SG10201504251WA - Composition for metal electroplating comprising leveling agent - Google Patents
Composition for metal electroplating comprising leveling agentInfo
- Publication number
- SG10201504251WA SG10201504251WA SG10201504251WA SG10201504251WA SG10201504251WA SG 10201504251W A SG10201504251W A SG 10201504251WA SG 10201504251W A SG10201504251W A SG 10201504251WA SG 10201504251W A SG10201504251W A SG 10201504251WA SG 10201504251W A SG10201504251W A SG 10201504251WA
- Authority
- SG
- Singapore
- Prior art keywords
- composition
- leveling agent
- metal electroplating
- electroplating
- metal
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/0605—Polycondensates containing five-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
- C08G73/0616—Polycondensates containing five-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with only two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Electrochemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US35004510P | 2010-06-01 | 2010-06-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201504251WA true SG10201504251WA (en) | 2015-07-30 |
Family
ID=45066252
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201504251WA SG10201504251WA (en) | 2010-06-01 | 2011-05-31 | Composition for metal electroplating comprising leveling agent |
SG2012086377A SG185736A1 (en) | 2010-06-01 | 2011-05-31 | Composition for metal electroplating comprising leveling agent |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG2012086377A SG185736A1 (en) | 2010-06-01 | 2011-05-31 | Composition for metal electroplating comprising leveling agent |
Country Status (11)
Country | Link |
---|---|
US (1) | US9683302B2 (en) |
EP (1) | EP2576696B1 (en) |
JP (1) | JP5933532B2 (en) |
KR (3) | KR101829866B1 (en) |
CN (1) | CN102939339B (en) |
IL (1) | IL223183B (en) |
MY (1) | MY164464A (en) |
RU (1) | RU2603675C2 (en) |
SG (2) | SG10201504251WA (en) |
TW (1) | TWI539036B (en) |
WO (1) | WO2011151785A1 (en) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103270064B (en) | 2010-12-21 | 2016-12-07 | 巴斯夫欧洲公司 | Comprise the composition for metal electroplating of levelling agent |
US9243339B2 (en) * | 2012-05-25 | 2016-01-26 | Trevor Pearson | Additives for producing copper electrodeposits having low oxygen content |
EP3068819B1 (en) | 2013-11-06 | 2019-03-27 | Rohm and Haas Electronic Materials LLC | Nitrogen containing polymers as levelers |
US10344128B2 (en) * | 2014-08-06 | 2019-07-09 | Basf Se | Process for preparing polymeric, ionic imidazolium compounds |
WO2016020214A1 (en) * | 2014-08-06 | 2016-02-11 | Basf Se | Process for preparing polymeric, ionic imidazolium compounds of high molecular weight |
JP2018517793A (en) | 2015-04-28 | 2018-07-05 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | Reaction product of bis anhydride and diamine as additive for electroplating bath |
US10006136B2 (en) | 2015-08-06 | 2018-06-26 | Dow Global Technologies Llc | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds |
US9932684B2 (en) | 2015-08-06 | 2018-04-03 | Rohm And Haas Electronic Materials Llc | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides |
US10100421B2 (en) * | 2015-08-06 | 2018-10-16 | Dow Global Technologies Llc | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds |
TWI608132B (en) | 2015-08-06 | 2017-12-11 | 羅門哈斯電子材料有限公司 | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyridyl alkylamines and bisepoxides |
US20170067173A1 (en) * | 2015-09-09 | 2017-03-09 | Rohm And Haas Electronic Materials Llc | Acid copper electroplating bath and method for electroplating low internal stress and good ductility copper deposits |
RU2018122266A (en) * | 2015-11-20 | 2019-12-30 | Хексион Инк. | CHEMICAL PRODUCTS FOR SURFACE PROTECTION |
US10100420B2 (en) | 2015-12-29 | 2018-10-16 | Hong Kong Applied Science and Technology Research Institute Company Limtied | Plating leveler for electrodeposition of copper pillar |
US10519557B2 (en) * | 2016-02-12 | 2019-12-31 | Macdermid Enthone Inc. | Leveler compositions for use in copper deposition in manufacture of microelectronics |
