DE602007005183D1 - Prepreg sowie mit einer leitenden Schicht laminiertes Substrat für eine Leiterplatte - Google Patents

Prepreg sowie mit einer leitenden Schicht laminiertes Substrat für eine Leiterplatte

Info

Publication number
DE602007005183D1
DE602007005183D1 DE200760005183 DE602007005183T DE602007005183D1 DE 602007005183 D1 DE602007005183 D1 DE 602007005183D1 DE 200760005183 DE200760005183 DE 200760005183 DE 602007005183 T DE602007005183 T DE 602007005183T DE 602007005183 D1 DE602007005183 D1 DE 602007005183D1
Authority
DE
Germany
Prior art keywords
prepreg
circuit board
conductive layer
printed circuit
layer laminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE200760005183
Other languages
English (en)
Inventor
Toshihiro Ohta
Tomiho Yamada
Shigeru Asami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NOF Corp
TDK Corp
Original Assignee
NOF Corp
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NOF Corp, TDK Corp filed Critical NOF Corp
Publication of DE602007005183D1 publication Critical patent/DE602007005183D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/006—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to block copolymers containing at least one sequence of polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2351/00—Characterised by the use of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers
    • C08J2351/04—Characterised by the use of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers grafted on to rubbers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2926—Coated or impregnated inorganic fiber fabric
    • Y10T442/2992—Coated or impregnated glass fiber fabric

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
DE200760005183 2006-05-30 2007-05-30 Prepreg sowie mit einer leitenden Schicht laminiertes Substrat für eine Leiterplatte Active DE602007005183D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006150527A JP2007320088A (ja) 2006-05-30 2006-05-30 プリプレグ及びプリント配線板用金属張り基板

Publications (1)

Publication Number Publication Date
DE602007005183D1 true DE602007005183D1 (de) 2010-04-22

Family

ID=38328447

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200760005183 Active DE602007005183D1 (de) 2006-05-30 2007-05-30 Prepreg sowie mit einer leitenden Schicht laminiertes Substrat für eine Leiterplatte

Country Status (6)

Country Link
US (1) US7820274B2 (de)
EP (1) EP1862493B1 (de)
JP (1) JP2007320088A (de)
KR (1) KR100974007B1 (de)
CN (1) CN101081903B (de)
DE (1) DE602007005183D1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090108834A (ko) 2008-04-14 2009-10-19 삼성전기주식회사 절연시트, 동박적층판 및 인쇄회로기판의 제조방법과 이를이용한 인쇄회로기판
CN101583244B (zh) * 2008-05-13 2011-11-09 欣兴电子股份有限公司 线路板的制造方法
WO2009147633A1 (en) * 2008-06-03 2009-12-10 Sabic Innovative Plastics Ip B.V. Lightweight high stiffness composites having class a surface finish
JP2010034197A (ja) * 2008-07-28 2010-02-12 Fujitsu Ltd ビルドアップ基板
CN102124474A (zh) * 2008-09-30 2011-07-13 日油株式会社 Rf标签及其制造方法
JP5332803B2 (ja) * 2009-03-27 2013-11-06 日油株式会社 Ｒｆタグおよびその製造方法
CN102476489B (zh) * 2011-07-29 2014-07-23 深圳光启高等理工研究院 一种超材料非均匀介质基板及其制备方法
CN102307432B (zh) * 2011-08-31 2013-02-13 东莞生益电子有限公司 粘结片材料的加工应用工艺
CN104220236A (zh) * 2012-03-29 2014-12-17 株式会社可乐丽 热塑性液晶聚合物薄膜及其制造方法
KR101934059B1 (ko) * 2012-07-03 2018-12-31 에스케이케미칼 주식회사 열가소성 프리프레그 및 그 제조방법
US9526185B2 (en) * 2014-04-08 2016-12-20 Finisar Corporation Hybrid PCB with multi-unreinforced laminate
CN105722303B (zh) * 2014-12-04 2019-01-25 中山台光电子材料有限公司 多层印刷电路板
KR20180052646A (ko) * 2015-08-21 2018-05-18 코닝 인코포레이티드 플렉서블 기판 웹들 내의 피쳐들의 연속적 제조 방법들 및 이와 관련된 제품들
CN105873352B (zh) * 2015-11-06 2019-02-01 武汉光谷创元电子有限公司 高频通信用基板及其制造方法
CN108148335A (zh) * 2016-12-02 2018-06-12 臻鼎科技股份有限公司 树脂组合物及应用该树脂组合物的胶片及电路板
WO2022266637A1 (en) * 2021-06-15 2022-12-22 California Institute Of Technology Self-deployable antenna
CN117510938A (zh) * 2022-07-27 2024-02-06 华为技术有限公司 一种半固化片、基板、印刷电路板及相关制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2805181A (en) * 1953-09-03 1957-09-03 Union Carbide Corp Thermoplastic laminate
US3238077A (en) * 1961-01-18 1966-03-01 Exxon Research Engineering Co Process of bonding a polyolefin layer laminate which has been partially cured to a b-stage product
US3240662A (en) 1961-01-23 1966-03-15 Exxon Research Engineering Co Impregnated reinforcing element bonded to an oxide coating on a copper foil
JPH0923047A (ja) 1995-07-05 1997-01-21 Kuraray Co Ltd プリント配線板用積層板及びその製造方法
WO1997038564A1 (en) * 1996-04-09 1997-10-16 Arlon, Inc. Composite dielectric material
JPH10265592A (ja) 1997-03-25 1998-10-06 Shin Etsu Polymer Co Ltd プリント配線板用プリプレグの製造方法
JPH1160645A (ja) * 1997-08-27 1999-03-02 Tdk Corp 耐熱性低誘電性高分子材料ならびにそれを用いたフィルム、基板、電子部品および耐熱性樹脂成形品
JPH1187910A (ja) 1997-09-09 1999-03-30 Ibiden Co Ltd プリント配線板およびその製造方法
US6420476B1 (en) * 1998-04-16 2002-07-16 Tdk Corporation Composite dielectric material composition, and film, substrate, electronic part and molded article produced therefrom
JP2000001622A (ja) * 1998-04-16 2000-01-07 Tdk Corp 複合誘電体材料組成物と、これを用いたフィルム、基板、電子部品および成形品
JP2003268190A (ja) * 2002-03-18 2003-09-25 Nof Corp 低誘電性耐熱樹脂組成物、ならびにこれを用いた成形品およびプリント配線板用金属張り基板
WO2003092342A1 (en) * 2002-04-26 2003-11-06 E.I. Du Pont De Nemours And Company Low loss dielectric material for printed circuit boards and integrated circuit chip packaging
EP2314434A3 (de) * 2002-07-18 2013-08-21 Mitsubishi Rayon Co., Ltd. Zwischenprodukt für das FRP-Formen und Herstellungsverfahren dafür

