TWI354005B - - Google Patents

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Publication number
TWI354005B
TWI354005B TW094101892A TW94101892A TWI354005B TW I354005 B TWI354005 B TW I354005B TW 094101892 A TW094101892 A TW 094101892A TW 94101892 A TW94101892 A TW 94101892A TW I354005 B TWI354005 B TW I354005B
Authority
TW
Taiwan
Prior art keywords
heat
component
dissipating
group
composition
Prior art date
Application number
TW094101892A
Other languages
English (en)
Chinese (zh)
Other versions
TW200536896A (en
Inventor
Masaya Asaine
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200536896A publication Critical patent/TW200536896A/zh
Application granted granted Critical
Publication of TWI354005B publication Critical patent/TWI354005B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW094101892A 2004-01-23 2005-01-21 Composition for heat conductive siloxanes heat release and its using method TW200536896A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004016155A JP4154605B2 (ja) 2004-01-23 2004-01-23 熱伝導性シリコーン放熱用組成物及び放熱構造の製造方法

Publications (2)

Publication Number Publication Date
TW200536896A TW200536896A (en) 2005-11-16
TWI354005B true TWI354005B (https=) 2011-12-11

Family

ID=34879026

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094101892A TW200536896A (en) 2004-01-23 2005-01-21 Composition for heat conductive siloxanes heat release and its using method

Country Status (4)

Country Link
JP (1) JP4154605B2 (https=)
KR (1) KR101127285B1 (https=)
CN (1) CN100565854C (https=)
TW (1) TW200536896A (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4803365B2 (ja) * 2006-02-22 2011-10-26 信越化学工業株式会社 熱伝導性シリコーン組成物、熱伝導性シリコーン成形体及びその製造方法
JP5283346B2 (ja) 2007-04-10 2013-09-04 信越化学工業株式会社 熱伝導性硬化物及びその製造方法
JP5233325B2 (ja) 2008-02-29 2013-07-10 信越化学工業株式会社 熱伝導性硬化物及びその製造方法
JP5093488B2 (ja) * 2008-04-15 2012-12-12 信越化学工業株式会社 熱伝導性シリコーン組成物及び接着構造体並びに半導体装置
JP5499774B2 (ja) * 2009-03-04 2014-05-21 信越化学工業株式会社 光半導体封止用組成物及びそれを用いた光半導体装置
JP5740864B2 (ja) * 2010-08-03 2015-07-01 日立化成株式会社 熱伝導シート、熱伝導シートの製造方法、及び熱伝導シートを用いた放熱装置
WO2019216190A1 (ja) * 2018-05-08 2019-11-14 富士高分子工業株式会社 熱伝導性シート、これを用いた実装方法及びこれを用いた接合方法
US20240250333A1 (en) * 2021-03-31 2024-07-25 Sekisui Polymatech Co., Ltd. Heat-conductive composition, heat-conductive member, and battery module

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4374967A (en) * 1981-07-06 1983-02-22 Dow Corning Corporation Low temperature silicone gel
DE4328657A1 (de) * 1993-08-26 1995-03-02 Bayer Ag Organopolysiloxanmischung zur Herstellung von klebstoffabweisenden Organopolysiloxanfilmen
JP2819444B2 (ja) * 1993-11-08 1998-10-30 東レ・ダウコーニング・シリコーン株式会社 導電性シリコーンゴム組成物
JP2001214063A (ja) * 2000-01-31 2001-08-07 Dow Corning Toray Silicone Co Ltd シリコーンゲル組成物およびシリコーンゲル
JP3580366B2 (ja) * 2001-05-01 2004-10-20 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
JP2002363412A (ja) * 2001-06-11 2002-12-18 Three Bond Co Ltd 熱伝導性組成物
JP3803058B2 (ja) * 2001-12-11 2006-08-02 信越化学工業株式会社 熱伝導性シリコーン組成物、その硬化物及び敷設方法並びにそれを用いた半導体装置の放熱構造体

Also Published As

Publication number Publication date
TW200536896A (en) 2005-11-16
KR101127285B1 (ko) 2012-03-30
KR20050076763A (ko) 2005-07-27
CN1649134A (zh) 2005-08-03
JP4154605B2 (ja) 2008-09-24
JP2005206733A (ja) 2005-08-04
CN100565854C (zh) 2009-12-02

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Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees