JPS55122892A - Plating bath for tin, tin-lead alloy - Google Patents
Plating bath for tin, tin-lead alloyInfo
- Publication number
- JPS55122892A JPS55122892A JP3091279A JP3091279A JPS55122892A JP S55122892 A JPS55122892 A JP S55122892A JP 3091279 A JP3091279 A JP 3091279A JP 3091279 A JP3091279 A JP 3091279A JP S55122892 A JPS55122892 A JP S55122892A
- Authority
- JP
- Japan
- Prior art keywords
- ions
- tin
- plating bath
- stannous
- plumbous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title abstract 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 title 1
- 150000002500 ions Chemical class 0.000 abstract 8
- RAXXELZNTBOGNW-UHFFFAOYSA-O Imidazolium Chemical compound C1=C[NH+]=CN1 RAXXELZNTBOGNW-UHFFFAOYSA-O 0.000 abstract 2
- -1 sulfamic acid ions Chemical class 0.000 abstract 2
- 229910052783 alkali metal Inorganic materials 0.000 abstract 1
- 150000001340 alkali metals Chemical class 0.000 abstract 1
- 229930195733 hydrocarbon Natural products 0.000 abstract 1
- 150000002430 hydrocarbons Chemical class 0.000 abstract 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
PURPOSE: To produce uniform, dense plated layer at a high speed, by addn. of a specified amount of imidazolium betains to a plating bath contg. sulfamic acid ions as a principal component, stannous ions, and plumbous ions.
CONSTITUTION: Stannous ions, or stannous ions and plumbous ions are used in a concentration about 10W200g/l. Sulfamic acid ions are used in a concentration not smaller than that equivalent of stannous ions or stannous ions and plumbous ions contained in the bath. To the plating bath is added 0.1W50g/l of imidazolium betains shown by formula I, where R', R are hydrocarbons, M', M are H, NH4 +, or alkali metal, and n is an integer.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3091279A JPS55122892A (en) | 1979-03-16 | 1979-03-16 | Plating bath for tin, tin-lead alloy |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3091279A JPS55122892A (en) | 1979-03-16 | 1979-03-16 | Plating bath for tin, tin-lead alloy |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55122892A true JPS55122892A (en) | 1980-09-20 |
Family
ID=12316904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3091279A Pending JPS55122892A (en) | 1979-03-16 | 1979-03-16 | Plating bath for tin, tin-lead alloy |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55122892A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011151785A1 (en) * | 2010-06-01 | 2011-12-08 | Basf Se | Composition for metal electroplating comprising leveling agent |
-
1979
- 1979-03-16 JP JP3091279A patent/JPS55122892A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011151785A1 (en) * | 2010-06-01 | 2011-12-08 | Basf Se | Composition for metal electroplating comprising leveling agent |
CN102939339A (en) * | 2010-06-01 | 2013-02-20 | 巴斯夫欧洲公司 | Composition for metal electroplating comprising leveling agent |
US9683302B2 (en) | 2010-06-01 | 2017-06-20 | Basf Se | Composition for metal electroplating comprising leveling agent |
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