JP2014517440A - Ｌｅｄアセンブリ内の熱管理方法 - Google Patents

Ｌｅｄアセンブリ内の熱管理方法 Download PDF

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Publication number
JP2014517440A
JP2014517440A JP2014501076A JP2014501076A JP2014517440A JP 2014517440 A JP2014517440 A JP 2014517440A JP 2014501076 A JP2014501076 A JP 2014501076A JP 2014501076 A JP2014501076 A JP 2014501076A JP 2014517440 A JP2014517440 A JP 2014517440A
Authority
JP
Japan
Prior art keywords
component
composition
thermal management
led
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014501076A
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English (en)
Japanese (ja)
Other versions
JP2014517440A5 (https=
Inventor
ベッカー グレゴリー
エダル バグウェイガー ドラブ
ラベル アンドリュー
ストロング マイケル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
Original Assignee
Dow Corning Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Corp filed Critical Dow Corning Corp
Publication of JP2014517440A publication Critical patent/JP2014517440A/ja
Publication of JP2014517440A5 publication Critical patent/JP2014517440A5/ja
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/60—Arrangements for cooling, heating, ventilating or compensating for temperature fluctuations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2014501076A 2011-03-22 2012-02-20 Ｌｅｄアセンブリ内の熱管理方法 Pending JP2014517440A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161466231P 2011-03-22 2011-03-22
US61/466,231 2011-03-22
PCT/US2012/025781 WO2012128875A1 (en) 2011-03-22 2012-02-20 Thermal management within an led assembly

Publications (2)

Publication Number Publication Date
JP2014517440A true JP2014517440A (ja) 2014-07-17
JP2014517440A5 JP2014517440A5 (https=) 2015-01-15

Family

ID=45815960

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014501076A Pending JP2014517440A (ja) 2011-03-22 2012-02-20 Ｌｅｄアセンブリ内の熱管理方法

Country Status (7)

Country Link
US (1) US20130344632A1 (https=)
EP (1) EP2689643A1 (https=)
JP (1) JP2014517440A (https=)
KR (1) KR20140017602A (https=)
CN (1) CN103430637A (https=)
TW (1) TW201242505A (https=)
WO (1) WO2012128875A1 (https=)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017059479A (ja) * 2015-09-18 2017-03-23 東芝ライテック株式会社 発光装置、投光器及び発光装置の製造方法
JP2017063193A (ja) * 2015-09-21 2017-03-30 隆達電子股▲ふん▼有限公司 Ｌｅｄチップパッケージ
JP2018022767A (ja) * 2016-08-03 2018-02-08 三菱瓦斯化学株式会社 熱伝導シートの製造方法
JP2020136607A (ja) * 2019-02-25 2020-08-31 信越ポリマー株式会社 放熱構造およびそれを備える機器
KR102152164B1 (ko) * 2019-03-20 2020-09-04 주식회사 오투마 방열장치 및 그 제조방법
JPWO2020218277A1 (ja) * 2019-04-22 2021-12-02 三井化学株式会社 電子機器筐体、その製造方法および金属樹脂複合体
JP2023550866A (ja) * 2020-09-23 2023-12-06 ダウ グローバル テクノロジーズ エルエルシー 分配粘度が低く、分配後の鉛直流が少なく、硬化後の熱インピーダンスが低い熱界面材料
KR102958112B1 (ko) 2018-11-16 2026-04-28 헨켈 아게 운트 코. 카게아아 액체 광학 투명 접착제 응용분야를 위한 이중 경화성 실리콘-유기 하이브리드 중합체 조성물

