1310992 八、本案 若有化學式時’請揭示最能顯示發明特徵的化學式 無。 九、發明說明： 【發明所屬之技術領域】 ^發明係關於-種發光二極體模組，特別是指一種利用 職咖編_性之導熱膠 【先前技術】 發光二極體係為一種通電時可發光之電子元件，其發光 原理是將電能轉換為光，也就是將Ρ·Ν接合注入少數載體， ，其與多數載體再結合而發出自然光之二極體，欲使LED發 光良好必須有極多之電子-電洞對直接複合。當LED施以順^ 偏壓後，空間電荷層變窄’基於兩側之費米能階差異，所以 p-N兩侧之主要載體分別注入n侧及p侧。由於兩侧之少數 载體大量增加’使兩侧之間進行大量電洞_電子對的再複合， 並放出足夠之光子數；目前發光二極體之種類大致包含1310992 VIII. This case If there is a chemical formula, please disclose the chemical formula that best shows the characteristics of the invention. IX. Description of the invention: [Technical field to which the invention pertains] The invention relates to a light-emitting diode module, in particular to a thermal adhesive which utilizes a professional coffee maker. [Prior Art] A light-emitting diode system is a kind of power-on The illuminating electronic component has the principle of converting electric energy into light, that is, injecting Ρ·Ν into a small number of carriers, and combining with most carriers to emit a natural light diode, in order to make the LED emit good, it must have a pole. Many electron-hole pairs are directly compounded. When the LED is biased, the space charge layer is narrowed. Based on the Fermi level difference on both sides, the main carriers on both sides of the p-N are injected into the n-side and the p-side, respectively. Due to the large increase in the number of carriers on both sides, a large number of holes-electron pairs are recombined between the two sides, and enough photons are released; the current types of light-emitting diodes roughly include
GaAs、GaAsl-xPx、GaP 等系列。此外，在 GaAsl-xPx、GaP 系列中摻雜氮原子亦會改變其發光之顏色。 由於LED具有質量輕、體積小、免度尚、耗電量低、使 用壽命長等優點，如今已被用來替代傳統電燈泡，成為新一 代的環保能源’且已經在各個領域被廣泛的應用，諸如曰常 生活中所用的各種家電產品、手機或是七段顯示器等。在此 特別列舉一將LED模組應用於七段顯示器之習知技術加以說 明〇 請參閱第一圖與第二圖，第一圖係顯示習知七段顯示器 之示意圖，第二圖係第一圖中2-2剖面之剖面圖。如圖所示， 一個七段顯示器100具備有一封裝板件1、一電路載板2、八 6 1310992 個LED 3 (第二圖僅顯示其中之一個）與—封膠層4。該 ’板件1具備有一板件本體11與八個對應於LED 3之透^區 12 (包含有圖中所示的七個顯示線段與右下角的顯示 ^ 電路載板2具備有一載板本體21’該載板本體21之上表面= 下表面分別佈设有一板上電路22與一板下電路23，且在今 上電路22與該板下電路23係以一導電元件24予以連通^ = 個LED 3係結合於該板上電路22。 ’ 在習知技術中，該封裝板件1係利用塑膠射出成形之 式而製成，八個透光區域12係八個貫穿板件本體u之 $，八個LED 3係結合在板上電路22上，在進行該七段顯示 器励之封裝作業時’係將封裝板件i覆蓋在電路載板2之 載板本體21之上表面，此時封裝板件丨之每—透光區域12 必須分別位於各LED 3之對應位置。然後，利用黏膠將 板件1與電路載板2之載板本體21之上表面予以黏合， 膠風乾之後則形成該封膠層4。最後，再利用環氧樹酯或其他 透光物質結合於上述之八個預留孔，藉以形成八個封〔 3之透光區段12。 舉凡熟習相關技藝之人士皆能理解，在習知技術之中， 由於封裝板件1係利用塑膠射出成形之方式而製程，受制於 現有一般成形技術之限制，在塑膠射出成型之尺寸設計上，、 為了避免模具流道太窄、不無、縮率不均勻與冷^条 異太大造成之材料均勻度與機械強度差異太大等問題，故 得封裝板件1之厚度往往必須控制在35mm至5mm之間。 同時，由於全球環保意識抬頭，無鉛製程之推廣亦被 各個國家及地區所魏，絲，目前的無錯或低鉛含量鮮料 之熔點溫度都普遍較過去含鉛焊料之熔點溫度高，故在特定 之製程（如過錫爐或過回銲爐等）巾，其工作溫度往往會 過去習知製程之工作溫度為高。又由於該七段顯示器⑽之 封餘件1是__射出成形而製成之緣故，在較高溫之 工作壤境下，容易被溶化或產生變形，故該七段顯示器100 7 1310992 根本無法結合其他電路進行來進行高工作溫度之製程。 此外’由於在習知技術中，該封裝板件丨與電^柄 之上表面係利用黏膠予以黏合，由於黏膠係一具 半流體物質，故在風乾形成封膠層4的過程之中，^ 溢膠的問題，使該七段顯示器100之平整度不足。今 f層2由黏膠風乾而形成，在較雜之卫作:$ 進行高工作溫度之製程。再者’由於黏膠與其^ =時’將會影響到内部電子元件與電路之 【發明内容】 本發明所欲解決之技術問題與目的： 綜觀以上所述，在習知技術中，由 t泸料特性與製程之限制，仍普遍存^ 今融if之厚度㈣合於贿之電路（如捷運悠遊卡4曰片 金内，以及無法運高工作溫度製程等問曰曰片 之主要目的係提供—種發光二極體模租， 其係先將-耐熱材料切銑成—封襄 =、，且 :===路4板裝經過製=GaAs, GaAsl-xPx, GaP and other series. In addition, the doping of nitrogen atoms in the GaAsl-xPx and GaP series also changes the color of its luminescence. Because LED has the advantages of light weight, small size, freeness, low power consumption and long service life, it has been used as a substitute for traditional electric light bulbs and has become a new generation of environmentally friendly energy sources, and has been widely used in various fields. Such as a variety of home appliances used in everyday life, mobile phones or seven-segment displays. Here is a description of a conventional technique for applying an LED module to a