JP2013026625A - 半導体パッケージ及びその製造方法 - Google Patents

半導体パッケージ及びその製造方法 Download PDF

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Publication number
JP2013026625A
JP2013026625A JP2012159378A JP2012159378A JP2013026625A JP 2013026625 A JP2013026625 A JP 2013026625A JP 2012159378 A JP2012159378 A JP 2012159378A JP 2012159378 A JP2012159378 A JP 2012159378A JP 2013026625 A JP2013026625 A JP 2013026625A
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Japan
Prior art keywords
connection terminal
insulating film
chip
substrate
semiconductor
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Pending
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JP2012159378A
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English (en)
Japanese (ja)
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JP2013026625A5 (enExample
Inventor
Young Lyong Kim
泳龍 金
Tae-Hun Kim
泰勳 金
Chul Yong Jang
▲チュル▼容 張
Jong-Ho Lee
種昊 李
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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Priority claimed from KR1020120029739A external-priority patent/KR101936788B1/ko
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of JP2013026625A publication Critical patent/JP2013026625A/ja
Publication of JP2013026625A5 publication Critical patent/JP2013026625A5/ja
Pending legal-status Critical Current

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    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2012159378A 2011-07-18 2012-07-18 半導体パッケージ及びその製造方法 Pending JP2013026625A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20110071016 2011-07-18
KR10-2011-0071016 2011-07-18
KR1020120029739A KR101936788B1 (ko) 2011-07-18 2012-03-23 반도체 패키지 및 그 제조 방법
KR10-2012-0029739 2012-03-23

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JP2013026625A true JP2013026625A (ja) 2013-02-04
JP2013026625A5 JP2013026625A5 (enExample) 2015-06-18

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JP2012159378A Pending JP2013026625A (ja) 2011-07-18 2012-07-18 半導体パッケージ及びその製造方法

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US (2) US8970046B2 (enExample)
JP (1) JP2013026625A (enExample)
CN (1) CN102891136B (enExample)
DE (1) DE102012212611A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021241447A1 (enExample) * 2020-05-26 2021-12-02

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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