JP2014517440A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2014517440A5 JP2014517440A5 JP2014501076A JP2014501076A JP2014517440A5 JP 2014517440 A5 JP2014517440 A5 JP 2014517440A5 JP 2014501076 A JP2014501076 A JP 2014501076A JP 2014501076 A JP2014501076 A JP 2014501076A JP 2014517440 A5 JP2014517440 A5 JP 2014517440A5
- Authority
- JP
- Japan
- Prior art keywords
- ethylhexyl
- thermal management
- bis
- component
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims 13
- 239000000203 mixture Substances 0.000 claims 10
- NXQMCAOPTPLPRL-UHFFFAOYSA-N 2-(2-benzoyloxyethoxy)ethyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCCOCCOC(=O)C1=CC=CC=C1 NXQMCAOPTPLPRL-UHFFFAOYSA-N 0.000 claims 4
- RWPICVVBGZBXNA-UHFFFAOYSA-N bis(2-ethylhexyl) benzene-1,4-dicarboxylate Chemical compound CCCCC(CC)COC(=O)C1=CC=C(C(=O)OCC(CC)CCCC)C=C1 RWPICVVBGZBXNA-UHFFFAOYSA-N 0.000 claims 3
- 239000003054 catalyst Substances 0.000 claims 3
- 125000000962 organic group Chemical group 0.000 claims 3
- PRWJPWSKLXYEPD-UHFFFAOYSA-N 4-[4,4-bis(5-tert-butyl-4-hydroxy-2-methylphenyl)butan-2-yl]-2-tert-butyl-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(C)CC(C=1C(=CC(O)=C(C=1)C(C)(C)C)C)C1=CC(C(C)(C)C)=C(O)C=C1C PRWJPWSKLXYEPD-UHFFFAOYSA-N 0.000 claims 2
- RWPICVVBGZBXNA-BGYRXZFFSA-N Bis(2-ethylhexyl) terephthalate Natural products CCCC[C@H](CC)COC(=O)C1=CC=C(C(=O)OC[C@H](CC)CCCC)C=C1 RWPICVVBGZBXNA-BGYRXZFFSA-N 0.000 claims 2
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 claims 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims 2
- SAOKZLXYCUGLFA-UHFFFAOYSA-N bis(2-ethylhexyl) adipate Chemical compound CCCCC(CC)COC(=O)CCCCC(=O)OCC(CC)CCCC SAOKZLXYCUGLFA-UHFFFAOYSA-N 0.000 claims 2
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 claims 2
- MTYUOIVEVPTXFX-UHFFFAOYSA-N bis(2-propylheptyl) benzene-1,2-dicarboxylate Chemical compound CCCCCC(CCC)COC(=O)C1=CC=CC=C1C(=O)OCC(CCC)CCCCC MTYUOIVEVPTXFX-UHFFFAOYSA-N 0.000 claims 2
- 239000007809 chemical reaction catalyst Substances 0.000 claims 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 claims 2
- 239000000945 filler Substances 0.000 claims 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 2
- 238000006459 hydrosilylation reaction Methods 0.000 claims 2
- JNXDCMUUZNIWPQ-UHFFFAOYSA-N trioctyl benzene-1,2,4-tricarboxylate Chemical compound CCCCCCCCOC(=O)C1=CC=C(C(=O)OCCCCCCCC)C(C(=O)OCCCCCCCC)=C1 JNXDCMUUZNIWPQ-UHFFFAOYSA-N 0.000 claims 2
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 claims 1
- GPZYYYGYCRFPBU-UHFFFAOYSA-N 6-Hydroxyflavone Chemical compound C=1C(=O)C2=CC(O)=CC=C2OC=1C1=CC=CC=C1 GPZYYYGYCRFPBU-UHFFFAOYSA-N 0.000 claims 1
- 229910052582 BN Inorganic materials 0.000 claims 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims 1
- PEJPHLLTLKIOJZ-UHFFFAOYSA-N CCCCC(CC)CC1=C(C)C(C(O)=O)=CC=C1C(O)=O Chemical compound CCCCC(CC)CC1=C(C)C(C(O)=O)=CC=C1C(O)=O PEJPHLLTLKIOJZ-UHFFFAOYSA-N 0.000 claims 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 229920000049 Carbon (fiber) Polymers 0.000 claims 1