seven-segment display. Please refer to the first and second figures. The first figure shows a schematic diagram of a conventional seven-segment display. A cross-sectional view of the section 2-2 in the figure. As shown, a seven-segment display 100 is provided with a package board 1, a circuit carrier 2, eight 6 1310992 LEDs 3 (the second figure shows only one of them) and a sealant layer 4. The 'board 1' is provided with a plate body 11 and eight transparent areas 12 corresponding to the LEDs 3 (including the display lines of the seven display lines and the lower right corner shown in the figure). The circuit board 2 is provided with a carrier body. 21' The upper surface of the carrier body 21 = the lower surface is respectively provided with an on-board circuit 22 and a lower-board circuit 23, and the upper circuit 22 and the lower-substrate circuit 23 are connected by a conductive element 24 ^ = The LEDs 3 are coupled to the on-board circuit 22. In the prior art, the package board 1 is made by plastic injection molding, and the eight light transmissive regions 12 are eight through the plate body u. $, eight LEDs 3 are combined on the on-board circuit 22, and when the seven-segment display is packaged, the package board i is covered on the upper surface of the carrier body 21 of the circuit carrier 2, Each of the light-transmissive regions 12 of the packaged board member must be located at a corresponding position of each of the LEDs 3. Then, the upper surface of the carrier member 21 of the circuit carrier 2 is bonded by the adhesive, and the adhesive is dried. Forming the sealant layer 4. Finally, using epoxy resin or other light transmissive substance to bond to The eight reserved holes are described to form eight transparent sections 12. It can be understood by those skilled in the art that, in the prior art, the packaged board 1 is formed by plastic injection molding. The method and the process are subject to the limitations of the existing general forming technology, in the size design of the plastic injection molding, in order to avoid the material flow uniformity caused by the mold flow path being too narrow, not missing, the shrinkage rate is uneven and the cold strip is too large. The difference between the mechanical strength and the mechanical strength is too large, so the thickness of the packaged plate member 1 must be controlled between 35mm and 5mm. At the same time, due to the global environmental awareness, the promotion of the lead-free process has also been promoted by various countries and regions. The current melting temperature of the error-free or low-lead fresh material is generally higher than the melting temperature of the lead-containing solder in the past. Therefore, in a specific process (such as a tin furnace or a reflow oven), the operating temperature tends to pass. The operating temperature of the conventional process is high. Since the seal 1 of the seven-segment display (10) is made by __ injection molding, it is easily melted or deformed under the working environment of higher temperature. Therefore, the seven-segment display 100 7 1310992 cannot be combined with other circuits to carry out the process of high working temperature. In addition, because in the prior art, the surface of the package board and the upper surface of the electric handle are bonded by adhesive. Since the adhesive is a semi-fluid substance, in the process of air-drying to form the sealant layer 4, the problem of overflowing the glue makes the flatness of the seven-segment display 100 insufficient. The f layer 2 is formed