JPS55122892A - Plating bath for tin, tin-lead alloy - Google Patents

Plating bath for tin, tin-lead alloy

Info

Publication number
JPS55122892A
JPS55122892A JP3091279A JP3091279A JPS55122892A JP S55122892 A JPS55122892 A JP S55122892A JP 3091279 A JP3091279 A JP 3091279A JP 3091279 A JP3091279 A JP 3091279A JP S55122892 A JPS55122892 A JP S55122892A
Authority
JP
Japan
Prior art keywords
ions
tin
plating bath
stannous
plumbous
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3091279A
Other languages
Japanese (ja)
Inventor
Shoji Shiga
Hitoshi Kato
Satoshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FURUKAWA KINZOKU KOGYO KK
Furukawa Metals Co Ltd
Furukawa Electric Co Ltd
Original Assignee
FURUKAWA KINZOKU KOGYO KK
Furukawa Metals Co Ltd
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FURUKAWA KINZOKU KOGYO KK, Furukawa Metals Co Ltd, Furukawa Electric Co Ltd filed Critical FURUKAWA KINZOKU KOGYO KK
Priority to JP3091279A priority Critical patent/JPS55122892A/en
Publication of JPS55122892A publication Critical patent/JPS55122892A/en
Pending legal-status Critical Current

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  • Electroplating And Plating Baths Therefor (AREA)

Abstract

PURPOSE: To produce uniform, dense plated layer at a high speed, by addn. of a specified amount of imidazolium betains to a plating bath contg. sulfamic acid ions as a principal component, stannous ions, and plumbous ions.
CONSTITUTION: Stannous ions, or stannous ions and plumbous ions are used in a concentration about 10W200g/l. Sulfamic acid ions are used in a concentration not smaller than that equivalent of stannous ions or stannous ions and plumbous ions contained in the bath. To the plating bath is added 0.1W50g/l of imidazolium betains shown by formula I, where R', R are hydrocarbons, M', M are H, NH4 +, or alkali metal, and n is an integer.
COPYRIGHT: (C)1980,JPO&Japio
JP3091279A 1979-03-16 1979-03-16 Plating bath for tin, tin-lead alloy Pending JPS55122892A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3091279A JPS55122892A (en) 1979-03-16 1979-03-16 Plating bath for tin, tin-lead alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3091279A JPS55122892A (en) 1979-03-16 1979-03-16 Plating bath for tin, tin-lead alloy

Publications (1)

Publication Number Publication Date
JPS55122892A true JPS55122892A (en) 1980-09-20

Family

ID=12316904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3091279A Pending JPS55122892A (en) 1979-03-16 1979-03-16 Plating bath for tin, tin-lead alloy

Country Status (1)

Country Link
JP (1) JPS55122892A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011151785A1 (en) * 2010-06-01 2011-12-08 Basf Se Composition for metal electroplating comprising leveling agent

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011151785A1 (en) * 2010-06-01 2011-12-08 Basf Se Composition for metal electroplating comprising leveling agent
CN102939339A (en) * 2010-06-01 2013-02-20 巴斯夫欧洲公司 Composition for metal electroplating comprising leveling agent
US9683302B2 (en) 2010-06-01 2017-06-20 Basf Se Composition for metal electroplating comprising leveling agent

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