TW200746950A - Method for producing electronic component - Google Patents

Method for producing electronic component

Info

Publication number
TW200746950A
TW200746950A TW096111268A TW96111268A TW200746950A TW 200746950 A TW200746950 A TW 200746950A TW 096111268 A TW096111268 A TW 096111268A TW 96111268 A TW96111268 A TW 96111268A TW 200746950 A TW200746950 A TW 200746950A
Authority
TW
Taiwan
Prior art keywords
ink
electronic component
letterpress
blanket
producing electronic
Prior art date
Application number
TW096111268A
Other languages
Chinese (zh)
Other versions
TWI458407B (en
Inventor
Masanori Kasai
Hiroshi Isozumi
Original Assignee
Dainippon Ink & Chemicals
Mitsumura Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Ink & Chemicals, Mitsumura Printing Co Ltd filed Critical Dainippon Ink & Chemicals
Publication of TW200746950A publication Critical patent/TW200746950A/en
Application granted granted Critical
Publication of TWI458407B publication Critical patent/TWI458407B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259—Multistep manufacturing methods
    • H01L27/1292—Multistep manufacturing methods using liquid deposition, e.g. printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Thin Film Transistor (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Methods (AREA)

Abstract

A method for producing an electronic component of the present invention includes producing an electronic component using a printing method including an ink-coating step of coating ink on a blanket so as to form an ink-coated face, a pattern-forming step of pressing a letterpress on the ink-coated face so as to remove ink at a part contacted to the letterpress, and a transferring step of transferring ink remaining on the blanket to a material to be printed, wherein one or plural layers of patterns using at least one ink selected from the group consisting of a conductive ink, a dielectric ink and a semiconducting ink are formed.
TW096111268A 2006-03-31 2007-03-30 Method for producing electronic component TWI458407B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006097360A JP4828988B2 (en) 2006-03-31 2006-03-31 Manufacturing method of electronic parts

Publications (2)

Publication Number Publication Date
TW200746950A true TW200746950A (en) 2007-12-16
TWI458407B TWI458407B (en) 2014-10-21

Family

ID=38563609

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096111268A TWI458407B (en) 2006-03-31 2007-03-30 Method for producing electronic component

Country Status (4)

Country Link
JP (1) JP4828988B2 (en)
KR (1) KR101263058B1 (en)
TW (1) TWI458407B (en)
WO (1) WO2007114342A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103298268A (en) * 2012-02-28 2013-09-11 比亚迪股份有限公司 Method for preparing ceramic radiating base for LED packaging

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009105083A (en) * 2007-10-19 2009-05-14 Brother Ind Ltd Method of manufacturing thin film transistor, and thin film transistor manufactured by the manufacturing method
KR101319338B1 (en) * 2007-11-08 2013-10-16 엘지디스플레이 주식회사 Printing device and method for forming pattern using the same
EP2292707B1 (en) 2008-06-13 2017-03-08 DIC Corporation Ink composition for forming an insulating film and an insulating film formed from said ink composition
JP5617189B2 (en) * 2009-05-18 2014-11-05 Dic株式会社 Insulating film forming ink composition, insulating film formed from the ink composition, and electronic device having the insulating film
KR20140043249A (en) 2009-06-30 2014-04-09 디아이씨 가부시끼가이샤 Electronic part manufacturing method and electronic part manufactured by the method
KR101296663B1 (en) 2009-07-09 2013-08-14 엘지디스플레이 주식회사 Printing apparatus
JP5821313B2 (en) * 2011-06-20 2015-11-24 東レ株式会社 A printing ink composition for forming an insulating film, and an insulating film formed from the printing ink composition for forming an insulating film.
TW201417191A (en) * 2012-08-01 2014-05-01 Tokyo Electron Ltd Method for forming pattern for electronic device, electronic device, and pattern forming device
US20140248423A1 (en) * 2013-03-04 2014-09-04 Uni-Pixel Displays, Inc. Method of roll to roll printing of fine lines and features with an inverse patterning process
JP2015159277A (en) * 2014-01-23 2015-09-03 パナソニック株式会社 Manufacturing method of electronic device
WO2017110495A1 (en) * 2015-12-22 2017-06-29 Dic株式会社 Thin-film transistor manufacturing method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0353762A (en) * 1989-07-21 1991-03-07 Matsushita Graphic Commun Syst Inc Picture communication equipment
JPH11126974A (en) * 1997-10-24 1999-05-11 Asahi Chem Res Lab Ltd Manufacture of multilayered wiring board
JP4035968B2 (en) * 2000-06-30 2008-01-23 セイコーエプソン株式会社 Method for forming conductive film pattern
JP2003084118A (en) * 2001-09-12 2003-03-19 Fuji Photo Film Co Ltd Color filter
JP2004303729A (en) * 2003-03-19 2004-10-28 Sumitomo Osaka Cement Co Ltd Paint for forming fine particle integration film, fine particle integration film and its manufacturing method
JP2005353770A (en) * 2004-06-09 2005-12-22 Hitachi Chem Co Ltd Manufacturing method of printed wiring board
JP2006202793A (en) 2005-01-18 2006-08-03 Mitsui Chemicals Inc Process for producing printed board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103298268A (en) * 2012-02-28 2013-09-11 比亚迪股份有限公司 Method for preparing ceramic radiating base for LED packaging

Also Published As

Publication number Publication date
JP2007273712A (en) 2007-10-18
WO2007114342A1 (en) 2007-10-11
JP4828988B2 (en) 2011-11-30
KR101263058B1 (en) 2013-05-09
KR20090005068A (en) 2009-01-12
TWI458407B (en) 2014-10-21

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees