JP2012520375A5 - - Google Patents
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- Publication number
- JP2012520375A5 JP2012520375A5 JP2011554032A JP2011554032A JP2012520375A5 JP 2012520375 A5 JP2012520375 A5 JP 2012520375A5 JP 2011554032 A JP2011554032 A JP 2011554032A JP 2011554032 A JP2011554032 A JP 2011554032A JP 2012520375 A5 JP2012520375 A5 JP 2012520375A5
- Authority
- JP
- Japan
- Prior art keywords
- composition
- ethylhexyl
- bis
- heat source
- interface material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- CDWUGUNUUPYAFB-UHFFFAOYSA-N CC(C1)(C1(C)C(CNC)=O)C=[IH] Chemical compound CC(C1)(C1(C)C(CNC)=O)C=[IH] CDWUGUNUUPYAFB-UHFFFAOYSA-N 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15956909P | 2009-03-12 | 2009-03-12 | |
| US61/159,569 | 2009-03-12 | ||
| PCT/US2009/066204 WO2010104534A1 (en) | 2009-03-12 | 2009-12-01 | Thermal interface materials and mehtods for their preparation and use |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012520375A JP2012520375A (ja) | 2012-09-06 |
| JP2012520375A5 true JP2012520375A5 (https=) | 2012-10-18 |
| JP5640021B2 JP5640021B2 (ja) | 2014-12-10 |
Family
ID=41490482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011554032A Expired - Fee Related JP5640021B2 (ja) | 2009-03-12 | 2009-12-01 | 熱界面材料、並びに、その調製及び使用方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8440312B2 (https=) |
| EP (1) | EP2406321A1 (https=) |
| JP (1) | JP5640021B2 (https=) |
| KR (1) | KR20110133608A (https=) |
| CN (1) | CN102341459B (https=) |
| TW (1) | TW201035247A (https=) |
| WO (1) | WO2010104534A1 (https=) |
Families Citing this family (80)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101803009B (zh) * | 2007-09-11 | 2012-07-04 | 陶氏康宁公司 | 组合物，包括这种组合物的热界面材料,及其制备方法和用途 |
| EP2519782A1 (de) * | 2009-12-31 | 2012-11-07 | SGL Carbon SE | Decken- oder wandelement mit einem heiz- oder kühlregister |
| JP5534837B2 (ja) * | 2010-01-28 | 2014-07-02 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーンゴム組成物 |
| WO2011125753A1 (ja) | 2010-04-02 | 2011-10-13 | 株式会社カネカ | 硬化性樹脂組成物、硬化性樹脂組成物タブレット、成形体、半導体のパッケージ、半導体部品及び発光ダイオード |
| EP2582765B1 (de) * | 2010-06-21 | 2014-10-15 | Basf Se | 2-ethylhexyl-methyl-terephthalat als weichmacher in kleb- und dichtstoffen |
| US8791185B2 (en) * | 2010-06-21 | 2014-07-29 | Basf Se | 2-ethylhexyl methyl terephthalate as plasticizer in adhesives and sealants |
| KR20130128420A (ko) * | 2010-11-18 | 2013-11-26 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 폴리실라잔 결합층을 포함하는 발광 다이오드 성분 |
| KR101866299B1 (ko) | 2011-01-26 | 2018-06-12 | 다우 실리콘즈 코포레이션 | 고온 안정성 열 전도성 재료 |
| WO2012128875A1 (en) * | 2011-03-22 | 2012-09-27 | Dow Corning Corporation | Thermal management within an led assembly |
| US9012585B2 (en) | 2011-07-20 | 2015-04-21 | Dow Corning Corporation | Zinc containing complex and condensation reaction catalysts, methods for preparing the catalysts, and compositions containing the catalysts |
| US9228061B2 (en) | 2011-09-07 | 2016-01-05 | Dow Corning Corporation | Zirconium containing complex and condensation reaction catalysts, methods for preparing the catalysts, and compositions containing the catalysts |
| WO2013036546A2 (en) | 2011-09-07 | 2013-03-14 | Dow Corning Corporation | Titanium containing complex and condensation reaction catalysts, methods for preparing the catalysts, and compositions containing the catalysts |
| CN103814040B (zh) | 2011-09-20 | 2016-08-31 | 道康宁公司 | 含镍硅氢加成催化剂及含有该催化剂的组合物 |
| EP2758414B1 (en) | 2011-09-20 | 2018-11-21 | Dow Silicones Corporation | Ruthenium containing hydrosilylation catalysts and compositions containing the catalysts |
| CN103842368B (zh) | 2011-09-20 | 2017-02-22 | 道康宁公司 | 含铱硅氢加成催化剂及含有该催化剂的组合物 |
| WO2013052588A1 (en) | 2011-10-04 | 2013-04-11 | Dow Corning Corporation | Iron(ii) containing complex and condensation reaction catalysts, methods for preparing the catalysts, and compositions containing the catalysts |
| US9139699B2 (en) | 2012-10-04 | 2015-09-22 | Dow Corning Corporation | Metal containing condensation reaction catalysts, methods for preparing the catalysts, and compositions containing the catalysts |
| WO2013081794A1 (en) | 2011-12-01 | 2013-06-06 | Dow Corning Corporation | Hydrosilylation reaction catalysts and curable compositions and methods for their preparation and use |
| JP5998639B2 (ja) * | 2012-04-09 | 2016-09-28 | 信越化学工業株式会社 | 高電圧電気絶縁体ポリマー碍子用シリコーンゴム組成物及びポリマー碍子 |
| EP2865719A4 (en) * | 2012-06-22 | 2016-01-20 | Momentive Performance Mat Jp | TWO-PIECE HARDENABLE POLYORGANOSILOXANE COMPOSITION AND USE THEREOF |
| JP5308564B1 (ja) * | 2012-06-22 | 2013-10-09 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 二剤型の硬化性ポリオルガノシロキサン組成物及びその使用 |
| CN103568402A (zh) * | 2012-07-22 | 2014-02-12 | 上海利隆化工化纤有限公司 | 带玻纤导热硅胶片及其制备方法 |
| CN103087556B (zh) * | 2012-12-31 | 2014-11-12 | 东莞市万钧化工新材料科技有限公司 | 一种导热填料的表面处理方法及应用 |
| US9481781B2 (en) | 2013-05-02 | 2016-11-01 | Melior Innovations, Inc. | Black ceramic additives, pigments, and formulations |
| US11351652B2 (en) * | 2013-05-02 | 2022-06-07 | Melior Innovations, Inc. | Polysilocarb binders and coatings |
| US10738206B2 (en) | 2013-05-02 | 2020-08-11 | Melior Innovations, Inc. | Black ceramic additives, pigments, and formulations |
| CN103408937B (zh) * | 2013-07-30 | 2015-06-03 | 深圳德邦界面材料有限公司 | 一种粘性或非粘性的导热界面材料及其制备方法 |
| TW201527474A (zh) * | 2013-10-04 | 2015-07-16 | Momentive Performance Mat Jp | 硬化性聚有機矽氧烷組成物的硬化物、使用硬化性聚有機矽氧烷組成物的接著體、使用硬化性聚有機矽氧烷組成物之接著體的製造方法，以及其用途 |
| US9935246B2 (en) * | 2013-12-30 | 2018-04-03 | Cree, Inc. | Silazane-containing materials for light emitting diodes |
| US10787574B2 (en) | 2014-02-28 | 2020-09-29 | Melior Innovations, Inc. | Polymer derived ceramic effects particles, uses and methods of making |
| EP3114172A4 (en) * | 2014-03-06 | 2017-10-25 | Henkel AG & Co. KGaA | A single crystal alumina filled die attach paste |
