WO2011013922A3 - 표면 처리제 조성물, 이의 제조방법, 인쇄회로기판용 동박 및 연성동박적층필름 - Google Patents

표면 처리제 조성물, 이의 제조방법, 인쇄회로기판용 동박 및 연성동박적층필름 Download PDF

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Publication number
WO2011013922A3
WO2011013922A3 PCT/KR2010/004523 KR2010004523W WO2011013922A3 WO 2011013922 A3 WO2011013922 A3 WO 2011013922A3 KR 2010004523 W KR2010004523 W KR 2010004523W WO 2011013922 A3 WO2011013922 A3 WO 2011013922A3
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WO
WIPO (PCT)
Prior art keywords
agent composition
treating agent
surface treating
circuit board
printed circuit
Prior art date
Application number
PCT/KR2010/004523
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English (en)
French (fr)
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WO2011013922A2 (ko
WO2011013922A9 (ko
Inventor
류종호
김용석
정현민
박진영
원종찬
Original Assignee
일진소재산업(주)
한국화학연구원
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Priority to JP2012522746A priority Critical patent/JP2013500378A/ja
Publication of WO2011013922A2 publication Critical patent/WO2011013922A2/ko
Publication of WO2011013922A3 publication Critical patent/WO2011013922A3/ko
Publication of WO2011013922A9 publication Critical patent/WO2011013922A9/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/02—Polysilicates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C09D183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/24—Organic non-macromolecular coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Paints Or Removers (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

본 발명은 하기 화학식 1 내지 4로 표시되는 실란계 화합물로 이루어진 군에서 선택되는 하나 이상의 제1 실란계 화합물; 실란계 화합물과 다른 구조를 가지는 하나 이상의 실란계 화합물로 이루어진 군에서 선택되는 하나 이상의 제2 실란계 화합물; 상기 제1 실란계 화합물과 제2 실란계 화합물의 가수분해물; 및 수계 용매를 포함하는 표면 처리제 조성물을 개시한다:
PCT/KR2010/004523 2009-07-29 2010-07-13 표면 처리제 조성물, 이의 제조방법, 인쇄회로기판용 동박 및 연성동박적층필름 WO2011013922A2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012522746A JP2013500378A (ja) 2009-07-29 2010-07-13 表面処理剤組成物、その製造方法、印刷回路基板用銅箔及び軟性銅箔積層フィルム

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0069324 2009-07-29
KR1020090069324A KR101298998B1 (ko) 2009-07-29 2009-07-29 표면 처리제 조성물, 이의 제조방법, 인쇄회로기판용 동박 및 연성동박적층필름

Publications (3)

Publication Number Publication Date
WO2011013922A2 WO2011013922A2 (ko) 2011-02-03
WO2011013922A3 true WO2011013922A3 (ko) 2011-04-21
WO2011013922A9 WO2011013922A9 (ko) 2011-06-16

Family

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Application Number Title Priority Date Filing Date
PCT/KR2010/004523 WO2011013922A2 (ko) 2009-07-29 2010-07-13 표면 처리제 조성물, 이의 제조방법, 인쇄회로기판용 동박 및 연성동박적층필름

Country Status (3)

