WO2007026174A3 - Method of printing - Google Patents

Method of printing Download PDF

Info

Publication number
WO2007026174A3
WO2007026174A3 PCT/GB2006/003269 GB2006003269W WO2007026174A3 WO 2007026174 A3 WO2007026174 A3 WO 2007026174A3 GB 2006003269 W GB2006003269 W GB 2006003269W WO 2007026174 A3 WO2007026174 A3 WO 2007026174A3
Authority
WO
WIPO (PCT)
Prior art keywords
layer
print pattern
printed
vectors
printing
Prior art date
Application number
PCT/GB2006/003269
Other languages
French (fr)
Other versions
WO2007026174A2 (en
Inventor
Paul Raymond Drury
Robert Harvey
Original Assignee
Xaar Technology Ltd
Paul Raymond Drury
Robert Harvey
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xaar Technology Ltd, Paul Raymond Drury, Robert Harvey filed Critical Xaar Technology Ltd
Publication of WO2007026174A2 publication Critical patent/WO2007026174A2/en
Publication of WO2007026174A3 publication Critical patent/WO2007026174A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Methods (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A method for printing multiple layer structures, such as printed circuit boards, or flexible substrates: a first print pattern is printed to form a first layer, which is subsequently imaged to measure the displacement vectors of fiducial marks in the first print pattern; the vectors are then applied to the second print pattern to ensure that the second layer is printed in registration with the first layer.
PCT/GB2006/003269 2005-09-02 2006-09-04 Method of printing WO2007026174A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0517929.6 2005-09-02
GB0517929A GB0517929D0 (en) 2005-09-02 2005-09-02 Method of printing

Publications (2)

Publication Number Publication Date
WO2007026174A2 WO2007026174A2 (en) 2007-03-08
WO2007026174A3 true WO2007026174A3 (en) 2007-05-10

Family

ID=35220785

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2006/003269 WO2007026174A2 (en) 2005-09-02 2006-09-04 Method of printing

Country Status (3)

Country Link
GB (1) GB0517929D0 (en)
TW (1) TW200718318A (en)
WO (1) WO2007026174A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7066747B2 (en) 2017-05-15 2022-05-13 アプライド マテリアルズ インコーポレイテッド Free shape distortion correction

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7623699B2 (en) 2004-04-19 2009-11-24 3M Innovative Properties Company Apparatus and method for the automated marking of defects on webs of material
GB0619548D0 (en) 2006-10-03 2006-11-15 Plastic Logic Ltd Distortion tolerant processing
US8175739B2 (en) 2007-07-26 2012-05-08 3M Innovative Properties Company Multi-unit process spatial synchronization
US7542821B2 (en) 2007-07-26 2009-06-02 3M Innovative Properties Company Multi-unit process spatial synchronization of image inspection systems
US7797133B2 (en) 2008-09-10 2010-09-14 3M Innovative Properties Company Multi-roller registered repeat defect detection of a web process line
TWI384912B (en) * 2010-12-13 2013-02-01 Au Optronics Corp Attachment structure of flexible circuit board and method of making the same
US11003164B2 (en) * 2019-08-30 2021-05-11 Micron Technology, Inc. Methods for aligning a physical layer to a pattern formed via multi-patterning, and associated systems

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002039793A2 (en) * 2000-11-08 2002-05-16 Orbotech Ltd. Multi-layer printed circuit board fabrication system and method
US20020118350A1 (en) * 2001-02-28 2002-08-29 Creo Ltd. Method and apparatus for registration control in production by imaging
WO2003094582A2 (en) * 2002-05-02 2003-11-13 Orbotech Ltd. A system and method for manufacturing printed circuit boards employing non-uniformly modified images
US20040118595A1 (en) * 2002-12-06 2004-06-24 Flammer Jeffrey D. Rigid-flex circuit board system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002039793A2 (en) * 2000-11-08 2002-05-16 Orbotech Ltd. Multi-layer printed circuit board fabrication system and method
US20020118350A1 (en) * 2001-02-28 2002-08-29 Creo Ltd. Method and apparatus for registration control in production by imaging
WO2003094582A2 (en) * 2002-05-02 2003-11-13 Orbotech Ltd. A system and method for manufacturing printed circuit boards employing non-uniformly modified images
US20040118595A1 (en) * 2002-12-06 2004-06-24 Flammer Jeffrey D. Rigid-flex circuit board system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7066747B2 (en) 2017-05-15 2022-05-13 アプライド マテリアルズ インコーポレイテッド Free shape distortion correction

Also Published As

Publication number Publication date
WO2007026174A2 (en) 2007-03-08
GB0517929D0 (en) 2005-10-12
TW200718318A (en) 2007-05-01

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