| FR3029205B1 (fr) | 2014-11-27 | 2018-05-25 | Institut Vedecom | Encapsulation de composants electroniques dans des materiaux polymeres |
| US20160168037A1 (en) | 2014-12-10 | 2016-06-16 | Hyundai Motor Company | Thermal interface material and method for manufacturing thermal interface material |
| CN104497574A (zh) * | 2014-12-10 | 2015-04-08 | 深圳市博恩实业有限公司 | 多功能有机硅热界面材料 |
| JP6789220B2 (ja) * | 2014-12-24 | 2020-11-25 | モーメンティブ・パフォーマンス・マテリアルズ・インク | 熱伝導性プラスチック組成物、熱伝導性プラスチックを製造するための押出装置および方法 |
| EP3253835A1 (en) * | 2015-02-03 | 2017-12-13 | Dow Corning Corporation | Curable silicone formulations and related cured products, methods, articles, and devices |
| CN107636062B (zh) | 2015-06-18 | 2021-05-04 | 陶氏环球技术有限责任公司 | 导热弹性复合材料 |
| US10155896B2 (en) | 2015-06-30 | 2018-12-18 | Laird Technologies, Inc. | Thermal interface materials with low secant modulus of elasticity and high thermal conductivity |
| US10692797B2 (en) * | 2015-06-30 | 2020-06-23 | Laird Technologies, Inc. | Thermal interface materials with low secant modulus of elasticity and high thermal conductivity |
| US9828539B2 (en) | 2015-06-30 | 2017-11-28 | Laird Technologies, Inc. | Thermal interface materials with low secant modulus of elasticity and high thermal conductivity |
| US10781349B2 (en) | 2016-03-08 | 2020-09-22 | Honeywell International Inc. | Thermal interface material including crosslinker and multiple fillers |
| WO2017156312A1 (en) * | 2016-03-10 | 2017-09-14 | Melior Innovations, Inc. | Polysilocarb binders and coatings |
| US10190031B2 (en) * | 2016-06-06 | 2019-01-29 | Jiali Wu | Thermally conductive interface composition and use thereof |
| US20180030328A1 (en) * | 2016-07-26 | 2018-02-01 | Honeywell International Inc. | Gel-type thermal interface material |
| CN107699206A (zh) * | 2016-08-09 | 2018-02-16 | 天津莱尔德电子材料有限公司 | 热界面材料组件和可控地改变其表面粘性的系统和方法 |
| EP3281994A1 (en) | 2016-08-09 | 2018-02-14 | Tianjin Laird Technologies Limited | Thermal interface material assemblies and systems and methods for controllably changing surface tack of thermal interface materials |
| SG10201607550RA (en) * | 2016-09-09 | 2018-04-27 | 3M Innovative Properties Co | Thermal Interface Material |
| CN106747267B (zh) * | 2016-12-02 | 2019-01-08 | 航天特种材料及工艺技术研究所 | 一种碳纤维刚性隔热瓦及其制备方法 |
| JP6613462B2 (ja) * | 2017-06-27 | 2019-12-04 | 積水ポリマテック株式会社 | 熱伝導性シート |
| CN111051434B (zh) | 2017-07-24 | 2022-03-29 | 陶氏东丽株式会社 | 多成分硬化型导热性硅酮凝胶组合物、导热性部件及散热构造体 |
| CN111051433B (zh) * | 2017-07-24 | 2022-12-30 | 陶氏东丽株式会社 | 导热性硅酮凝胶组合物、导热性部件及散热构造体 |
| CN111094458B (zh) | 2017-07-24 | 2022-03-29 | 陶氏东丽株式会社 | 导热性硅酮凝胶组合物、导热性部件及散热构造体 |
| US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
| KR102191614B1 (ko) * | 2017-09-15 | 2020-12-15 | 주식회사 엘지화학 | 복합재 |
| KR102191615B1 (ko) * | 2017-09-22 | 2020-12-15 | 주식회사 엘지화학 | 복합재 |
| EP3688111A4 (en) * | 2017-09-29 | 2021-07-28 | Dow Silicones Corporation | THERMAL CONDUCTIVE COMPOSITION |