US10190228B2 (en) * | 2016-03-29 | 2019-01-29 | Rohm And Haas Electronic Materials Llc | Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features |
CN109996785B (en) * | 2016-09-22 | 2021-12-28 | 麦克德米德乐思公司 | Copper deposition in wafer level packaging of integrated circuits |
WO2018073011A1 (en) | 2016-10-20 | 2018-04-26 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
KR102457310B1 (en) | 2016-12-20 | 2022-10-20 | 바스프 에스이 | Composition for Metal Plating Containing Inhibitory Agents for Void-Free Filling |
CN110678583B (en) * | 2017-06-01 | 2022-09-30 | 巴斯夫欧洲公司 | Tin alloy electroplating compositions containing leveling agents |
US11387108B2 (en) | 2017-09-04 | 2022-07-12 | Basf Se | Composition for metal electroplating comprising leveling agent |
EP3511444B1 (en) * | 2018-01-16 | 2020-07-22 | ATOTECH Deutschland GmbH | Metal or metal alloy deposition composition and plating compound |
KR102483615B1 (en) * | 2018-01-24 | 2023-01-03 | 삼성전기주식회사 | Leveler for plating comprising bis-aryl ammonium and copper plating method using the same |
KR102662397B1 (en) * | 2018-10-23 | 2024-05-02 | 솔브레인 주식회사 | Electroplating composition and electroplating method |
WO2021058336A1 (en) | 2019-09-27 | 2021-04-01 | Basf Se | Composition for copper bump electrodeposition comprising a leveling agent |
EP4034696A1 (en) | 2019-09-27 | 2022-08-03 | Basf Se | Composition for copper bump electrodeposition comprising a leveling agent |
CN110938847B (en) * | 2019-10-30 | 2021-11-12 | 苏州清飙科技有限公司 | Copper electroplating leveling agent, preparation method thereof and electroplating solution |
CN115335434A (en) | 2020-04-03 | 2022-11-11 | 巴斯夫欧洲公司 | Composition for copper bump electrodeposition comprising polyaminoamide type leveling agent |
EP3922662A1 (en) | 2020-06-10 | 2021-12-15 | Basf Se | Polyalkanolamine |
JP2023533784A (en) | 2020-07-13 | 2023-08-04 | ビーエーエスエフ ソシエタス・ヨーロピア | Composition for copper electroplating on cobalt seeds |
KR102339868B1 (en) * | 2021-07-30 | 2021-12-16 | 와이엠티 주식회사 | Leveler and electroplating composition for filling via hole |
IL311715A (en) | 2021-10-01 | 2024-05-01 | Basf Se | Composition for copper electrodeposition comprising a polyaminoamide type leveling agent |
WO2024008562A1 (en) | 2022-07-07 | 2024-01-11 | Basf Se | Use of a composition comprising a polyaminoamide type compound for copper nanotwin electrodeposition |
Family Cites Families (31)
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US3108006A (en) * | 1959-07-13 | 1963-10-22 | M & T Chemicals Inc | Plating on aluminum |
JPS55122892A (en) * | 1979-03-16 | 1980-09-20 | Furukawa Electric Co Ltd:The | Plating bath for tin, tin-lead alloy |
US5077414A (en) * | 1990-03-29 | 1991-12-31 | E. I. Du Pont De Nemours And Company | Preparation of 1,3-disubstituted imidazolium salts |
JPH04202305A (en) * | 1990-11-29 | 1992-07-23 | Sanyo Chem Ind Ltd | Quarternary salt-modified styrene-based resin |
JPH0754188A (en) * | 1993-08-06 | 1995-02-28 | Nippon Steel Corp | Production of aluminum-chromium alloy plated steel sheet |
US5607570A (en) * | 1994-10-31 | 1997-03-04 | Rohbani; Elias | Electroplating solution |
JP3655388B2 (en) * | 1996-04-08 | 2005-06-02 | ディップソール株式会社 | Non-acid bath for tin plating and tin-lead alloy plating, and plating method using the plating bath |
US6024857A (en) | 1997-10-08 | 2000-02-15 | Novellus Systems, Inc. | Electroplating additive for filling sub-micron features |
FR2773991B1 (en) | 1998-01-26 | 2000-05-26 | Oreal | USE AS A PROTECTIVE AGENT FOR KERATINIC FIBERS OF HETEROCYCLIC QUATERNARY POLYAMMONIUM POLYMERS AND COSMETIC COMPOSITIONS |
JP2001073182A (en) | 1999-07-15 | 2001-03-21 | Boc Group Inc:The | Improved acidic copper electroplating solution |
US20050006245A1 (en) * | 2003-07-08 | 2005-01-13 | Applied Materials, Inc. | Multiple-step electrodeposition process for direct copper plating on barrier metals |
WO2001096632A2 (en) * | 2000-06-15 | 2001-12-20 | Applied Materials, Inc. | A method and apparatus for conditioning electrochemical baths in plating technology |
US6610192B1 (en) | 2000-11-02 | 2003-08-26 | Shipley Company, L.L.C. | Copper electroplating |
US7316772B2 (en) | 2002-03-05 | 2008-01-08 | Enthone Inc. | Defect reduction in electrodeposited copper for semiconductor applications |
