JP2013084960A - はんだ接合のための溝付き板 - Google Patents
はんだ接合のための溝付き板 Download PDFInfo
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- JP2013084960A JP2013084960A JP2012225711A JP2012225711A JP2013084960A JP 2013084960 A JP2013084960 A JP 2013084960A JP 2012225711 A JP2012225711 A JP 2012225711A JP 2012225711 A JP2012225711 A JP 2012225711A JP 2013084960 A JP2013084960 A JP 2013084960A
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 44
- 229910052751 metal Inorganic materials 0.000 claims abstract description 212
- 239000002184 metal Substances 0.000 claims abstract description 212
- 230000002093 peripheral effect Effects 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims description 27
- 239000004020 conductor Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 abstract description 14
- 230000008569 process Effects 0.000 abstract description 12
- 238000012546 transfer Methods 0.000 abstract description 11
- 239000011800 void material Substances 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 20
- 238000005476 soldering Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 6
- 229910001092 metal group alloy Inorganic materials 0.000 description 5
- 229910000838 Al alloy Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
- -1 tin) Chemical class 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1178—Means for venting or for letting gases escape
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Structure Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
【解決手段】マルチダイLED放射体基板上の金属板または放射体基板に取り付けられた金属コアプリント基板(MCPCB)200上の金属板208(またはその両方の金属板)は、多数の放射状の溝210〜215を設けるものであり、その少なくとも一部は金属板208の周辺端部まで延在する。これらの溝210〜215は、はんだ接合プロセスにおいて空気を逃がすことができる流路を形成し、はんだボイドのサイズおよび/または総面積を縮小し、それにより、放射体とMCPCBとの間の熱伝達を改善する。
【選択図】図2
Description
101 LED放射体
102 金属コアプリント基板(MCPCB)
104 LEDダイ
106 放射体基板
107 底面
108 大きな円形金属板
109 表面
110、112、114 電気接点
115 一次レンズ
116、118、120 電気接点
122 金属板
124 溝
126 はんだ材料
200 MCPCB
202 表面
204 金属接点(またはパッド)
208 より大きな円形の金属板
210〜215 放射状の溝
300 はんだ接合部
302 はんだボイド
310 円
350 はんだ接合部
352 はんだボイド
360 円
400 MCPCB
402 大きな円形の金属板
404〜409 溝
500 MCPCB
502 大きな円形の金属板
504〜509 内側にある放射状溝
514〜519 外側にある放射状溝
600 MCPCB
602 大きな円形の金属板
604〜609 内側にある放射状溝
614〜619 外側にある放射状溝
700 MCPCB
702 大きな円形の金属板
704〜709 第1の一組の放射状溝
714〜719 第2の一組の放射状溝
800 MCPCB
802 大きな円形の金属板
804〜807 第1の一組の放射状溝
814〜819 第2の一組の放射状溝
900 MCPCB
902 大きな円形の金属板
904〜909 ほぼ放射状の溝
1000 MCPCB
1002 大きな円形の金属板
1004〜1009 湾曲した放射状溝
Claims (20)
- 発光デバイスを支持する放射体基板に接合するためのプリント基板であって、
第1の絶縁層と、
前記第1の絶縁層の表面上の金属板とを備え、
前記金属板はその中に複数の溝を有し、前記溝の少なくともいくつかは、前記金属板の中心から第1の距離のところに内端を、前記金属板の周辺端部のところに外端を有するプリント基板。 - 前記第1の絶縁層に平行であり、前記の絶縁層の下にある第2の絶縁層と、
前記第1の絶縁層の底面と前記第2の絶縁層の表面との間に配設された導電性材料の少なくとも1つのパターン層とをさらに備える請求項1に記載のプリント基板。 - 前記第1の絶縁層の前記表面上に配設された複数の金属コンタクト・パッドをさらに備え、