- 229910001111 Fine metal Inorganic materials 0.000 claims 1
- KRADHMIOFJQKEZ-UHFFFAOYSA-N Tri-2-ethylhexyl trimellitate Chemical compound CCCCC(CC)COC(=O)C1=CC=C(C(=O)OCC(CC)CCCC)C(C(=O)OCC(CC)CCCC)=C1 KRADHMIOFJQKEZ-UHFFFAOYSA-N 0.000 claims 1
- FRQDZJMEHSJOPU-UHFFFAOYSA-N Triethylene glycol bis(2-ethylhexanoate) Chemical compound CCCCC(CC)C(=O)OCCOCCOCCOC(=O)C(CC)CCCC FRQDZJMEHSJOPU-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 239000002318 adhesion promoter Substances 0.000 claims 1
- RREGISFBPQOLTM-UHFFFAOYSA-N alumane;trihydrate Chemical compound O.O.O.[AlH3] RREGISFBPQOLTM-UHFFFAOYSA-N 0.000 claims 1
- 229910002113 barium titanate Inorganic materials 0.000 claims 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims 1
- 229920005601 base polymer Polymers 0.000 claims 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims 1
- 239000004917 carbon fiber Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000011231 conductive filler Substances 0.000 claims 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- 239000003431 cross linking reagent Substances 0.000 claims 1
- 125000000753 cycloalkyl group Chemical group 0.000 claims 1
- QYQADNCHXSEGJT-UHFFFAOYSA-N cyclohexane-1,1-dicarboxylate;hydron Chemical class OC(=O)C1(C(O)=O)CCCCC1 QYQADNCHXSEGJT-UHFFFAOYSA-N 0.000 claims 1
- 239000010432 diamond Substances 0.000 claims 1
- 229910003460 diamond Inorganic materials 0.000 claims 1
- 235000014113 dietary fatty acids Nutrition 0.000 claims 1
- FBSAITBEAPNWJG-UHFFFAOYSA-N dimethyl phthalate Natural products CC(=O)OC1=CC=CC=C1OC(C)=O FBSAITBEAPNWJG-UHFFFAOYSA-N 0.000 claims 1
- 229960001826 dimethylphthalate Drugs 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- 239000000194 fatty acid Substances 0.000 claims 1
- 229930195729 fatty acid Natural products 0.000 claims 1
- -1 fatty acid ester Chemical class 0.000 claims 1
- 230000004907 flux Effects 0.000 claims 1
- 235000013773 glyceryl triacetate Nutrition 0.000 claims 1
- 239000010439 graphite Substances 0.000 claims 1
- 229910002804 graphite Inorganic materials 0.000 claims 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims 1
- 239000000347 magnesium hydroxide Substances 0.000 claims 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims 1
- 239000000395 magnesium oxide Substances 0.000 claims 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims 1
- 239000002923 metal particle Substances 0.000 claims 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 150000002978 peroxides Chemical class 0.000 claims 1
- 239000000546 pharmaceutical excipient Substances 0.000 claims 1
- 239000004014 plasticizer Substances 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 238000007639 printing Methods 0.000 claims 1
- 230000003014 reinforcing effect Effects 0.000 claims 1