| US10428256B2 (en) * | 2017-10-23 | 2019-10-01 | Honeywell International Inc. | Releasable thermal gel |
| WO2019084329A2 (en) | 2017-10-25 | 2019-05-02 | Melior Innovations, Inc. | PLASTIC ADDITIVES AND SIOC CERAMIC FOR CEMENTS, CONCRETES AND STRUCTURAL DECORATIVE MATERIALS |
| KR102236924B1 (ko) * | 2017-12-04 | 2021-04-07 | 주식회사 엘지화학 | 가소제 조성물 및 이를 포함하는 수지 조성물 |
| US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
| WO2020000228A1 (en) * | 2018-06-27 | 2020-01-02 | Dow Silicones Corporation | Thermal gap filler and its application for battery management system |
| US10923412B2 (en) | 2018-08-10 | 2021-02-16 | Cerebras Systems Inc. | Apparatuses and methods for implementing a sliding thermal interface between substrates with varying coefficients of thermal expansion |
| CN112805336A (zh) * | 2018-10-15 | 2021-05-14 | 电化株式会社 | 二液固化型组合物的组合、热传导性固化物及电子仪器 |
| US20210403716A1 (en) * | 2018-12-29 | 2021-12-30 | Dow Global Technologies Llc | Thermally conductive composition containing mgo filler and methods and devices in which said composition is used |
| KR102173228B1 (ko) * | 2019-01-04 | 2020-11-03 | 한국과학기술원 | 연성 평판 진동형 히트파이프 및 이의 제작 방법 |
| JP7777985B2 (ja) * | 2019-02-27 | 2025-12-01 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン | サーマルインターフェース材料 |
| US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
| TWI745704B (zh) * | 2019-06-21 | 2021-11-11 | 國立陽明交通大學 | 氧化鎳晶片、其製備方法及用途 |
| CN112980196A (zh) * | 2019-12-18 | 2021-06-18 | 富士高分子工业株式会社 | 导热性组合物、导热性片材及其制造方法 |
| US20230066746A1 (en) * | 2020-03-13 | 2023-03-02 | Ddp Specialty Electronic Materials Us, Llc | Thermal interface material comprising magnesium hydroxide |
| CN111423841A (zh) * | 2020-04-07 | 2020-07-17 | 深圳日高胶带新材料有限公司 | 一种有机硅高导热阻燃压敏胶及其制备方法 |
| CN115698222A (zh) * | 2020-06-05 | 2023-02-03 | 电化株式会社 | 二液固化型导热性润滑脂用组合物、导热性润滑脂及电子设备 |
| CN116368195B (zh) | 2020-09-23 | 2026-03-10 | 陶氏环球技术有限责任公司 | 具有低分配粘度、分配后具有低竖向流动且固化后具有低热阻抗的热界面材料 |
| US20240301264A1 (en) | 2020-12-17 | 2024-09-12 | Zephyros, Inc. | Thermally Conductive Electrically Resistive Low Density Adhesive |
| CN113115557B (zh) * | 2021-02-05 | 2022-07-26 | 中山市鼎兴有机硅科技有限公司 | 一种内嵌导热组的散热硅胶片 |
| US11733154B2 (en) | 2021-08-16 | 2023-08-22 | International Business Machines Corporation | Thermal interface material detection through compression |
| US12200910B2 (en) * | 2022-01-14 | 2025-01-14 | Raytheon Company | Clamped pyrolytic graphite sheets for heat spreading |
| TW202417563A (zh) * | 2022-10-18 | 2024-05-01 | 美商陶氏有機矽公司 | 基於矽烷改質聚合物之導熱組成物 |
| CN116102890B (zh) * | 2023-02-09 | 2024-08-13 | 广州回天新材料有限公司 | 一种有机硅橡胶组合物及其制备方法 |
| WO2025250722A1 (en) * | 2024-05-30 | 2025-12-04 | Saint-Gobain Performance Plastics Corporation | Composite material, composite material layer, and thermal interface material with thermal conductivity properties |
Family Cites Families (64)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3205283A (en) | 1965-09-07 | Solventless liquid organopolysiloxane encapsulating compositions | ||