前記複数の金属コンタクト・パッドのうちの少なくとも1つは、前記パターン層の前記導電性材料に電気的に接続される請求項2に記載のプリント基板。 - 前記金属板は、円形である請求項1に記載のプリント基板。
- 前記第1の距離は、ゼロである請求項1に記載のプリント基板。
- 前記第1の距離は、ゼロより大きい請求項1に記載のプリント基板。
- 前記複数の溝は、金属板の前記中心のところに内端を、前記中心から第2の距離のところに外端を有する少なくとも1つの溝をさらに含み、前記第2の距離は、前記金属板の前記中心から前記金属板の前記周辺端部までの距離より小さい請求項1に記載のプリント基板。
- 前記第2の距離は、第1の距離に等しい請求項7に記載のプリント基板。
- 前記第2の距離は、第1の距離より小さい請求項7に記載のプリント基板。
- 前記複数の放射状溝のすべての各外端は、前記金属板の前記周辺端部のところにある請求項1に記載のプリント基板。
- 発光デバイス用の放射体であって、
複数の発光ダイオードを支持するように適合された表面および、底面を有する放射体基板と、
前記放射体基板の前記底面上に配設された金属板とを備え、
前記金属板はその中に複数の溝を有し、前記溝の少なくともいくつかは、前記金属板の中心から第1の距離のところに内端を、前記金属板の周辺端部のところに外端を有する放射体。 - 前記金属板は、円形である請求項11に記載の放射体。
- 前記第1の距離は、ゼロである請求項11に記載の放射体。
- 前記第1の距離は、ゼロより大きい請求項11に記載の放射体。
- 前記複数の溝は、金属板の前記中心のところに内端を、前記中心から第2の距離のところに外端を有する少なくとも1つの溝をさらに含み、前記第2の距離は、前記金属板の前記中心から前記金属板の前記周辺端部までの距離より小さい請求項11に記載の放射体。
- 発光デバイスであって、
第1の絶縁層および前記第1の絶縁層の表面上の第1の金属板を有するプリント基板と、
複数の発光ダイオードを保持する表面および第2の金属板をその上に有する底面を有する放射体基板と、
前記第1の金属板と前記第2の金属板との間に配設され、前記第1の金属板と前記第2の金属板とに接合されたはんだ層とを備え、
前記第1の金属板はその中に複数の溝を有し、前記溝の少なくともいくつかは、前記第1の金属板の中心から第1の距離のところに内端を、前記第1の金属板の周辺端部のところに外端を有する発光デバイス。 - 前記第1および第2の金属板は、円形である請求項16に記載の発光デバイス。
- 前記第1の距離は、ゼロである請求項16に記載の発光デバイス。
- 前記複数の溝は、金属板の前記中心のところに内端を、前記中心から第2の距離のところに外端を有する少なくとも1つの溝をさらに含み、前記第2の距離は、前記金属板の前記中心から前記金属板の前記周辺端部までの距離より小さい請求項16に記載の発光デバイス。
- 前記複数の放射状溝のすべての各外端は、前記金属板の前記周辺端部のところにある請求項16に記載の発光デバイス。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/270,646 | 2011-10-11 | ||
US13/270,646 US8587019B2 (en) | 2011-10-11 | 2011-10-11 | Grooved plate for improved solder bonding |
Publications (3)
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JP2013084960A true JP2013084960A (ja) | 2013-05-09 |
JP2013084960A5 JP2013084960A5 (ja) | 2015-11-26 |
JP6300439B2 JP6300439B2 (ja) | 2018-03-28 |
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JP2012225711A Active JP6300439B2 (ja) | 2011-10-11 | 2012-10-11 | はんだ接合のための溝付き板 |
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US (1) | US8587019B2 (ja) |
JP (1) | JP6300439B2 (ja) |
CN (1) | CN103079337B (ja) |
TW (1) | TWI568037B (ja) |
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JP2015201608A (ja) * | 2014-04-10 | 2015-11-12 | 大日本印刷株式会社 | 樹脂付リードフレームおよびその製造方法、ならびにledパッケージおよびその製造方法 |
WO2016152297A1 (ja) * | 2015-03-20 | 2016-09-29 | ウシオ電機株式会社 | 蛍光光源装置 |
WO2017073486A1 (ja) * | 2015-10-27 | 2017-05-04 | 京セラ株式会社 | 配線基板、電子装置および電子モジュール |
KR101809430B1 (ko) | 2015-03-31 | 2017-12-14 | 우시오덴키 가부시키가이샤 | 형광 광원 장치 |
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Citations (13)
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US20130087813A1 (en) | 2013-04-11 |
JP6300439B2 (ja) | 2018-03-28 |
US8587019B2 (en) | 2013-11-19 |
TW201332167A (zh) | 2013-08-01 |
TWI568037B (zh) | 2017-01-21 |
CN103079337A (zh) | 2013-05-01 |
CN103079337B (zh) | 2018-03-27 |
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