- 238000007650 screen-printing Methods 0.000 claims 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 claims 1
- 239000003381 stabilizer Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 239000004094 surface-active agent Substances 0.000 claims 1
- URAYPUMNDPQOKB-UHFFFAOYSA-N triacetin Chemical compound CC(=O)OCC(OC(C)=O)COC(C)=O URAYPUMNDPQOKB-UHFFFAOYSA-N 0.000 claims 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 claims 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims 1
- 239000011787 zinc oxide Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161466231P | 2011-03-22 | 2011-03-22 | |
| US61/466,231 | 2011-03-22 | ||
| PCT/US2012/025781 WO2012128875A1 (en) | 2011-03-22 | 2012-02-20 | Thermal management within an led assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014517440A JP2014517440A (ja) | 2014-07-17 |
| JP2014517440A5 true JP2014517440A5 (https=) | 2015-01-15 |
Family
ID=45815960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014501076A Pending JP2014517440A (ja) | 2011-03-22 | 2012-02-20 | Ｌｅｄアセンブリ内の熱管理方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20130344632A1 (https=) |
| EP (1) | EP2689643A1 (https=) |
| JP (1) | JP2014517440A (https=) |
| KR (1) | KR20140017602A (https=) |
| CN (1) | CN103430637A (https=) |
| TW (1) | TW201242505A (https=) |
| WO (1) | WO2012128875A1 (https=) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9935246B2 (en) * | 2013-12-30 | 2018-04-03 | Cree, Inc. | Silazane-containing materials for light emitting diodes |
| EP3114172A4 (en) * | 2014-03-06 | 2017-10-25 | Henkel AG & Co. KGaA | A single crystal alumina filled die attach paste |
| CN106158790B (zh) | 2015-04-10 | 2018-11-16 | 台达电子工业股份有限公司 | 功率模块及其热界面结构 |
| WO2017012118A1 (en) * | 2015-07-23 | 2017-01-26 | Dow Global Technologies Llc | Thermally conductive composite comprising boron nitride-thermoset particles |
| CN105172259A (zh) * | 2015-08-11 | 2015-12-23 | 深圳长宝覆铜板科技有限公司 | 高散热金属铝基覆铜板制作方法 |
| JP6481576B2 (ja) * | 2015-09-18 | 2019-03-13 | 東芝ライテック株式会社 | 発光装置、投光器及び発光装置の製造方法 |
| TWI646706B (zh) * | 2015-09-21 | 2019-01-01 | 隆達電子股份有限公司 | 發光二極體晶片封裝體 |
| JP6814384B2 (ja) * | 2016-08-03 | 2021-01-20 | 三菱瓦斯化学株式会社 | 熱伝導シートの製造方法 |
| KR102236923B1 (ko) * | 2017-12-04 | 2021-04-07 | 주식회사 엘지화학 | 가소제 조성물 및 이를 포함하는 수지 조성물 |
| EA039238B1 (ru) | 2018-05-20 | 2021-12-21 | Абеятек, Ллс | Светоизлучающий диод для применения при низких температурах |
| JP2020136607A (ja) * | 2019-02-25 | 2020-08-31 | 信越ポリマー株式会社 | 放熱構造およびそれを備える機器 |
| KR102152164B1 (ko) * | 2019-03-20 | 2020-09-04 | 주식회사 오투마 | 방열장치 및 그 제조방법 |
| CN113692326B (zh) * | 2019-04-22 | 2023-08-01 | 三井化学株式会社 | 电子设备壳体、其制造方法及金属树脂复合体 |
| CN116368195B (zh) * | 2020-09-23 | 2026-03-10 | 陶氏环球技术有限责任公司 | 具有低分配粘度、分配后具有低竖向流动且固化后具有低热阻抗的热界面材料 |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2676182A (en) | 1950-09-13 | 1954-04-20 | Dow Corning | Copolymeric siloxanes and methods of preparing them |