by the air drying of the adhesive. In the more complicated work: $ to carry out the process of high working temperature. In addition, 'because the adhesive and its ^ =' will affect the internal electronic components and circuits. [Invention] The technical problem to be solved by the present invention Purpose: Looking at the above, in the conventional technology, the characteristics of the t-material and the limitation of the process are still widespread. The thickness of the current if (4) is combined with the bribe circuit (such as the MRT Yuyou card 4 曰 piece of gold, And the main purpose of the problem is that it is not necessary to provide a working temperature process. The main purpose of the film is to provide a kind of light-emitting diode die-casting, which is to cut and heat-heat-resistant materials into - seal =, and: === road 4 Loading system =
iS性藉以使完成封裝作業後之發模S 利用二,艘模組’其係 其連结 8 1310992 組具備較高之導熱能力。 本發明之另一目的在於提供一種發光二極體模組，其係 利用一耐熱之封裝板件與一低動性之導熱膠來進行該LED與 其連結電路之封裝，藉以使發光二極體模組得以平整地被^ 袭，而不會產生溢膠與平整性欠佳之問題。 本發明解決問題之技術手段： 本發明為解決習知技術之問題所採用之技術手段係提供 一種發光二極體模組，其包括有一電路載板、一封裝板件 至少一發光二極體(Light Emitting Diode;以下簡稱LED)與一 ^熱膠。該電路載板具備有一載板本體，其上表面與下&面 分別佈設有一板上電路與一板下電路，該板上電路結合有該 LED並連通該板下電路。該封裝板件係由耐高溫之高分子材 料，組成，利用切銑方式而成形，並具備有至少一透光區域， 在該封裝板件覆蓋於該電路載板時，該LED係對應於該透光 區域。該導熱膠係由具備耐高溫、可導熱與低流動特性之三 氧化二鋁（Al2〇3)基高分子材料所組成，並用以將該封裝板 件覆蓋結合於該電路载板之上表面，藉以在施予一高溫壓合 製程後’將結合於該板上電路之該LED封裝於該封裝板件與 丨該電路載板之間。 〃 本發明對照先前技術之功效： ^相較於現有發光二極體模組之封裝技術，本發明係特別 採用將耐熱之高分子材料板件切銑成封裝板件’來取代習用 塑膠射出成形製程之封裝板件’藉以使發光二極體模組之封 裝板件厚度得以自習用之3.5mm至5mm大幅降低到本發明 之0.4mm左右，而該發光二極體模組之整體厚度則約僅 0.51mm至0.61mm ’使得其可嵌合於輕薄之電路而廣泛運用 各種超薄板型電路（如捷運悠遊卡或是晶片金融卡）内。 9 1310992 同時’由於封裝元件與導熱膠係 組成，故本發明所提供之發光二極細且 :度之，試後，發現該發光二極體 3〇〇 C之_而不會被熔化’故可廣 $ 約250Χ：〜28(TC左右）之無鉛製程。 门 作酿度 過4!測導熱之高分子材料所組成，經 ΐϋίΐ ίί其具備有至少G.4W之基礎導熱效果，故 Z確^先Γ極體模組在高溫工作環境下，其内部之電子元 件及電路仍能維持特定水準之運作穩定性 从τίϊ:由於導ί膠係用低流動性之高分子材料所組成， 单二Ϊ體模組得以平整地被封裝’有效解決溢夥與 千i性人^之問題’進而提製作該發光二極體敵之良率。 為了能更進-步瞭解本創作特徵及技術内容，請以 下有關本發明之詳細說明與附圖。 【實施方式】 、^於本發明所知1供之發光二極體(Light Emitting Diode ; 以下簡稱LED)模組可廣泛運用於多種模組電路與電子裝 置，其組合實施方式更是不勝枚舉，故在此不再一二贅述， 亦僅列舉其運用於七段顯示器之實施例加以說明，故以下皆 以七段顯示器之元件名稱來代表LED模組。 ，參閱第三圖與第四圖，第三圖係顯示本發明較佳實施 例之，意圖，第四圖係顯示第三圖中4_4剖面之剖面圖。如 圖所示，一個七段顯示态2〇〇包括有一封裝板件$、一電路载 板6、八個LED 7與一導熱膠8。該封裝板件5具備有一板件 ^體51與八個對應於led 3之透光區域12 (包含有圖中所 示的七個顯示線段與右下角的顯示點）。 該電路載板6具備有一載板本體61，該載板本體61之上 表面611與下表面612分別佈設有一板上電路62與一板下電 1310992 5 = ίίϊίι電路62與該板下電路63係以—導電元件64 i_L電予以積體連通。八個LED 3係結合於該 =電路62。此外，該電路載板 封轉片65與心祕^ :射二3板上電路62、載板本體6卜板τ電路63與絕 耐_ (如FR-5 i 、m陶是材枓）經過cnc切銑或鑽孔後製成， L、ED 7 # 域52係八個貫穿板件本體51之預留孔，八個 :合在板上電路62上，在進行該七段顯示器200之 61 i j時’係將縣板件5覆蓋在電路載板6之載板本體 611，此時封裝板件5之每一透光區域62必須分 可莫T 7之對應位置。然後，利用具備高具備耐高溫、 動特性之三氧化二紹（处〇3)基高分子材料所 6 娜8結合於封裝板件5與電路載板6之載板本體 爾搭条^面611之間，並施予一高_合製程。最後，再利 2氧摘或其他透光物質結合於上述之八個預留孔，藉以 形成八個封裝led 3之透光區段12。 叫繼續參㈣五圖與第六圖，並且—併參照第三圖與第 =肋第五圖係顯示顯示板上電路之配置方式示意圖，第六 圖則』不板下電路包覆有絕緣封裝膠片之示·。如圖所 ^、’該板上電路62之外緣具備有八個高電位接腳A、B、D、 古、F、G、I與j ’以及二個低電位接腳c與η。其中，四個 ▽電位，？ A、B、d與Ε係分別經由上半部之四個LED 7 2於第，圖中上半部之透光區域52之相對位置，配置位置 禾直，顯示於圖式之中）而導接於低電位接腳C。同樣地， T電位接腳F、G、1與J係分別經由下半部之LED 7 (位 ‘f,圖中下半部之透光區域52之相對位置，配置位置未直 ”、具示於圖式之中）而導接於低電位接聊H。該板下電路63 1310992 ^大部分區域皆被絕緣封㈣片65所包覆 接通該高電位接腳A、B、D、E、F、G、1盘;外匕刀= 位接腳C與ίί。 以及该低電 規古Ϊΐ所屬技術賴中具有通常知識者皆可理解，相較於 之·模組之封裝技術，本發明係__將耐敎 2 ί 板件施予CNC切銑或鑽孔之方式而製成圭^ H’_L支可使發封裝板件之厚度得以控制在〇.4聰左右，^ 2光二極體模組之整體厚度則可控制在α5ι_ ^ 薄之Γ路ίΐίίΐΓ斤製成之發光二極體模、组可嵌合於輕 曰運用各種超薄板型電路(如捷運悠遊卡或是 w同f i i於封裝元件解__耐熱之私子材料所 :、成故本發明所提供之發光二極體模組可承受較高之工作 t過發明人測試後，發現該發光二極體模組可承受 舰化’故可肤獅於高溫（―般工作 酿度約250C〜28(TC左右）之無錯製程。 2於ί熱縣用可導熱之高分子材料所組成，經 ί其具備有至少罐之基礎導熱效果，故 了確保發光二極體模組在高溫工作環境下，其内 件及電路仍能維持特定水準之運作穩定性。 电卞兀 最後，由於導熱膠係用低流動性之高分子材料所組成， 鋪额得以平整地被雜，有贿決溢膠與 平整性人佳之f摘’進而提升製作該發光二鋪驗之良率。 在藉由上述之本發明實施例可知，本發明確具產業上之利 用仏^。惟以上之實施例說明，僅為本發明之較佳實施例說 明、，舉凡所屬技術領域中具有通常知識者當可依據本發明之 j實施规_作其它麵之改良及變化。