JP6463735B2 - 焼結材料上への厚い銅層の堆積方法 - Google Patents

焼結材料上への厚い銅層の堆積方法 Download PDF

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Publication number
JP6463735B2
JP6463735B2 JP2016513303A JP2016513303A JP6463735B2 JP 6463735 B2 JP6463735 B2 JP 6463735B2 JP 2016513303 A JP2016513303 A JP 2016513303A JP 2016513303 A JP2016513303 A JP 2016513303A JP 6463735 B2 JP6463735 B2 JP 6463735B2
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JP
Japan
Prior art keywords
layer
copper
sintered layer
current
substrate
Prior art date
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Expired - Fee Related
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JP2016513303A
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English (en)
Japanese (ja)
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JP2016518530A (ja
JP2016518530A5 (enExample
Inventor
グレーデン マークス
グレーデン マークス
ゲント ヘアコ
ゲント ヘアコ
ダンブロフスキー ニーナ
ダンブロフスキー ニーナ
マクネリー アンソニー
マクネリー アンソニー
リューター ローベアト
リューター ローベアト
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
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Atotech Deutschland GmbH and Co KG
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Publication of JP2016518530A publication Critical patent/JP2016518530A/ja
Publication of JP2016518530A5 publication Critical patent/JP2016518530A5/ja
Application granted granted Critical
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Expired - Fee Related legal-status Critical Current
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/38—Pretreatment of metallic surfaces to be electroplated of refractory metals or nickel
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
    • C25D5/44—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1492—Periodical treatments, e.g. pulse plating of through-holes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
JP2016513303A 2013-05-13 2014-05-09 焼結材料上への厚い銅層の堆積方法 Expired - Fee Related JP6463735B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP13075031.8A EP2803756A1 (en) 2013-05-13 2013-05-13 Method for depositing thick copper layers onto sintered materials
EP13075031.8 2013-05-13
PCT/EP2014/059530 WO2014184102A2 (en) 2013-05-13 2014-05-09 Method for depositing thick copper layers onto sintered materials

Publications (3)

Publication Number Publication Date
JP2016518530A JP2016518530A (ja) 2016-06-23
JP2016518530A5 JP2016518530A5 (enExample) 2018-10-11
JP6463735B2 true JP6463735B2 (ja) 2019-02-06

Family

ID=48463683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016513303A Expired - Fee Related JP6463735B2 (ja) 2013-05-13 2014-05-09 焼結材料上への厚い銅層の堆積方法

Country Status (7)

Country Link
US (1) US20160060781A1 (enExample)
EP (2) EP2803756A1 (enExample)
JP (1) JP6463735B2 (enExample)
KR (1) KR102254080B1 (enExample)
CN (1) CN105189827B (enExample)
TW (1) TWI638914B (enExample)
WO (1) WO2014184102A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021004413A (ja) * 2019-06-25 2021-01-14 サムソン エレクトロ−メカニックス カンパニーリミテッド． 印刷回路基板のめっき方法及びこれを用いた印刷回路基板

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI542729B (zh) * 2015-07-09 2016-07-21 旭德科技股份有限公司 線路板及其製作方法
CN107787258A (zh) * 2015-07-16 2018-03-09 陶氏环球技术有限责任公司 纳米导电粒子沉积层的组合式光和化学烧结
WO2018057490A1 (en) * 2016-09-22 2018-03-29 Macdermid Enthone Inc. Copper plating method and composition for semiconductor substrates
CN107986810B (zh) * 2018-01-22 2022-11-18 中国计量大学 功率电子器件用AlN陶瓷敷铜基板及其制备方法
JP7337338B2 (ja) * 2018-08-24 2023-09-04 時空化学株式会社 Ｖｏｃ除去用触媒の製造方法及びｖｏｃ除去方法
JP7107189B2 (ja) * 2018-11-28 2022-07-27 住友金属鉱山株式会社 銅張積層板および銅張積層板の製造方法
CN110952118A (zh) * 2019-11-20 2020-04-03 中电国基南方集团有限公司 一种陶瓷电路无氰镀铜溶液、配制方法及电镀工艺
CN112626577B (zh) * 2020-12-01 2023-05-19 中国兵器工业第五九研究所 一种石英晶体电极薄膜的制备方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3887405A (en) * 1974-05-10 1975-06-03 Minnesota Mining & Mfg Method and composition for cleaning copper surfaces
JPS60131998A (ja) * 1983-12-19 1985-07-13 Ngk Spark Plug Co Ltd メツキの前処理液
US4888208A (en) 1986-10-16 1989-12-19 Toyo Boseki Kabushiki Kaisha Ceramic substrate for printed circuits and production thereof
DE3836521C2 (de) 1988-10-24 1995-04-13 Atotech Deutschland Gmbh Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung des Bades
JPH0633499B2 (ja) * 1988-12-27 1994-05-02 上村工業株式会社 非導電体へのめっき方法
FI88286C (fi) * 1990-09-19 1993-04-26 Lk Products Oy Foerfarande foer att belaegga ett dielektriskt keramiskt stycke med ett elektricitet ledande skikt
US5242535A (en) 1992-09-29 1993-09-07 The Boc Group, Inc. Method of forming a copper circuit pattern
JP3481379B2 (ja) * 1995-08-23 2003-12-22 メック株式会社 電気めっき法
US6036835A (en) * 1997-09-24 2000-03-14 Shipley Company, L.L.C. Method of microetching a conductive polymer on multilayer circuit boards
JP4812144B2 (ja) 1998-07-22 2011-11-09 住友電気工業株式会社 窒化アルミニウム焼結体及びその製造方法
US6444110B2 (en) * 1999-05-17 2002-09-03 Shipley Company, L.L.C. Electrolytic copper plating method
AT407536B (de) 1999-11-17 2001-04-25 Electrovac Verfahren zur herstellung einer temperaturwechselbeanspruchbaren kupferschicht auf einem keramischen substrat
JP4033611B2 (ja) * 2000-07-28 2008-01-16 メック株式会社 銅または銅合金のマイクロエッチング剤およびそれを用いるマイクロエッチング法
JP2006052101A (ja) * 2004-08-10 2006-02-23 Mitsuboshi Belting Ltd セラミックス基材表面への金属皮膜形成方法及び金属化処理セラミックス基材
JP2007081214A (ja) * 2005-09-15 2007-03-29 Mitsui Mining & Smelting Co Ltd プリント配線基板の製造方法
ATE506468T1 (de) * 2008-04-28 2011-05-15 Atotech Deutschland Gmbh Wässriges saures bad und verfahren zum elektrolytischen abschneiden von kupfer
JP2012122097A (ja) 2010-12-08 2012-06-28 Ebara Corp 電気めっき方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021004413A (ja) * 2019-06-25 2021-01-14 サムソン エレクトロ−メカニックス カンパニーリミテッド． 印刷回路基板のめっき方法及びこれを用いた印刷回路基板

Also Published As

Publication number Publication date
EP2997180B1 (en) 2019-07-03
CN105189827B (zh) 2017-09-12
JP2016518530A (ja) 2016-06-23
KR102254080B1 (ko) 2021-05-21
US20160060781A1 (en) 2016-03-03
CN105189827A (zh) 2015-12-23
WO2014184102A2 (en) 2014-11-20
EP2997180A2 (en) 2016-03-23
TW201504484A (zh) 2015-02-01
EP2803756A1 (en) 2014-11-19
TWI638914B (zh) 2018-10-21
KR20160007520A (ko) 2016-01-20
WO2014184102A3 (en) 2015-01-08

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