| US2676182A (en) | 1950-09-13 | 1954-04-20 | Dow Corning | Copolymeric siloxanes and methods of preparing them |
| US2938007A (en) * | 1957-06-17 | 1960-05-24 | Gen Electric | Compositions comprising an organopolysiloxane, silica and a dicarboxylic acid ester plasticizer and the heat cured product thereof |
| US3296291A (en) | 1962-07-02 | 1967-01-03 | Gen Electric | Reaction of silanes with unsaturated olefinic compounds |
| US3220972A (en) | 1962-07-02 | 1965-11-30 | Gen Electric | Organosilicon process using a chloroplatinic acid reaction product as the catalyst |
| US3159601A (en) | 1962-07-02 | 1964-12-01 | Gen Electric | Platinum-olefin complex catalyzed addition of hydrogen- and alkenyl-substituted siloxanes |
| NL131800C (https=) | 1965-05-17 | |||
| NL129346C (https=) | 1966-06-23 | |||
| US3516946A (en) | 1967-09-29 | 1970-06-23 | Gen Electric | Platinum catalyst composition for hydrosilation reactions |
| US3814730A (en) | 1970-08-06 | 1974-06-04 | Gen Electric | Platinum complexes of unsaturated siloxanes and platinum containing organopolysiloxanes |
| US3989667A (en) | 1974-12-02 | 1976-11-02 | Dow Corning Corporation | Olefinic siloxanes as platinum inhibitors |
| US3989668A (en) | 1975-07-14 | 1976-11-02 | Dow Corning Corporation | Method of making a silicone elastomer and the elastomer prepared thereby |
| US4087585A (en) | 1977-05-23 | 1978-05-02 | Dow Corning Corporation | Self-adhering silicone compositions and preparations thereof |
| US4370358A (en) | 1980-09-22 | 1983-01-25 | General Electric Company | Ultraviolet curable silicone adhesives |
| US4544696A (en) * | 1984-10-29 | 1985-10-01 | Sws Silicones Corporation | Silicone elastomers having thermally conductive properties |
| US4584355A (en) | 1984-10-29 | 1986-04-22 | Dow Corning Corporation | Silicone pressure-sensitive adhesive process and product with improved lap-shear stability-I |
| US4585836A (en) | 1984-10-29 | 1986-04-29 | Dow Corning Corporation | Silicone pressure-sensitive adhesive process and product with improved lap-shear stability-II |
| US4591622A (en) | 1984-10-29 | 1986-05-27 | Dow Corning Corporation | Silicone pressure-sensitive adhesive process and product thereof |
| JPS61195129A (ja) | 1985-02-22 | 1986-08-29 | Toray Silicone Co Ltd | 有機けい素重合体の製造方法 |
| US4584361A (en) | 1985-06-03 | 1986-04-22 | Dow Corning Corporation | Storage stable, one part polyorganosiloxane compositions |
| US4766176A (en) | 1987-07-20 | 1988-08-23 | Dow Corning Corporation | Storage stable heat curable organosiloxane compositions containing microencapsulated platinum-containing catalysts |
| US4774281A (en) | 1987-09-04 | 1988-09-27 | Dow Corning Corporation | Low compression set silicone rubber |
| JPH0214244A (ja) | 1988-06-30 | 1990-01-18 | Toray Dow Corning Silicone Co Ltd | 加熱硬化性オルガノポリシロキサン組成物 |
| US5036117A (en) | 1989-11-03 | 1991-07-30 | Dow Corning Corporation | Heat-curable silicone compositions having improved bath life |