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9935246B2 (en) * 2013-12-30 2018-04-03 Cree, Inc. Silazane-containing materials for light emitting diodes
EP3114172A4 (en) * 2014-03-06 2017-10-25 Henkel AG & Co. KGaA A single crystal alumina filled die attach paste
CN106158790B (zh) 2015-04-10 2018-11-16 台达电子工业股份有限公司 功率模块及其热界面结构
WO2017012118A1 (en) * 2015-07-23 2017-01-26 Dow Global Technologies Llc Thermally conductive composite comprising boron nitride-thermoset particles
CN105172259A (zh) * 2015-08-11 2015-12-23 深圳长宝覆铜板科技有限公司 高散热金属铝基覆铜板制作方法
KR102236923B1 (ko) * 2017-12-04 2021-04-07 주식회사 엘지화학 가소제 조성물 및 이를 포함하는 수지 조성물
EA039238B1 (ru) 2018-05-20 2021-12-21 Абеятек, Ллс Светоизлучающий диод для применения при низких температурах

Citations (3)

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JP2007510306A (ja) * 2003-10-28 2007-04-19 ダウ・コーニング・コーポレイション 平坦な上面を有するパッドの製造方法
JP2010153803A (ja) * 2008-11-28 2010-07-08 Toshiba Lighting & Technology Corp 電子部品実装モジュール及び電気機器
WO2010104534A1 (en) * 2009-03-12 2010-09-16 Dow Corning Corporation Thermal interface materials and mehtods for their preparation and use

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US3296291A (en) 1962-07-02 1967-01-03 Gen Electric Reaction of silanes with unsaturated olefinic compounds
US3220972A (en) 1962-07-02 1965-11-30 Gen Electric Organosilicon process using a chloroplatinic acid reaction product as the catalyst
US3159601A (en) 1962-07-02 1964-12-01 Gen Electric Platinum-olefin complex catalyzed addition of hydrogen- and alkenyl-substituted siloxanes
NL131800C (https=) 1965-05-17
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JP3444199B2 (ja) 1998-06-17 2003-09-08 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及びその製造方法
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JP2007510306A (ja) * 2003-10-28 2007-04-19 ダウ・コーニング・コーポレイション 平坦な上面を有するパッドの製造方法
JP2010153803A (ja) * 2008-11-28 2010-07-08 Toshiba Lighting & Technology Corp 電子部品実装モジュール及び電気機器
WO2010104534A1 (en) * 2009-03-12 2010-09-16 Dow Corning Corporation Thermal interface materials and mehtods for their preparation and use

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017059479A (ja) * 2015-09-18 2017-03-23 東芝ライテック株式会社 発光装置、投光器及び発光装置の製造方法
JP2017063193A (ja) * 2015-09-21 2017-03-30 隆達電子股▲ふん▼有限公司 Ｌｅｄチップパッケージ
JP2018022767A (ja) * 2016-08-03 2018-02-08 三菱瓦斯化学株式会社 熱伝導シートの製造方法
KR102958112B1 (ko) 2018-11-16 2026-04-28 헨켈 아게 운트 코. 카게아아 액체 광학 투명 접착제 응용분야를 위한 이중 경화성 실리콘-유기 하이브리드 중합체 조성물
JP2020136607A (ja) * 2019-02-25 2020-08-31 信越ポリマー株式会社 放熱構造およびそれを備える機器
KR102152164B1 (ko) * 2019-03-20 2020-09-04 주식회사 오투마 방열장치 및 그 제조방법
JPWO2020218277A1 (ja) * 2019-04-22 2021-12-02 三井化学株式会社 電子機器筐体、その製造方法および金属樹脂複合体
JP2023550866A (ja) * 2020-09-23 2023-12-06 ダウ グローバル テクノロジーズ エルエルシー 分配粘度が低く、分配後の鉛直流が少なく、硬化後の熱インピーダンスが低い熱界面材料
JP7731420B2 (ja) 2020-09-23 2025-08-29 ダウ グローバル テクノロジーズ エルエルシー 分配粘度が低く、分配後の鉛直流が少なく、硬化後の熱インピーダンスが低い熱界面材料

Also Published As

Publication number Publication date
CN103430637A (zh) 2013-12-04
WO2012128875A1 (en) 2012-09-27
US20130344632A1 (en) 2013-12-26
EP2689643A1 (en) 2014-01-29
TW201242505A (en) 2012-10-16
KR20140017602A (ko) 2014-02-11

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