| US3296291A (en) | 1962-07-02 | 1967-01-03 | Gen Electric | Reaction of silanes with unsaturated olefinic compounds |
| US3220972A (en) | 1962-07-02 | 1965-11-30 | Gen Electric | Organosilicon process using a chloroplatinic acid reaction product as the catalyst |
| US3159601A (en) | 1962-07-02 | 1964-12-01 | Gen Electric | Platinum-olefin complex catalyzed addition of hydrogen- and alkenyl-substituted siloxanes |
| NL131800C (https=) | 1965-05-17 | |||
| NL129346C (https=) | 1966-06-23 | |||
| US3516946A (en) | 1967-09-29 | 1970-06-23 | Gen Electric | Platinum catalyst composition for hydrosilation reactions |
| US3814730A (en) | 1970-08-06 | 1974-06-04 | Gen Electric | Platinum complexes of unsaturated siloxanes and platinum containing organopolysiloxanes |
| US3989667A (en) | 1974-12-02 | 1976-11-02 | Dow Corning Corporation | Olefinic siloxanes as platinum inhibitors |
| US3989668A (en) | 1975-07-14 | 1976-11-02 | Dow Corning Corporation | Method of making a silicone elastomer and the elastomer prepared thereby |
| US4087585A (en) | 1977-05-23 | 1978-05-02 | Dow Corning Corporation | Self-adhering silicone compositions and preparations thereof |
| US4370358A (en) | 1980-09-22 | 1983-01-25 | General Electric Company | Ultraviolet curable silicone adhesives |
| US4584355A (en) | 1984-10-29 | 1986-04-22 | Dow Corning Corporation | Silicone pressure-sensitive adhesive process and product with improved lap-shear stability-I |
| US4591622A (en) | 1984-10-29 | 1986-05-27 | Dow Corning Corporation | Silicone pressure-sensitive adhesive process and product thereof |
| US4585836A (en) | 1984-10-29 | 1986-04-29 | Dow Corning Corporation | Silicone pressure-sensitive adhesive process and product with improved lap-shear stability-II |
| JPS61195129A (ja) | 1985-02-22 | 1986-08-29 | Toray Silicone Co Ltd | 有機けい素重合体の製造方法 |
| US4584361A (en) | 1985-06-03 | 1986-04-22 | Dow Corning Corporation | Storage stable, one part polyorganosiloxane compositions |
| US4766176A (en) | 1987-07-20 | 1988-08-23 | Dow Corning Corporation | Storage stable heat curable organosiloxane compositions containing microencapsulated platinum-containing catalysts |
| US4784879A (en) | 1987-07-20 | 1988-11-15 | Dow Corning Corporation | Method for preparing a microencapsulated compound of a platinum group metal |
| US4774281A (en) | 1987-09-04 | 1988-09-27 | Dow Corning Corporation | Low compression set silicone rubber |
| JP2630993B2 (ja) | 1988-06-23 | 1997-07-16 | 東レ・ダウコーニング・シリコーン株式会社 | ヒドロシリル化反応用白金系触媒含有粒状物およびその製造方法 |
| JPH0214244A (ja) | 1988-06-30 | 1990-01-18 | Toray Dow Corning Silicone Co Ltd | 加熱硬化性オルガノポリシロキサン組成物 |
| US5036117A (en) | 1989-11-03 | 1991-07-30 | Dow Corning Corporation | Heat-curable silicone compositions having improved bath life |
| JP3029680B2 (ja) | 1991-01-29 | 2000-04-04 | 東レ・ダウコーニング・シリコーン株式会社 | オルガノペンタシロキサンおよびその製造方法 |
| GB9103191D0 (en) | 1991-02-14 | 1991-04-03 | Dow Corning | Platinum complexes and use thereof |