US8002962B2 (en) | 2002-03-05 | 2011-08-23 | Enthone Inc. | Copper electrodeposition in microelectronics |
US20030201191A1 (en) * | 2002-04-29 | 2003-10-30 | Applied Materials, Inc. | Electrochemical method for direct organic additives analysis in copper baths |
JP2004217565A (en) | 2003-01-15 | 2004-08-05 | Shikoku Chem Corp | Fungicide and method for solving bulking and scumming of activated sludge |
US7128822B2 (en) | 2003-06-04 | 2006-10-31 | Shipley Company, L.L.C. | Leveler compounds |
DE10333239A1 (en) * | 2003-07-21 | 2005-03-10 | Basf Ag | Process for the preparation of purified 1,3-substituted imidazolium salts |
TW200613586A (en) * | 2004-07-22 | 2006-05-01 | Rohm & Haas Elect Mat | Leveler compounds |
JP4973829B2 (en) * | 2004-07-23 | 2012-07-11 | 上村工業株式会社 | Electro copper plating bath and electro copper plating method |
JP4202305B2 (en) * | 2004-07-29 | 2008-12-24 | ファナック株式会社 | 3D laser processing machine |
US7771579B2 (en) | 2004-12-03 | 2010-08-10 | Taiwan Semiconductor Manufacturing Co. | Electro chemical plating additives for improving stress and leveling effect |
US7662981B2 (en) * | 2005-07-16 | 2010-02-16 | Rohm And Haas Electronic Materials Llc | Leveler compounds |
KR101223386B1 (en) * | 2006-09-25 | 2013-01-16 | 에스케이종합화학 주식회사 | Imidazoline-based Corrosion Inhibitors Composition |
RU2334831C2 (en) * | 2006-10-31 | 2008-09-27 | Федеральное государственное унитарное предприятие "Калужский научно-исследовательский институт телемеханических устройств" | Electrolyte of copper coating |
JP2008195990A (en) * | 2007-02-09 | 2008-08-28 | Dipsol Chem Co Ltd | Electric aluminum plating bath and plating method using the same |
KR20100098437A (en) * | 2007-12-12 | 2010-09-06 | 바스프 에스이 | Method for the production of disubstituted imidazolium salts |
EP2093278A1 (en) * | 2008-02-05 | 2009-08-26 | Evonik Goldschmidt GmbH | Performance additive for improving the sprinkling characteristics of ionic fluids on solid surfaces |
EP2199315B1 (en) | 2008-12-19 | 2013-12-11 | Basf Se | Composition for metal electroplating comprising leveling agent |
ES2702453T3 (en) | 2008-12-22 | 2019-03-01 | Basf Se | Process for the preparation of polymeric imidazolium ionic compounds |
-
2011
- 2011-05-31 EP EP11789339.6A patent/EP2576696B1/en active Active
- 2011-05-31 KR KR1020137000075A patent/KR101829866B1/en active IP Right Grant
- 2011-05-31 SG SG10201504251WA patent/SG10201504251WA/en unknown
- 2011-05-31 KR KR1020187004069A patent/KR101891473B1/en active Application Filing
- 2011-05-31 TW TW100119130A patent/TWI539036B/en active
- 2011-05-31 SG SG2012086377A patent/SG185736A1/en unknown
- 2011-05-31 CN CN201180027324.9A patent/CN102939339B/en active Active
- 2011-05-31 JP JP2013513029A patent/JP5933532B2/en active Active
- 2011-05-31 WO PCT/IB2011/052385 patent/WO2011151785A1/en active Application Filing
- 2011-05-31 KR KR1020187023375A patent/KR101955869B1/en active IP Right Grant
- 2011-05-31 RU RU2012157535/05A patent/RU2603675C2/en not_active IP Right Cessation
- 2011-05-31 US US13/701,217 patent/US9683302B2/en active Active
- 2011-05-31 MY MYPI2012005096A patent/MY164464A/en unknown
-
2012
- 2012-11-22 IL IL223183A patent/IL223183B/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
IL223183B (en) | 2018-03-29 |
CN102939339A (en) | 2013-02-20 |
TW201211321A (en) | 2012-03-16 |
KR20180017244A (en) | 2018-02-20 |
US20130068626A1 (en) | 2013-03-21 |
EP2576696A1 (en) | 2013-04-10 |
KR101955869B1 (en) | 2019-03-07 |
IL223183A0 (en) | 2013-02-03 |
EP2576696A4 (en) | 2014-07-16 |
CN102939339B (en) | 2016-02-17 |
JP2013527325A (en) | 2013-06-27 |
JP5933532B2 (en) | 2016-06-15 |
KR101891473B1 (en) | 2018-08-27 |
RU2603675C2 (en) | 2016-11-27 |
TWI539036B (en) | 2016-06-21 |
KR20130112018A (en) | 2013-10-11 |
WO2011151785A1 (en) | 2011-12-08 |
MY164464A (en) | 2017-12-15 |
EP2576696B1 (en) | 2017-10-04 |
KR101829866B1 (en) | 2018-02-20 |
KR20180094140A (en) | 2018-08-22 |
SG185736A1 (en) | 2012-12-28 |
RU2012157535A (en) | 2014-07-20 |
US9683302B2 (en) | 2017-06-20 |
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