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