Also Published As

Publication number Publication date
JP2007320088A (ja) 2007-12-13
KR100974007B1 (ko) 2010-08-05
CN101081903B (zh) 2012-11-21
KR20070115688A (ko) 2007-12-06
US20070281566A1 (en) 2007-12-06
CN101081903A (zh) 2007-12-05
US7820274B2 (en) 2010-10-26
EP1862493B1 (de) 2010-03-10
EP1862493A1 (de) 2007-12-05

Similar Documents

Publication Publication Date Title
DE602007005183D1 (de) Prepreg sowie mit einer leitenden Schicht laminiertes Substrat für eine Leiterplatte
FI20075572L (fi) Sulatettu komponenttinen monikerrospiirilevy ja sen valmistusmenetelmä
TW200737380A (en) Multilayer interconnection substrate, semiconductor device, and solder resist
ATE514320T1 (de) Mehrschichtiges keramiksubstrat, elektronische komponente und verfahren zur herstellung eines mehrschichtigen keramiksubstrats
EP2007931A4 (de) Polyimidsubstrat und verfahren zur herstellung einer leiterplatte damit
ATE557576T1 (de) Leiterplatine mit elektronischem bauelement
TW200802775A (en) An embedded electronic device and method for manufacturing an embedded electronic device
EP1945013A4 (de) Mehrschichtige leiterplatte und herstellungsverfahren dafür
WO2007050114A3 (en) A substantially continuous layer of embedded transient protection for printed circuit boards
EP2015623A4 (de) Leiterplatte mit hitzebeständigem substrat
EP2200413A4 (de) Mehrschichtige bestückte leiterplatte und verfahren zur herstellung einer mehrschichtigen bestückten leiterplatte
EP2209358A4 (de) Mehrschichtige bestückte leiterplatte und verfahren zur herstellung einer mehrschichtigen bestückten leiterplatte
WO2011159722A3 (en) Method of manufacturing conductive structures
EP2016810A4 (de) Leiterplatten mit gestapelten micros-durchkontaktierungen
EP2068605A4 (de) Leiterplatte
TW200744417A (en) Method for manufacturing stack via of HDI printed circuit board
EP2280594A4 (de) Leiterplatte und verfahren zu ihrer herstellung
HK1135556A1 (en) Printed wiring board and method for manufacturing the same
EP2141971A4 (de) Mehrschichtige leiterplatte und verfahren zu ihrer herstellung
DE602007009603D1 (de) Verfahren zur Herstellung einer mehrschichtigen Leiterplatte
TWI372590B (en) Single or multi-layer printed circuit board with improved edge via design
MY159854A (en) Resin coated copper foil and method for manufacturing resin coated copper foil
EP2284611A4 (de) Lichtempfindliche harzzusammensetzung, lichtempfindliches element, verfahren zur herstellung einer resist-struktur und verfahren zur herstellung einer bestückten leiterplatte
TWI350721B (en) Substrate for forming printed circuit, printed circuit board and method of forming metallic thin layer thereon
WO2010055429A3 (en) Methods for manufacturing printed panels and panel obtained herewith

Legal Events

Date Code Title Description
8364 No opposition during term of opposition