JP2016518530A5 - - Google Patents
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- Publication number
- JP2016518530A5 JP2016518530A5 JP2016513303A JP2016513303A JP2016518530A5 JP 2016518530 A5 JP2016518530 A5 JP 2016518530A5 JP 2016513303 A JP2016513303 A JP 2016513303A JP 2016513303 A JP2016513303 A JP 2016513303A JP 2016518530 A5 JP2016518530 A5 JP 2016518530A5
- Authority
- JP
- Japan
- Prior art keywords
- copper
- carrier
- electrolytic copper
- concentration
- plating solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 29
- 229910052802 copper Inorganic materials 0.000 claims description 29
- 239000010949 copper Substances 0.000 claims description 29
- 239000003795 chemical substances by application Substances 0.000 claims description 11
- 238000007747 plating Methods 0.000 claims description 9
- 239000000969 carrier Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 239000006259 organic additive Substances 0.000 claims description 3
- 239000000080 wetting agent Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 2
- 238000000151 deposition Methods 0.000 description 8
- 230000008021 deposition Effects 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 238000004070 electrodeposition Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 3
- 230000002378 acidificating effect Effects 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 229920005682 EO-PO block copolymer Polymers 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP13075031.8 | 2013-05-13 | ||
| EP13075031.8A EP2803756A1 (en) | 2013-05-13 | 2013-05-13 | Method for depositing thick copper layers onto sintered materials |
| PCT/EP2014/059530 WO2014184102A2 (en) | 2013-05-13 | 2014-05-09 | Method for depositing thick copper layers onto sintered materials |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016518530A JP2016518530A (ja) | 2016-06-23 |
| JP2016518530A5 true JP2016518530A5 (enExample) | 2018-10-11 |
| JP6463735B2 JP6463735B2 (ja) | 2019-02-06 |
Family
ID=48463683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016513303A Expired - Fee Related JP6463735B2 (ja) | 2013-05-13 | 2014-05-09 | 焼結材料上への厚い銅層の堆積方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20160060781A1 (enExample) |
| EP (2) | EP2803756A1 (enExample) |
| JP (1) | JP6463735B2 (enExample) |
| KR (1) | KR102254080B1 (enExample) |
| CN (1) | CN105189827B (enExample) |
| TW (1) | TWI638914B (enExample) |
| WO (1) | WO2014184102A2 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI542729B (zh) * | 2015-07-09 | 2016-07-21 | 旭德科技股份有限公司 | 線路板及其製作方法 |
| KR20180020219A (ko) * | 2015-07-16 | 2018-02-27 | 다우 글로벌 테크놀로지스 엘엘씨 | 나노 전도성 입자 증착막의 결합 된 사진 및 화학적인 소결 |
| WO2018057490A1 (en) * | 2016-09-22 | 2018-03-29 | Macdermid Enthone Inc. | Copper plating method and composition for semiconductor substrates |
| CN107986810B (zh) * | 2018-01-22 | 2022-11-18 | 中国计量大学 | 功率电子器件用AlN陶瓷敷铜基板及其制备方法 |
| JP7337338B2 (ja) * | 2018-08-24 | 2023-09-04 | 時空化学株式会社 | Ｖｏｃ除去用触媒の製造方法及びｖｏｃ除去方法 |
| JP7107189B2 (ja) * | 2018-11-28 | 2022-07-27 | 住友金属鉱山株式会社 | 銅張積層板および銅張積層板の製造方法 |
| KR102748951B1 (ko) * | 2019-06-25 | 2025-01-02 | 삼성전기주식회사 | 인쇄회로기판 도금 방법 및 인쇄회로기판 |
| CN110952118A (zh) * | 2019-11-20 | 2020-04-03 | 中电国基南方集团有限公司 | 一种陶瓷电路无氰镀铜溶液、配制方法及电镀工艺 |
| CN112626577B (zh) * | 2020-12-01 | 2023-05-19 | 中国兵器工业第五九研究所 | 一种石英晶体电极薄膜的制备方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3887405A (en) * | 1974-05-10 | 1975-06-03 | Minnesota Mining & Mfg | Method and composition for cleaning copper surfaces |
| JPS60131998A (ja) * | 1983-12-19 | 1985-07-13 | Ngk Spark Plug Co Ltd | メツキの前処理液 |
| US4888208A (en) | 1986-10-16 | 1989-12-19 | Toyo Boseki Kabushiki Kaisha | Ceramic substrate for printed circuits and production thereof |
| DE3836521C2 (de) | 1988-10-24 | 1995-04-13 | Atotech Deutschland Gmbh | Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung des Bades |
| JPH0633499B2 (ja) * | 1988-12-27 | 1994-05-02 | 上村工業株式会社 | 非導電体へのめっき方法 |
| FI88286C (fi) * | 1990-09-19 | 1993-04-26 | Lk Products Oy | Foerfarande foer att belaegga ett dielektriskt keramiskt stycke med ett elektricitet ledande skikt |
| US5242535A (en) | 1992-09-29 | 1993-09-07 | The Boc Group, Inc. | Method of forming a copper circuit pattern |
| JP3481379B2 (ja) * | 1995-08-23 | 2003-12-22 | メック株式会社 | 電気めっき法 |
| US6036835A (en) * | 1997-09-24 | 2000-03-14 | Shipley Company, L.L.C. | Method of microetching a conductive polymer on multilayer circuit boards |
| JP4812144B2 (ja) | 1998-07-22 | 2011-11-09 | 住友電気工業株式会社 | 窒化アルミニウム焼結体及びその製造方法 |
| US6444110B2 (en) * | 1999-05-17 | 2002-09-03 | Shipley Company, L.L.C. | Electrolytic copper plating method |
| AT407536B (de) | 1999-11-17 | 2001-04-25 | Electrovac | Verfahren zur herstellung einer temperaturwechselbeanspruchbaren kupferschicht auf einem keramischen substrat |
| JP4033611B2 (ja) * | 2000-07-28 | 2008-01-16 | メック株式会社 | 銅または銅合金のマイクロエッチング剤およびそれを用いるマイクロエッチング法 |
| JP2006052101A (ja) * | 2004-08-10 | 2006-02-23 | Mitsuboshi Belting Ltd | セラミックス基材表面への金属皮膜形成方法及び金属化処理セラミックス基材 |
| JP2007081214A (ja) * | 2005-09-15 | 2007-03-29 | Mitsui Mining & Smelting Co Ltd | プリント配線基板の製造方法 |
| ATE506468T1 (de) * | 2008-04-28 | 2011-05-15 | Atotech Deutschland Gmbh | Wässriges saures bad und verfahren zum elektrolytischen abschneiden von kupfer |
| JP2012122097A (ja) | 2010-12-08 | 2012-06-28 | Ebara Corp | 電気めっき方法 |
-
2013
- 2013-05-13 EP EP13075031.8A patent/EP2803756A1/en not_active Withdrawn
-
2014
- 2014-05-09 US US14/888,762 patent/US20160060781A1/en not_active Abandoned
- 2014-05-09 JP JP2016513303A patent/JP6463735B2/ja not_active Expired - Fee Related
- 2014-05-09 WO PCT/EP2014/059530 patent/WO2014184102A2/en not_active Ceased
- 2014-05-09 CN CN201480026427.7A patent/CN105189827B/zh not_active Expired - Fee Related
- 2014-05-09 EP EP14723768.9A patent/EP2997180B1/en active Active
- 2014-05-09 KR KR1020157031997A patent/KR102254080B1/ko not_active Expired - Fee Related
- 2014-05-13 TW TW103116883A patent/TWI638914B/zh not_active IP Right Cessation
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