KR20140017602A - Ｌｅｄ 조립체 내의 열 관리 - Google Patents

Ｌｅｄ 조립체 내의 열 관리 Download PDF

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Publication number
KR20140017602A
KR20140017602A KR1020137026925A KR20137026925A KR20140017602A KR 20140017602 A KR20140017602 A KR 20140017602A KR 1020137026925 A KR1020137026925 A KR 1020137026925A KR 20137026925 A KR20137026925 A KR 20137026925A KR 20140017602 A KR20140017602 A KR 20140017602A
Authority
KR
South Korea
Prior art keywords
component
composition
thermal management
heat sink
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020137026925A
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English (en)
Korean (ko)
Inventor
그레고리 베커
도랍 에듈 백웨이거
앤드류 러벌
마이클 스트롱
Original Assignee
다우 코닝 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다우 코닝 코포레이션 filed Critical 다우 코닝 코포레이션
Publication of KR20140017602A publication Critical patent/KR20140017602A/ko
Withdrawn legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/60—Arrangements for cooling, heating, ventilating or compensating for temperature fluctuations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR1020137026925A 2011-03-22 2012-02-20 Ｌｅｄ 조립체 내의 열 관리 Withdrawn KR20140017602A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161466231P 2011-03-22 2011-03-22
US61/466,231 2011-03-22
PCT/US2012/025781 WO2012128875A1 (en) 2011-03-22 2012-02-20 Thermal management within an led assembly

Publications (1)

Publication Number Publication Date
KR20140017602A true KR20140017602A (ko) 2014-02-11

Family

ID=45815960

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137026925A Withdrawn KR20140017602A (ko) 2011-03-22 2012-02-20 Ｌｅｄ 조립체 내의 열 관리

Country Status (7)

Country Link
US (1) US20130344632A1 (https=)
EP (1) EP2689643A1 (https=)
JP (1) JP2014517440A (https=)
KR (1) KR20140017602A (https=)
CN (1) CN103430637A (https=)
TW (1) TW201242505A (https=)
WO (1) WO2012128875A1 (https=)

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US9935246B2 (en) * 2013-12-30 2018-04-03 Cree, Inc. Silazane-containing materials for light emitting diodes
EP3114172A4 (en) * 2014-03-06 2017-10-25 Henkel AG & Co. KGaA A single crystal alumina filled die attach paste
CN106158790B (zh) 2015-04-10 2018-11-16 台达电子工业股份有限公司 功率模块及其热界面结构
WO2017012118A1 (en) * 2015-07-23 2017-01-26 Dow Global Technologies Llc Thermally conductive composite comprising boron nitride-thermoset particles
CN105172259A (zh) * 2015-08-11 2015-12-23 深圳长宝覆铜板科技有限公司 高散热金属铝基覆铜板制作方法
JP6481576B2 (ja) * 2015-09-18 2019-03-13 東芝ライテック株式会社 発光装置、投光器及び発光装置の製造方法
TWI646706B (zh) * 2015-09-21 2019-01-01 隆達電子股份有限公司 發光二極體晶片封裝體
JP6814384B2 (ja) * 2016-08-03 2021-01-20 三菱瓦斯化学株式会社 熱伝導シートの製造方法
KR102236923B1 (ko) * 2017-12-04 2021-04-07 주식회사 엘지화학 가소제 조성물 및 이를 포함하는 수지 조성물
EA039238B1 (ru) 2018-05-20 2021-12-21 Абеятек, Ллс Светоизлучающий диод для применения при низких температурах
JP2020136607A (ja) * 2019-02-25 2020-08-31 信越ポリマー株式会社 放熱構造およびそれを備える機器
KR102152164B1 (ko) * 2019-03-20 2020-09-04 주식회사 오투마 방열장치 및 그 제조방법
CN113692326B (zh) * 2019-04-22 2023-08-01 三井化学株式会社 电子设备壳体、其制造方法及金属树脂复合体
CN116368195B (zh) * 2020-09-23 2026-03-10 陶氏环球技术有限责任公司 具有低分配粘度、分配后具有低竖向流动且固化后具有低热阻抗的热界面材料

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Also Published As

Publication number Publication date
JP2014517440A (ja) 2014-07-17
CN103430637A (zh) 2013-12-04
WO2012128875A1 (en) 2012-09-27
US20130344632A1 (en) 2013-12-26
EP2689643A1 (en) 2014-01-29
TW201242505A (en) 2012-10-16

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