| JP3029680B2 (ja) | 1991-01-29 | 2000-04-04 | 東レ・ダウコーニング・シリコーン株式会社 | オルガノペンタシロキサンおよびその製造方法 |
| JP2511348B2 (ja) | 1991-10-17 | 1996-06-26 | 東レ・ダウコーニング・シリコーン株式会社 | オルガノポリシロキサンおよびその製造方法 |
| US6197859B1 (en) | 1993-06-14 | 2001-03-06 | The Bergquist Company | Thermally conductive interface pads for electronic devices |
| JPH10130504A (ja) * | 1996-10-29 | 1998-05-19 | Toray Dow Corning Silicone Co Ltd | シリコーンゴム組成物 |
| JP3413718B2 (ja) * | 1997-05-21 | 2003-06-09 | 信越化学工業株式会社 | シリコーンゴム組成物の製造方法 |
| US6020387A (en) | 1997-09-22 | 2000-02-01 | Caschem, Inc. | Low density polymers and methods of making and using same |
| JP3444199B2 (ja) | 1998-06-17 | 2003-09-08 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム組成物及びその製造方法 |
| DE19832687B4 (de) | 1998-07-21 | 2007-04-26 | Compact Technology Gmbh | Bausatz zur Herstellung von schnellhärtenden, acetoxysilanvernetzenden Silikonmassen, Verfahren zu seiner Herstellung und seine Verwendung |
| DE19832688A1 (de) | 1998-07-21 | 2000-02-03 | Heidelberger Bauchemie Gmbh | Schnellhärtende Silikonmassen mit guten Hafteigenschaften |
| WO2000005652A1 (en) | 1998-07-24 | 2000-02-03 | Sun Microsystems, Inc. | Method and apparatus for achieving deterministic memory allocation response in a computer system |
| US6399209B1 (en) | 1999-04-16 | 2002-06-04 | The Bergquist Company | Integrated release films for phase-change interfaces |
| KR100540583B1 (ko) | 1999-07-12 | 2006-01-10 | 제일모직주식회사 | 난연성 열가소성 수지조성물 |
| WO2001004194A1 (en) | 1999-07-14 | 2001-01-18 | Fibre Optic Lamp Company Limited | Method of, and material for, improving thermal conductivity |
| FR2809406B1 (fr) | 2000-05-29 | 2006-02-17 | Von Roll Isola France S A | Materiaux composites flexibles, isolants et thermiquement stables constitues d'un support impregne d'une resine acrylique |
| JP3580358B2 (ja) | 2000-06-23 | 2004-10-20 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及び半導体装置 |
| US6573328B2 (en) | 2001-01-03 | 2003-06-03 | Loctite Corporation | Low temperature, fast curing silicone compositions |
| WO2003013199A2 (en) | 2001-07-27 | 2003-02-13 | Eikos, Inc. | Conformal coatings comprising carbon nanotubes |
| US20050127329A1 (en) | 2001-08-17 | 2005-06-16 | Chyi-Shan Wang | Method of forming nanocomposite materials |
| FR2836922B1 (fr) | 2002-03-08 | 2004-05-21 | Commissariat Energie Atomique | Compositions de poly(ethynylene phenylene ethynylene silylenes) |
| US7375158B2 (en) * | 2002-05-31 | 2008-05-20 | Dow Corning Toray Silicone Company, Ltd. | Thermoconductive curable liquid polymer composition and semiconductor device produced with the use of this composition |
| US7147367B2 (en) * | 2002-06-11 | 2006-12-12 | Saint-Gobain Performance Plastics Corporation | Thermal interface material with low melting alloy |
| US6791839B2 (en) | 2002-06-25 | 2004-09-14 | Dow Corning Corporation | Thermal interface materials and methods for their preparation and use |
