JP2013026625A5 - - Google Patents

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Publication number
JP2013026625A5
JP2013026625A5 JP2012159378A JP2012159378A JP2013026625A5 JP 2013026625 A5 JP2013026625 A5 JP 2013026625A5 JP 2012159378 A JP2012159378 A JP 2012159378A JP 2012159378 A JP2012159378 A JP 2012159378A JP 2013026625 A5 JP2013026625 A5 JP 2013026625A5
Authority
JP
Japan
Prior art keywords
connection terminal
substrate
insulating film
chip
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012159378A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013026625A (ja
Filing date
Publication date
Priority claimed from KR1020120029739A external-priority patent/KR101936788B1/ko
Application filed filed Critical
Publication of JP2013026625A publication Critical patent/JP2013026625A/ja
Publication of JP2013026625A5 publication Critical patent/JP2013026625A5/ja
Pending legal-status Critical Current

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JP2012159378A 2011-07-18 2012-07-18 半導体パッケージ及びその製造方法 Pending JP2013026625A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2011-0071016 2011-07-18
KR20110071016 2011-07-18
KR10-2012-0029739 2012-03-23
KR1020120029739A KR101936788B1 (ko) 2011-07-18 2012-03-23 반도체 패키지 및 그 제조 방법

Publications (2)

Publication Number Publication Date
JP2013026625A JP2013026625A (ja) 2013-02-04
JP2013026625A5 true JP2013026625A5 (enExample) 2015-06-18

Family

ID=47534598

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012159378A Pending JP2013026625A (ja) 2011-07-18 2012-07-18 半導体パッケージ及びその製造方法

Country Status (4)

Country Link
US (2) US8970046B2 (enExample)
JP (1) JP2013026625A (enExample)
CN (1) CN102891136B (enExample)
DE (1) DE102012212611A1 (enExample)

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CN104409448A (zh) * 2014-11-21 2015-03-11 三星半导体(中国)研究开发有限公司 半导体封装及其制造方法
JP6560496B2 (ja) * 2015-01-26 2019-08-14 株式会社ジェイデバイス 半導体装置
US10486548B2 (en) * 2016-01-13 2019-11-26 Ford Global Technologies, Llc Power inverter for a vehicle
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KR102432379B1 (ko) * 2017-10-16 2022-08-12 삼성전자주식회사 반도체 소자
US10879225B2 (en) * 2018-10-24 2020-12-29 Samsung Electronics Co., Ltd. Semiconductor package and method of manufacturing semiconductor package
US11024604B2 (en) * 2019-08-10 2021-06-01 Amkor Technology Singapore Holding Pte. Ltd. Semiconductor devices and methods of manufacturing semiconductor devices
US11171109B2 (en) 2019-09-23 2021-11-09 Micron Technology, Inc. Techniques for forming semiconductor device packages and related packages, intermediate products, and methods
WO2021102876A1 (en) * 2019-11-29 2021-06-03 Yangtze Memory Technologies Co., Ltd. Chip package structure and manufacturing method thereof
US11373956B2 (en) 2020-01-14 2022-06-28 Advanced Semiconductor Engineering, Inc. Semiconductor device package and method of manufacturing the same
CN115699295A (zh) * 2020-05-26 2023-02-03 罗姆股份有限公司 半导体装置以及半导体装置的制造方法
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US11942430B2 (en) * 2021-07-12 2024-03-26 Micron Technology, Inc. Stacked die modules for semiconductor device assemblies and methods of manufacturing stacked die modules
US20230035470A1 (en) * 2021-07-30 2023-02-02 Stmicroelectronics S.R.L. Method of coupling semiconductor dice and corresponding semiconductor device
US12500148B2 (en) 2021-07-30 2025-12-16 Stmicroelectronics S.R.L. Method of coupling semiconductor dice, tool for use therein and corresponding semiconductor device
CN114093822B (zh) * 2021-11-03 2025-10-31 长江存储科技有限责任公司 半导体封装结构及制备方法、待封装芯片的制备方法
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JP2011243790A (ja) * 2010-05-19 2011-12-01 Panasonic Electric Works Co Ltd 配線方法、並びに、表面に配線が設けられた構造物、半導体装置、配線基板、メモリカード、電気デバイス、モジュール及び多層回路基板

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