| JP2511348B2 (ja) | 1991-10-17 | 1996-06-26 | 東レ・ダウコーニング・シリコーン株式会社 | オルガノポリシロキサンおよびその製造方法 |
| JP3444199B2 (ja) | 1998-06-17 | 2003-09-08 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム組成物及びその製造方法 |
| WO2000005652A1 (en) | 1998-07-24 | 2000-02-03 | Sun Microsystems, Inc. | Method and apparatus for achieving deterministic memory allocation response in a computer system |
| US7485202B2 (en) * | 2003-10-28 | 2009-02-03 | Dow Corning Corporation | Method for making a flat-top pad |
| US20060266475A1 (en) * | 2005-05-24 | 2006-11-30 | American Standard Circuits, Inc. | Thermally conductive interface |
| JP2010153803A (ja) * | 2008-11-28 | 2010-07-08 | Toshiba Lighting & Technology Corp | 電子部品実装モジュール及び電気機器 |
| CN102341459B (zh) * | 2009-03-12 | 2014-01-01 | 道康宁公司 | 热界面材料和它们的制备与使用方法 |
-
2012
- 2012-02-20 WO PCT/US2012/025781 patent/WO2012128875A1/en not_active Ceased
- 2012-02-20 KR KR1020137026925A patent/KR20140017602A/ko not_active Withdrawn
- 2012-02-20 CN CN2012800143432A patent/CN103430637A/zh active Pending
- 2012-02-20 JP JP2014501076A patent/JP2014517440A/ja active Pending
- 2012-02-20 EP EP12708430.9A patent/EP2689643A1/en not_active Withdrawn
- 2012-02-20 US US14/003,828 patent/US20130344632A1/en not_active Abandoned
- 2012-03-08 TW TW101107958A patent/TW201242505A/zh unknown
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2014517440A5 (https=) | ||
| JP2012520375A5 (https=) | ||
| US9481851B2 (en) | Thermally-curable heat-conductive silicone grease composition | |
| JP6600314B2 (ja) | Ｌｅｄランプヒートシンク | |
| US10030184B2 (en) | Addition one part curing type heat-conductive silicone grease composition | |
| KR101780077B1 (ko) | 도전성 회로 형성 방법 | |
| JP5155033B2 (ja) | 熱伝導性シリコーン組成物 | |
| US9120935B2 (en) | Hydrosilylation reaction inhibitors, and use thereof for preparing stable curable silicone compositions | |
| US20170283677A1 (en) | Uv-thickening thermally conductive silicone grease composition | |
| CN103430637A (zh) | Led组件内的热管理 | |
| JP2016098337A (ja) | 一液付加硬化型シリコーン組成物、その保存方法及び硬化方法 | |
| JP6627792B2 (ja) | 表面保護フィルム、基板加工体、及び表面保護フィルムの製造方法 | |
| KR20170101276A (ko) | 소결가능한 접착 재료 및 그것을 사용한 반도체 디바이스 | |
| TWI455969B (zh) | 樹脂組成物薄片、附金屬箔之樹脂組成物薄片、金屬基底配線板材料、金屬基底配線板、及ｌｅｄ光源構件 | |
| JP2012069783A (ja) | 熱伝導性シリコーン組成物およびこれを用いる実装基板 | |
| EP3219761A1 (en) | Ultraviolet-thickenable thermally conductive silicone grease composition | |
| JP6264307B2 (ja) | 付加硬化型シリコーン組成物 | |
| JPWO2019031082A1 (ja) | 有機ケイ素化合物及び硬化性熱伝導性シリコーン組成物 | |
| JP2017008146A (ja) | ポリオルガノシルセスキオキサン、ハードコートフィルム、接着シート、積層物及び装置 | |
| US9944824B2 (en) | Gas-emission-reduced silicone gel | |
| JP2014065906A5 (https=) | ||
| CN1649134A (zh) | 导热性硅氧烷放热用组合物及其使用方法 | |
| US12091591B2 (en) | Adhesive polyorganosiloxane composition | |
| TW201116541A (en) | Composition, cured product, electronic device, tri(2, 2-bis((allyloxy) methyl)-1-butoxy)aluminum, and preparation method therefor | |
| JP2018199745A5 (https=) |