| JP5165892B2 (ja) * | 2003-10-03 | 2013-03-21 | ヘンペル エイ／エス | 少なくとも２つのタイプの官能性ポリシロキサン化合物を含有するタイコート組成物及び支持体上に塗膜を形成させるための該組成物の使用方法 |
| US7452956B2 (en) | 2003-10-10 | 2008-11-18 | Dow Corning Corporation | Urethane compositions containing carbinol-functional silicone resins |
| JP4557136B2 (ja) * | 2004-05-13 | 2010-10-06 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム組成物及び成型品 |
| WO2005121267A1 (en) | 2004-06-11 | 2005-12-22 | Lg Chem. Ltd. | Adhesive sheet comprising hollow parts and method for preparing the same |
| EP1769033A1 (en) | 2004-06-30 | 2007-04-04 | Dow Corning Corporation | Fluorocarbon elastomer silicone vulcanizates |
| DE102004041379A1 (de) | 2004-08-26 | 2006-03-02 | Wacker-Chemie Gmbh | Vernetzbare Siloxan-Harnstoff-Copolymere |
| EP1866376B1 (en) * | 2005-04-06 | 2015-05-20 | Dow Corning Corporation | Organosiloxane compositions |
| JP5154010B2 (ja) * | 2005-10-27 | 2013-02-27 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 熱伝導性シリコーンゴム組成物 |
| DE102005057460A1 (de) | 2005-12-01 | 2007-06-06 | Wacker Chemie Ag | Zu hochfesten Elastomeren vernetzbare ionisch und/oder organometallisch funktionalisierte Siliconpolymere |
| DE102005061248B4 (de) | 2005-12-20 | 2007-09-20 | Infineon Technologies Ag | Systemträger mit in Kunststoffmasse einzubettenden Oberflächen, Verfahren zur Herstellung eines Systemträgers und Verwendung einer Schicht als Haftvermittlerschicht |
| JP4993611B2 (ja) * | 2006-01-26 | 2012-08-08 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 放熱材及びそれを用いた半導体装置 |
| US20070228331A1 (en) | 2006-03-28 | 2007-10-04 | Haitko Deborah A | Q silicone-containing composition, optoelectronic encapsulant thereof and device thereof |
| US20080001140A1 (en) | 2006-06-28 | 2008-01-03 | Gelcore Llc | Optoelectronic device |
| US20080160317A1 (en) | 2006-12-29 | 2008-07-03 | Deborah Ann Haitko | Optoelectronic device |
| WO2008103219A1 (en) | 2007-02-20 | 2008-08-28 | Dow Corning Coration | Filler treating agents based on hydrogen bonding polyorganosiloxanes |
| JP2008239719A (ja) * | 2007-03-26 | 2008-10-09 | Dow Corning Toray Co Ltd | シリコーンエラストマー組成物およびシリコーンエラストマー |
| JP5233325B2 (ja) * | 2008-02-29 | 2013-07-10 | 信越化学工業株式会社 | 熱伝導性硬化物及びその製造方法 |
| WO2010010841A1 (ja) * | 2008-07-22 | 2010-01-28 | 電気化学工業株式会社 | 樹脂組成物 |
-
2009
- 2009-12-01 CN CN200980157904.2A patent/CN102341459B/zh not_active Expired - Fee Related
- 2009-12-01 JP JP2011554032A patent/JP5640021B2/ja not_active Expired - Fee Related
- 2009-12-01 EP EP09768271A patent/EP2406321A1/en not_active Withdrawn
- 2009-12-01 KR KR1020117023991A patent/KR20110133608A/ko not_active Withdrawn
- 2009-12-01 US US13/144,096 patent/US8440312B2/en not_active Expired - Fee Related
- 2009-12-01 WO PCT/US2009/066204 patent/WO2010104534A1/en not_active Ceased
- 2009-12-11 TW TW98142597A patent/TW201035247A/zh unknown
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