JP2013500378A - 表面処理剤組成物、その製造方法、印刷回路基板用銅箔及び軟性銅箔積層フィルム - Google Patents

表面処理剤組成物、その製造方法、印刷回路基板用銅箔及び軟性銅箔積層フィルム Download PDF

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Publication number
JP2013500378A
JP2013500378A JP2012522746A JP2012522746A JP2013500378A JP 2013500378 A JP2013500378 A JP 2013500378A JP 2012522746 A JP2012522746 A JP 2012522746A JP 2012522746 A JP2012522746 A JP 2012522746A JP 2013500378 A JP2013500378 A JP 2013500378A
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JP
Japan
Prior art keywords
agent composition
copper foil
silane compounds
surface treatment
silane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012522746A
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English (en)
Japanese (ja)
Inventor
ジョンホ リュウ
ヨンソク キム
ヒュンミン チョン
ジンヨン パク
ジョンチャン ウオン
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Korea Research Institute of Chemical Technology KRICT
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Korea Research Institute of Chemical Technology KRICT
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Application filed by Korea Research Institute of Chemical Technology KRICT filed Critical Korea Research Institute of Chemical Technology KRICT
Publication of JP2013500378A publication Critical patent/JP2013500378A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/02—Polysilicates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C09D183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/24—Organic non-macromolecular coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Paints Or Removers (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2012522746A 2009-07-29 2010-07-13 表面処理剤組成物、その製造方法、印刷回路基板用銅箔及び軟性銅箔積層フィルム Pending JP2013500378A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2009-0069324 2009-07-29
KR1020090069324A KR101298998B1 (ko) 2009-07-29 2009-07-29 표면 처리제 조성물, 이의 제조방법, 인쇄회로기판용 동박 및 연성동박적층필름
PCT/KR2010/004523 WO2011013922A2 (ko) 2009-07-29 2010-07-13 표면 처리제 조성물, 이의 제조방법, 인쇄회로기판용 동박 및 연성동박적층필름

Publications (1)

Publication Number Publication Date
JP2013500378A true JP2013500378A (ja) 2013-01-07

Family

ID=43529811

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012522746A Pending JP2013500378A (ja) 2009-07-29 2010-07-13 表面処理剤組成物、その製造方法、印刷回路基板用銅箔及び軟性銅箔積層フィルム

Country Status (3)

Country Link
JP (1) JP2013500378A (ko)
KR (1) KR101298998B1 (ko)
WO (1) WO2011013922A2 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017043845A (ja) * 2015-08-25 2017-03-02 住友金属鉱山株式会社 金属材料用表面処理剤、金属接合体および金属材料の接着方法
WO2019117088A1 (ja) * 2017-12-11 2019-06-20 日産化学株式会社 窒素含有環を含むシラン化合物を含むコーティング組成物

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102519127B1 (ko) 2021-10-13 2023-04-10 테라신소재 주식회사 기판 접착용 표면처리제 조성물 및 이를 이용하여　다층 구조의 적층판을 제조하는 방법
KR102575509B1 (ko) 2021-10-13 2023-09-07 테라신소재 주식회사 다층 구조의 동박 적층판의 제조방법
KR20240032214A (ko) 2022-08-31 2024-03-12 주식회사 상보 양면 연성동박적층필름의 제조방법

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54155229A (en) * 1978-05-01 1979-12-07 Gen Electric Silicone composition and application thereof
JPH03152275A (ja) * 1989-11-06 1991-06-28 Shin Etsu Chem Co Ltd ウール処理剤
JPH07302968A (ja) * 1994-04-28 1995-11-14 Ube Ind Ltd 基板上金属配線の被覆法
JPH09208826A (ja) * 1995-11-29 1997-08-12 Shin Etsu Chem Co Ltd シリコーン水性エマルジョン組成物
JP2001305330A (ja) * 2000-04-20 2001-10-31 Toray Ind Inc カラーフィルター及び液晶表示装置
JP2004133088A (ja) * 2002-10-09 2004-04-30 Toray Ind Inc 電子部品用感光性耐熱性樹脂組成物および電子部品用感光性耐熱性樹脂前駆体組成物
WO2010008213A2 (en) * 2008-07-18 2010-01-21 Iljin Copper Foil Co., Ltd. Silane based compound, method for preparing the same, and surface treating agent composition for copper foil including the silane based compound
WO2010008214A2 (en) * 2008-07-18 2010-01-21 Iljin Copper Foil Co., Ltd. Copper foil for printed circuit board, method of preparing the same, and flexible copper clad laminate using polyamic acid precursor and copper foil

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TW326423B (en) * 1993-08-06 1998-02-11 Gould Inc Metallic foil with adhesion promoting layer
JPH11256096A (ja) * 1998-03-12 1999-09-21 Nippon Parkerizing Co Ltd 金属材料用表面処理剤組成物および処理方法
KR100336108B1 (ko) * 1999-08-21 2002-05-08 최규복 다층 인쇄 회로용 내층 회로 기판 및 이의 표면처리 방법
US20030012927A1 (en) 2001-06-04 2003-01-16 Ube Industries, Ltd. Process for preparing metal-coated aromatic polyimide film
AU2003244145A1 (en) * 2003-06-27 2005-01-13 Nokia Corporation Camera lens-positioning device using shape memory alloy and camera using the device
KR100656247B1 (ko) * 2004-11-30 2006-12-11 한국화학연구원 실란계 커플링제를 이용한 폴리이미드 필름의표면개질방법, 그를 이용한 동박 적층 필름의 제조방법 및그로 제조된 2층 구조의 동박 적층필름
KR20070064933A (ko) * 2005-12-19 2007-06-22 삼성전자주식회사 직교 주파수 다중 접속 시스템에서 인접 셀 간섭신호 제거방법 및 장치

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54155229A (en) * 1978-05-01 1979-12-07 Gen Electric Silicone composition and application thereof
JPH03152275A (ja) * 1989-11-06 1991-06-28 Shin Etsu Chem Co Ltd ウール処理剤
JPH07302968A (ja) * 1994-04-28 1995-11-14 Ube Ind Ltd 基板上金属配線の被覆法
JPH09208826A (ja) * 1995-11-29 1997-08-12 Shin Etsu Chem Co Ltd シリコーン水性エマルジョン組成物
JP2001305330A (ja) * 2000-04-20 2001-10-31 Toray Ind Inc カラーフィルター及び液晶表示装置
JP2004133088A (ja) * 2002-10-09 2004-04-30 Toray Ind Inc 電子部品用感光性耐熱性樹脂組成物および電子部品用感光性耐熱性樹脂前駆体組成物
WO2010008213A2 (en) * 2008-07-18 2010-01-21 Iljin Copper Foil Co., Ltd. Silane based compound, method for preparing the same, and surface treating agent composition for copper foil including the silane based compound
WO2010008214A2 (en) * 2008-07-18 2010-01-21 Iljin Copper Foil Co., Ltd. Copper foil for printed circuit board, method of preparing the same, and flexible copper clad laminate using polyamic acid precursor and copper foil

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017043845A (ja) * 2015-08-25 2017-03-02 住友金属鉱山株式会社 金属材料用表面処理剤、金属接合体および金属材料の接着方法
WO2019117088A1 (ja) * 2017-12-11 2019-06-20 日産化学株式会社 窒素含有環を含むシラン化合物を含むコーティング組成物
JPWO2019117088A1 (ja) * 2017-12-11 2020-12-24 日産化学株式会社 窒素含有環を含むシラン化合物を含むコーティング組成物
JP7284462B2 (ja) 2017-12-11 2023-05-31 日産化学株式会社 窒素含有環を含むシラン化合物を含むコーティング組成物
US11820917B2 (en) 2017-12-11 2023-11-21 Nissan Chemical Corporation Coating composition containing silane compound having nitrogen-containing ring

Also Published As

Publication number Publication date
KR20110011877A (ko) 2011-02-09
WO2011013922A3 (ko) 2011-04-21
WO2011013922A2 (ko) 2011-02-03
WO2011013922A9 (ko) 2011-06-16
KR101298998B1 (ko) 2013-08-26

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