Country Link
JP (1) JP2013500378A (ko)
KR (1) KR101298998B1 (ko)
WO (1) WO2011013922A2 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6834247B2 (ja) * 2015-08-25 2021-02-24 住友金属鉱山株式会社 金属材料用表面処理剤、金属接合体および金属材料の接着方法
EP3725855A4 (en) * 2017-12-11 2021-08-25 Nissan Chemical Corporation COATING COMPOSITION WITH SILANE COMPOUND WITH NITROGEN RING
KR102575509B1 (ko) 2021-10-13 2023-09-07 테라신소재 주식회사 다층 구조의 동박 적층판의 제조방법
KR102519127B1 (ko) 2021-10-13 2023-04-10 테라신소재 주식회사 기판 접착용 표면처리제 조성물 및 이를 이용하여　다층 구조의 적층판을 제조하는 방법
KR20240032214A (ko) 2022-08-31 2024-03-12 주식회사 상보 양면 연성동박적층필름의 제조방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR950007619A (ko) * 1993-08-06 1995-03-21 마이클 에이.센타니 점착촉진층을 가진 금속포일
KR20060028648A (ko) * 2003-06-27 2006-03-30 노키아 코포레이션 형상 기억 합금을 이용한 카메라 렌즈의 위치 결정 장치 및이 위치 결정 장치를 이용한 카메라
KR20070064933A (ko) * 2005-12-19 2007-06-22 삼성전자주식회사 직교 주파수 다중 접속 시스템에서 인접 셀 간섭신호 제거방법 및 장치
KR20100009262A (ko) * 2008-07-18 2010-01-27 일진소재산업주식회사 실란계 화합물, 그 제조 방법 및 이를 포함하는 동박용표면처리제 조성물
KR20100009263A (ko) * 2008-07-18 2010-01-27 일진소재산업주식회사 인쇄회로기판용 동박, 그 제조 방법 및 폴리아믹산전구체와 동박을 사용한 연성동박적층필름

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4246038A (en) * 1978-05-01 1981-01-20 General Electric Company Silicone abrasion resistant coatings for plastics
JPH0723585B2 (ja) * 1989-11-06 1995-03-15 信越化学工業株式会社 ウール処理剤
JPH07302968A (ja) * 1994-04-28 1995-11-14 Ube Ind Ltd 基板上金属配線の被覆法
JP3410618B2 (ja) * 1995-11-29 2003-05-26 信越化学工業株式会社 シリコーン水性エマルジョン組成物
JPH11256096A (ja) * 1998-03-12 1999-09-21 Nippon Parkerizing Co Ltd 金属材料用表面処理剤組成物および処理方法
KR100336108B1 (ko) * 1999-08-21 2002-05-08 최규복 다층 인쇄 회로용 내층 회로 기판 및 이의 표면처리 방법
JP2001305330A (ja) * 2000-04-20 2001-10-31 Toray Ind Inc カラーフィルター及び液晶表示装置
US20030012927A1 (en) 2001-06-04 2003-01-16 Ube Industries, Ltd. Process for preparing metal-coated aromatic polyimide film
JP2004133088A (ja) * 2002-10-09 2004-04-30 Toray Ind Inc 電子部品用感光性耐熱性樹脂組成物および電子部品用感光性耐熱性樹脂前駆体組成物
KR100656247B1 (ko) * 2004-11-30 2006-12-11 한국화학연구원 실란계 커플링제를 이용한 폴리이미드 필름의표면개질방법, 그를 이용한 동박 적층 필름의 제조방법 및그로 제조된 2층 구조의 동박 적층필름

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR950007619A (ko) * 1993-08-06 1995-03-21 마이클 에이.센타니 점착촉진층을 가진 금속포일
KR20060028648A (ko) * 2003-06-27 2006-03-30 노키아 코포레이션 형상 기억 합금을 이용한 카메라 렌즈의 위치 결정 장치 및이 위치 결정 장치를 이용한 카메라
KR20070064933A (ko) * 2005-12-19 2007-06-22 삼성전자주식회사 직교 주파수 다중 접속 시스템에서 인접 셀 간섭신호 제거방법 및 장치
KR20100009262A (ko) * 2008-07-18 2010-01-27 일진소재산업주식회사 실란계 화합물, 그 제조 방법 및 이를 포함하는 동박용표면처리제 조성물
KR20100009263A (ko) * 2008-07-18 2010-01-27 일진소재산업주식회사 인쇄회로기판용 동박, 그 제조 방법 및 폴리아믹산전구체와 동박을 사용한 연성동박적층필름

Also Published As

Publication number Publication date
JP2013500378A (ja) 2013-01-07
KR20110011877A (ko) 2011-02-09
KR101298998B1 (ko) 2013-08-26
WO2011013922A2 (ko) 2011-02-03
WO2011013922A9 (ko) 2011-06-16

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