JP2017063193A - Ledチップパッケージ - Google Patents
Ledチップパッケージ Download PDFInfo
- Publication number
- JP2017063193A JP2017063193A JP2016181630A JP2016181630A JP2017063193A JP 2017063193 A JP2017063193 A JP 2017063193A JP 2016181630 A JP2016181630 A JP 2016181630A JP 2016181630 A JP2016181630 A JP 2016181630A JP 2017063193 A JP2017063193 A JP 2017063193A
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- Prior art keywords
- light emitting
- led chip
- substrate
- chip package
- emitting assembly
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0756—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/08—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
Description
100…LEDチップパッケージ
102…基板
102A…基板の第1の部分
102B…基板の第2の部分
104…発光アセンブリ
106A、106B、106C、106D…LEDチップ
108A、108B、108C、108D…発光領域
110、110A、110B、110C…導線構造
112A…第1の電極
112B…第2の電極
114…蛍光シート
116…反射素子
118…半導体基板
120…金属端子
122…電気的接続領域
123…絶縁領域
124…金属層
124A…凸部
126…保護層
128、129…接着層
130…配線
132…グラファイト繊維質層
134…ダイボンディング領域
200、300…LEDチップパッケージ
Claims (14)
- 金属端子を有する基板、および、複数のLEDチップを一体化した発光アセンブリを備え、
前記発光アセンブリは、相互分離した複数の発光領域を有し、前記基板上に設置され、且つ前記金属端子と電気的接続されている
LEDチップパッケージ。 - 金属端子を有する基板、およびウエハレベルチップスケールパッケージで形成された発光アセンブリを備え、
前記発光アセンブリは、
相互分離した複数の発光領域を有し、前記基板上に設置され、且つ前記金属端子と電気的接続されている
LEDチップパッケージ。 - 前記発光アセンブリは、第1の電極と第2の電極を含み、
前記第1の電極と前記第2の電極は、前記発光アセンブリの同一側の端部に設置される
請求項1または請求項2に記載のLEDチップパッケージ。 - 前記第1の電極と前記第2の電極は、同一の前記発光領域上、または異なる前記発光領域上に配置される
請求項3に記載のLEDチップパッケージ。 - 前記複数の発光領域の間隙は、0より大きく、且つ50μmより小さい
請求項1または請求項2に記載のLEDチップパッケージ。 - 前記発光アセンブリの周辺に設置された反射素子を更に含む
請求項1または請求項2に記載のLEDチップパッケージ。 - 前記発光アセンブリ上に設置された蛍光層を更に含む
請求項1または請求項2に記載のLEDチップパッケージ。 - 前記複数の発光領域は、並列に設置される
請求項1または請求項2に記載のLEDチップパッケージ。 - 前記基板の材料は、金属層を含む
請求項1または請求項2に記載のLEDチップパッケージ。 - 前記発光アセンブリは、水平型チップまたは垂直型チップである
請求項9に記載のLEDチップパッケージ。 - 前記基板は、前記金属層の下方に配置されたグラファイト繊維質層を更に含む
請求項9に記載のLEDチップパッケージ。 - 前記基板は、第1の部分と第2の部分を含み、
前記第1の部分の材料は、無機材料であり、
前記第2の部分の材料は、有機材料または金属を含み、
前記発光アセンブリは、前記第1の部分上に設置される
請求項1または請求項2に記載のLEDチップパッケージ。 - 前記発光アセンブリは、水平型チップまたは垂直型チップである
請求項12に記載のLEDチップパッケージ。 - 前記発光アセンブリを前記基板に接合する接合構造は、フリップチップ接合構造である
請求項12に記載のLEDチップパッケージ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104131094A TWI646706B (zh) | 2015-09-21 | 2015-09-21 | 發光二極體晶片封裝體 |
TW104131094 | 2015-09-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2017063193A true JP2017063193A (ja) | 2017-03-30 |
Family
ID=56026756
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016181630A Pending JP2017063193A (ja) | 2015-09-21 | 2016-09-16 | Ledチップパッケージ |
Country Status (5)
Country | Link |
---|---|
US (1) | US9812432B2 (ja) |
EP (1) | EP3144968A1 (ja) |
JP (1) | JP2017063193A (ja) |
CN (1) | CN106549090A (ja) |
TW (1) | TWI646706B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD872038S1 (en) * | 2018-07-18 | 2020-01-07 | Haining Xincheng Electronics Co., Ltd. | LED chips on a printed circuit board |
USD873783S1 (en) * | 2018-10-19 | 2020-01-28 | Haining Xincheng Electronics Co., Ltd. | LED chip |
USD899384S1 (en) * | 2019-11-04 | 2020-10-20 | Putco, Inc. | Surface-mount device |
TWI744166B (zh) * | 2021-01-06 | 2021-10-21 | 研能科技股份有限公司 | 印表機驅動系統之系統級封裝晶片 |
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2016
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JP2015050461A (ja) * | 2013-08-30 | 2015-03-16 | エルジー イノテック カンパニー リミテッド | 発光素子パッケージ及びそれを含む車両用照明装置 |
JP2015115407A (ja) * | 2013-12-10 | 2015-06-22 | 三星電子株式会社Samsung Electronics Co.,Ltd. | 発光素子用配線基板、半導体発光装置、および、それらの製造方法 |
JP3192424U (ja) * | 2014-06-03 | 2014-08-14 | Hoya Candeo Optronics株式会社 | Ledモジュール |
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CN106549090A (zh) | 2017-03-29 |
TW201712897A (zh) | 2017-04-01 |
EP3144968A1 (en) | 2017-03-22 |
US20170084586A1 (en) | 2017-03-23 |
US9812432B2 (en) | 2017-11-07 |
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