細這些依據 本發明實施例所作的種種改良及變化，#仍屬於本發明之發 明精神及界定之專利範圍内。 12 1310992 【圖式簡單說明】 第一圖係顯示習知七段顯示器之示意圖； 第二圖係第一圖中2-2剖面之剖面圖； 第三圖係顯示本發明較佳實施例之示意圖； 第四圖係顯示第三圖中4-4剖面之剖面圖； 第五圖係顯示顯示板上電路之配置方式示意圖， 第六圖係顯示板下電路包覆有絕緣封裝膠片之示意圖。 【主要元件符號說明】 100 七段顯示器 1 封裝板件 11 板件本體 12 透光區域 2 電路載板 21 載板本體 22 板上電路 23 板下電路 24 導電元件 3 LED 4 封膠層 200 七段顯示器 5 封裝板件 6 電路載板 61 載板本體 611 上表面 13 1310992The iS property enables the hair mold S after the completion of the packaging operation to utilize the second module, which is connected to the 8 1310992 group and has a higher thermal conductivity. Another object of the present invention is to provide a light-emitting diode module that utilizes a heat-resistant package plate member and a low-motion thermal conductive adhesive to package the LED and its connection circuit, thereby enabling the LED module to be illuminated. The group was able to be flattened without the problem of poor glue and poor flatness. The technical means for solving the problem of the present invention: The technical means for solving the problems of the prior art is to provide a light emitting diode module comprising a circuit carrier board and a package board member at least one light emitting diode ( Light Emitting Diode; hereinafter referred to as LED) and a hot glue. The circuit carrier board is provided with a carrier body, and an upper circuit and a lower & surface are respectively provided with an on-board circuit and a lower-board circuit, and the on-board circuit combines the LED and communicates with the lower-board circuit. The package board is composed of a high temperature resistant polymer material, is formed by a cutting and milling method, and has at least one light transmissive area. When the package board covers the circuit carrier board, the LED system corresponds to the Light transmission area. The thermal conductive adhesive is composed of an aluminum oxide (Al2〇3)-based polymer material having high temperature resistance, heat conduction and low flow characteristics, and is used for covering the package board to the upper surface of the circuit carrier. The LED that is coupled to the on-board circuit is packaged between the package board and the circuit carrier after the application of a high temperature bonding process. 〃 The present invention compares the effects of the prior art: ^ Compared with the packaging technology of the existing light-emitting diode module, the present invention particularly uses a heat-resistant polymer material plate to be cut into a packaged plate member to replace the conventional plastic injection molding. The package board of the process 'is greatly reduced the thickness of the package plate of the LED module by 3.5mm to 5mm for self-study to about 0.4mm of the invention, and the overall thickness of the LED module is about Only 0.51mm to 0.61mm' makes it easy to fit into thin and light circuits and is widely used in a variety of ultra-thin board circuits (such as the MRT card or the chip financial card). 9 1310992 At the same time, due to the combination of the package component and the thermal adhesive, the light-emitting diode provided by the present invention is fine and: after the test, it is found that the light-emitting diode 3〇〇C is not melted. Wide $ about 250 Χ: ~28 (about TC) lead-free process. The door is made up of 4! The thermal conductivity polymer material is composed of 导热 ΐ ΐ ίί which has the basic heat conduction effect of at least G.4W, so Z is sure that the first Γ first body module is in a high temperature working environment, and its internal Electronic components and circuits can still maintain a