JP2013211441A - パッケージ、パッケージの製造方法、電子デバイスおよび電子機器 - Google Patents

パッケージ、パッケージの製造方法、電子デバイスおよび電子機器 Download PDF

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Publication number
JP2013211441A
JP2013211441A JP2012081254A JP2012081254A JP2013211441A JP 2013211441 A JP2013211441 A JP 2013211441A JP 2012081254 A JP2012081254 A JP 2012081254A JP 2012081254 A JP2012081254 A JP 2012081254A JP 2013211441 A JP2013211441 A JP 2013211441A
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Japan
Prior art keywords
metal film
base substrate
package
metal
lid
Prior art date
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Pending
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JP2012081254A
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English (en)
Japanese (ja)
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JP2013211441A5 (https=
Inventor
Tomoyuki Kamakura
知之 鎌倉
Masaya Ishida
方哉 石田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
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Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2012081254A priority Critical patent/JP2013211441A/ja
Publication of JP2013211441A publication Critical patent/JP2013211441A/ja
Publication of JP2013211441A5 publication Critical patent/JP2013211441A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2012081254A 2012-03-30 2012-03-30 パッケージ、パッケージの製造方法、電子デバイスおよび電子機器 Pending JP2013211441A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012081254A JP2013211441A (ja) 2012-03-30 2012-03-30 パッケージ、パッケージの製造方法、電子デバイスおよび電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012081254A JP2013211441A (ja) 2012-03-30 2012-03-30 パッケージ、パッケージの製造方法、電子デバイスおよび電子機器

Publications (2)

Publication Number Publication Date
JP2013211441A true JP2013211441A (ja) 2013-10-10
JP2013211441A5 JP2013211441A5 (https=) 2015-05-14

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ID=49529026

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JP2012081254A Pending JP2013211441A (ja) 2012-03-30 2012-03-30 パッケージ、パッケージの製造方法、電子デバイスおよび電子機器

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JP (1) JP2013211441A (https=)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180009615A (ko) * 2016-07-19 2018-01-29 주식회사 아모센스 세라믹 기판 제조 방법 및 이 제조방법으로 제조된 세라믹 기판
KR101856106B1 (ko) * 2015-04-24 2018-05-09 주식회사 아모센스 세라믹 기판 제조 방법 및 이 제조방법으로 제조된 세라믹 기판
KR101856107B1 (ko) * 2015-04-24 2018-05-09 주식회사 아모센스 세라믹 기판 제조 방법 및 이 제조방법으로 제조된 세라믹 기판
KR101856108B1 (ko) * 2015-04-24 2018-05-09 주식회사 아모센스 세라믹 기판 제조 방법 및 이 제조방법으로 제조된 세라믹 기판
KR101856109B1 (ko) * 2015-04-24 2018-05-09 주식회사 아모센스 세라믹 기판 제조 방법 및 이 제조방법으로 제조된 세라믹 기판
US10529646B2 (en) 2015-04-24 2020-01-07 Amosense Co., Ltd. Methods of manufacturing a ceramic substrate and ceramic substrates
US20240090133A1 (en) * 2022-09-08 2024-03-14 Murata Manufacturing Co., Ltd. Electronic component package and method for manufacturing electronic component package

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001028484A (ja) * 1999-07-15 2001-01-30 Daishinku Corp 電子部品用パッケージ
JP2003293143A (ja) * 2002-04-04 2003-10-15 Murata Mfg Co Ltd パラジウム触媒洗浄剤とパラジウム触媒の洗浄方法、及び該洗浄剤を使用した電子部品のめっき方法、並びに電子部品
JP2006032554A (ja) * 2004-07-14 2006-02-02 Japan Radio Co Ltd 電子部品の製造方法
JP2007318209A (ja) * 2006-05-23 2007-12-06 Daishinku Corp 表面実装型圧電振動デバイス、およびその製造方法
JP2009190080A (ja) * 2008-02-18 2009-08-27 Neomax Material:Kk 銅銀系ろう材および電子部品用パッケージの蓋用クラッド材
JP2010242117A (ja) * 2009-04-01 2010-10-28 Alps Electric Co Ltd 電気接点およびその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001028484A (ja) * 1999-07-15 2001-01-30 Daishinku Corp 電子部品用パッケージ
JP2003293143A (ja) * 2002-04-04 2003-10-15 Murata Mfg Co Ltd パラジウム触媒洗浄剤とパラジウム触媒の洗浄方法、及び該洗浄剤を使用した電子部品のめっき方法、並びに電子部品
JP2006032554A (ja) * 2004-07-14 2006-02-02 Japan Radio Co Ltd 電子部品の製造方法
JP2007318209A (ja) * 2006-05-23 2007-12-06 Daishinku Corp 表面実装型圧電振動デバイス、およびその製造方法
JP2009190080A (ja) * 2008-02-18 2009-08-27 Neomax Material:Kk 銅銀系ろう材および電子部品用パッケージの蓋用クラッド材
JP2010242117A (ja) * 2009-04-01 2010-10-28 Alps Electric Co Ltd 電気接点およびその製造方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101856106B1 (ko) * 2015-04-24 2018-05-09 주식회사 아모센스 세라믹 기판 제조 방법 및 이 제조방법으로 제조된 세라믹 기판
KR101856107B1 (ko) * 2015-04-24 2018-05-09 주식회사 아모센스 세라믹 기판 제조 방법 및 이 제조방법으로 제조된 세라믹 기판
KR101856108B1 (ko) * 2015-04-24 2018-05-09 주식회사 아모센스 세라믹 기판 제조 방법 및 이 제조방법으로 제조된 세라믹 기판
KR101856109B1 (ko) * 2015-04-24 2018-05-09 주식회사 아모센스 세라믹 기판 제조 방법 및 이 제조방법으로 제조된 세라믹 기판
US10529646B2 (en) 2015-04-24 2020-01-07 Amosense Co., Ltd. Methods of manufacturing a ceramic substrate and ceramic substrates
KR20180009615A (ko) * 2016-07-19 2018-01-29 주식회사 아모센스 세라믹 기판 제조 방법 및 이 제조방법으로 제조된 세라믹 기판
KR102563421B1 (ko) * 2016-07-19 2023-08-07 주식회사 아모센스 세라믹 기판 제조 방법
US20240090133A1 (en) * 2022-09-08 2024-03-14 Murata Manufacturing Co., Ltd. Electronic component package and method for manufacturing electronic component package
US12507346B2 (en) * 2022-09-08 2025-12-23 Murata Manufacturing Co., Ltd. Electronic component package and method for manufacturing electronic component package

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