RU2603675C2 - Композиция для нанесения металлического покрытия посредством электролитического осаждения, содержащая выравнивающий агент - Google Patents

Композиция для нанесения металлического покрытия посредством электролитического осаждения, содержащая выравнивающий агент Download PDF

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RU2603675C2
RU2603675C2 RU2012157535/05A RU2012157535A RU2603675C2 RU 2603675 C2 RU2603675 C2 RU 2603675C2 RU 2012157535/05 A RU2012157535/05 A RU 2012157535/05A RU 2012157535 A RU2012157535 A RU 2012157535A RU 2603675 C2 RU2603675 C2 RU 2603675C2
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Russia
Prior art keywords
copper
deposition
present
electrolytic
compound
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RU2012157535/05A
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English (en)
Russian (ru)
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RU2012157535A (ru
Inventor
Михаэль ЗИМЕР
Корнэлиа РЕГЕР-ГЕПФЕРТ
Николь МАЙЕР
Роман Бенедикт РЭТЭР
Марко АРНОЛЬД
Шарлотте ЭМНЕТ
Дитер Майер
Александер ФЛЮГЕЛЬ
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Басф Се
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0605—Polycondensates containing five-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0616—Polycondensates containing five-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with only two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
RU2012157535/05A 2010-06-01 2011-05-31 Композиция для нанесения металлического покрытия посредством электролитического осаждения, содержащая выравнивающий агент RU2603675C2 (ru)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US35004510P 2010-06-01 2010-06-01
US61/350,045 2010-06-01
PCT/IB2011/052385 WO2011151785A1 (en) 2010-06-01 2011-05-31 Composition for metal electroplating comprising leveling agent

Publications (2)

Publication Number Publication Date
RU2012157535A RU2012157535A (ru) 2014-07-20
RU2603675C2 true RU2603675C2 (ru) 2016-11-27

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RU2012157535/05A RU2603675C2 (ru) 2010-06-01 2011-05-31 Композиция для нанесения металлического покрытия посредством электролитического осаждения, содержащая выравнивающий агент

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Country Link
US (1) US9683302B2 (enExample)
EP (1) EP2576696B1 (enExample)
JP (1) JP5933532B2 (enExample)
KR (3) KR101955869B1 (enExample)
CN (1) CN102939339B (enExample)
IL (1) IL223183B (enExample)
MY (1) MY164464A (enExample)
RU (1) RU2603675C2 (enExample)
SG (2) SG185736A1 (enExample)
TW (1) TWI539036B (enExample)
WO (1) WO2011151785A1 (enExample)

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CN110678583B (zh) * 2017-06-01 2022-09-30 巴斯夫欧洲公司 包含流平剂的锡合金电镀组合物
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KR102483615B1 (ko) * 2018-01-24 2023-01-03 삼성전기주식회사 비스-아릴 암모늄 화합물을 포함하는 도금용 평탄제 및 이를 이용한 구리 도금 방법
CN119121333A (zh) * 2018-04-19 2024-12-13 巴斯夫欧洲公司 用于钴或钴合金电镀的组合物
KR102662397B1 (ko) * 2018-10-23 2024-05-02 솔브레인 주식회사 전기도금 조성물 및 전기도금 방법
WO2021058334A1 (en) 2019-09-27 2021-04-01 Basf Se Composition for copper bump electrodeposition comprising a leveling agent
EP4034697A1 (en) 2019-09-27 2022-08-03 Basf Se Composition for copper bump electrodeposition comprising a leveling agent
CN110938847B (zh) * 2019-10-30 2021-11-12 苏州清飙科技有限公司 电镀铜整平剂及其制备方法、以及电镀液
IL296980A (en) 2020-04-03 2022-12-01 Basf Se The composition for electrodeposition of copper bumps containing a polyaminoamide compensator
EP3922662A1 (en) 2020-06-10 2021-12-15 Basf Se Polyalkanolamine
JP7781850B2 (ja) 2020-07-13 2025-12-08 ビーエーエスエフ ソシエタス・ヨーロピア コバルトシード上の銅電気メッキ用組成物
KR102339868B1 (ko) * 2021-07-30 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 비아홀 충진을 위한 전기도금 조성물
EP4409058B1 (en) 2021-10-01 2025-11-05 Basf Se Composition for copper electrodeposition comprising a polyaminoamide type leveling agent
EP4551742A1 (en) 2022-07-07 2025-05-14 Basf Se Use of a composition comprising a polyaminoamide type compound for copper nanotwin electrodeposition
KR20250124348A (ko) 2022-12-19 2025-08-19 바스프 에스이 구리 나노트윈 전착용 조성물
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TWI539036B (zh) 2016-06-21
KR101955869B1 (ko) 2019-03-07
CN102939339B (zh) 2016-02-17
KR20180017244A (ko) 2018-02-20
SG185736A1 (en) 2012-12-28
US9683302B2 (en) 2017-06-20
JP2013527325A (ja) 2013-06-27
EP2576696B1 (en) 2017-10-04
RU2012157535A (ru) 2014-07-20
WO2011151785A1 (en) 2011-12-08
CN102939339A (zh) 2013-02-20
KR20180094140A (ko) 2018-08-22
KR20130112018A (ko) 2013-10-11
MY164464A (en) 2017-12-15
EP2576696A4 (en) 2014-07-16
EP2576696A1 (en) 2013-04-10
KR101829866B1 (ko) 2018-02-20
TW201211321A (en) 2012-03-16
IL223183B (en) 2018-03-29
IL223183A0 (en) 2013-02-03
US20130068626A1 (en) 2013-03-21
KR101891473B1 (ko) 2018-08-27
JP5933532B2 (ja) 2016-06-15
SG10201504251WA (en) 2015-07-30

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