certain level of operational stability from τίϊ: Since the chelating gel is composed of low-flow polymer materials, the single bismuth module can be packaged flatly. The problem of i sexuality ^ then raises the yield of the light-emitting diode. In order to further understand the features and technical contents of the present invention, the following detailed description and drawings of the present invention are provided. [Embodiment] The light-emitting diode (LED) module of the present invention is widely applicable to a variety of module circuits and electronic devices, and the combined implementation thereof is also numerous. Therefore, the description of the embodiment of the seven-segment display is used to represent the LED module. Referring to the third and fourth figures, the third drawing shows a preferred embodiment of the present invention, and the fourth drawing shows a cross-sectional view taken along line 4-4 of the third figure. As shown, a seven-segment display state includes a package board $, a circuit board 6, eight LEDs 7, and a thermal paste 8. The package board 5 is provided with a plate member 51 and eight light-transmissive regions 12 corresponding to the LEDs 3 (including the display points of the seven display line segments and the lower right corner shown in the figure). The circuit board 6 is provided with a carrier body 61. The upper surface 611 and the lower surface 612 of the carrier body 61 are respectively provided with an on-board circuit 62 and a board power-off 1310992 5 = ίίϊι circuit 62 and the board-down circuit 63 The conductive elements 64 i_L are electrically connected to each other. Eight LEDs 3 are coupled to the = circuit 62. In addition, the circuit carrier board sealing sheet 65 and the core secret ^: the second board circuit 62, the carrier board body 6 board τ circuit 63 and the endurance _ (such as FR-5 i, m ceramic material) After cnc is cut or drilled, L, ED 7 # domain 52 is a reserved hole penetrating through the plate body 51, eight: is integrated on the on-board circuit 62, and 61 of the seven-segment display 200 is performed. When the ij is, the county board 5 is covered on the carrier body 611 of the circuit carrier board 6. At this time, each of the transparent areas 62 of the package board 5 must be corresponding to the corresponding position of the T7. Then, using a high-temperature, dynamic-resistant trioxide (3)-based polymer material, 6 Na 8 is bonded to the carrier board 5 and the carrier board 6 of the circuit board 6 Between, and give a high _ joint process. Finally, a second oxygen strip or other light transmissive material is bonded to the eight predetermined holes to form eight light-transmissive sections 12 of the package led 3. Refer to continue to refer to (4) five and sixth diagrams, and - and refer to the third diagram and the fifth rib of the fifth diagram to show the layout of the circuit on the display panel, the sixth diagram is not covered with an insulating package Film show ·. As shown in the figure, the outer edge of the circuit 62 is provided with eight high potential pins A, B, D, ancient, F, G, I and j' and two low potential pins c and n. Among them, four zeta potentials,? A, B, d and the lanthanum are respectively connected via the four LEDs 7 in the upper half, and the relative positions of the light-transmitting regions 52 in the upper half of the figure are arranged in a straight position, which is shown in the figure) Connected to the low potential pin C. Similarly, the T potential pins F, G, 1 and J are respectively passed through the lower half of the LED 7 (bit 'f, the relative position of the light-transmitting region 52 in the lower half of the figure, the position is not straight), In the figure), it is connected to the low potential connection H. The lower circuit 63 1310992 ^ most of the area is covered by the insulating (four) piece 65 to the high potential pins A, B, D, E , F, G, 1 disk; outer boring tool = bit pin C and ίί. And the low-profile Ϊΐ Ϊΐ Ϊΐ Ϊΐ 具有 具有 具有 具有 具有 具有 具有 具有 具有 模组 模组 模组 模组 模组 模组 模组 模组 模组 模组 模组 模组Invented Department __ The 敎 2 ί plate is applied to the CNC cutting or drilling method to make the ^ ^ H ' _ L branch can make the thickness of the package board can be controlled in 〇. 4 Cong, ^ 2 light two The overall thickness of the polar body module can be controlled by α5ι_ ^ thin Γ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ 发光 发光 发光 发光 、 、 发光 、 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 发光 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰w with fii in the package component solution __ heat-resistant private material:: The light-emitting diode module provided by the invention can withstand higher work t after the inventor test, found The light-emitting diode module can withstand the high-temperature (the general working degree of about 250C~28 (about TC) of the ship-like lion's high-temperature process. 2 In the heat of the county, the conductive polymer material The composition has a thermal conductivity of at least the base of the can, so that the internal components and circuits of the LED module can maintain a certain level of operational stability under high temperature working conditions. The thermal adhesive is composed of a low-flowing polymer material, and the amount of the paving is evenly mixed, and there is a bribe and a flatness, and the yield of the illuminating second inspection is improved. The embodiments of the present invention described above are applicable to the present invention. However, the above embodiments are merely illustrative of the preferred embodiments of the present invention, and those of ordinary skill in the art may Modifications and variations of other aspects of the present invention are further improved and varied in accordance with the embodiments of the present invention, which are still within the scope of the inventive concept and defined patents of the present invention. 12 1310992 BRIEF DESCRIPTION OF THE DRAWINGS The first figure shows a schematic view of a conventional seven-segment display; the second figure is a cross-sectional view taken along line 2-2 in the first figure; the third figure shows a schematic view of a preferred embodiment of the present invention; The cross-sectional view of the section 4-4 in the third figure is shown; the fifth figure shows the arrangement of the circuit on the display panel, and the sixth figure shows the schematic diagram of the circuit under the board covered with the insulating package film. 100 Seven-segment display 1 Package board 11 Board body 12 Transmissive area 2 Circuit carrier board 21 Carrier board body 22 Board circuit 23 Subboard circuit 24 Conductive component 3 LED 4 Sealant layer 200 Seven-segment display 5 Package board 6 Circuit carrier board 61 carrier board body 611 upper surface 13 1310992
612 下表面 62 板上電路 63 板下電路 64 導電元件 65 絕緣封裝膠片 66 定位孔 7 LED 8 導熱膠 A、B、D、E、F、G、I、J 高電位接腳 C、Η 低電位接腳 14612 lower surface 62 on-board circuit 63 under-board circuit 64 conductive element 65 insulating package film 66 positioning hole 7 LED 8 thermal adhesive A, B, D, E, F, G, I, J high potential pin C, Η low potential Pin 14