JP2012509592A - 灰化方法及び装置による基板工程プラズマ - Google Patents
灰化方法及び装置による基板工程プラズマ Download PDFInfo
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
- H01L21/30655—Plasma etching; Reactive-ion etching comprising alternated and repeated etching and passivation steps, e.g. Bosch process
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
- H01L21/31138—Etching organic layers by chemical means by dry-etching
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
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Abstract
Description
本発明はプラズマ灰化により、半導体基板から有機物質を効率的に除去する手段を提供する基板工程(FEOL)に関する。工程中の基板の酸化および浸食を防止でき、酸素及び窒素の混合ガスのプラズマから算出される活性酸素及び活性窒素の比率よりも、本発明のプラズマ灰化による活性酸素及び活性窒素の比率は、実質的に大きい。
本発明は酸素(O2 )及び窒素(N2 )の混合ガスのプラズマから得られた活性窒素及び活性酸素の比率よりも実質的に大きい活性窒素及び活性酸素の比率をプラズマ中で提供する工程と装置に関する。
図1は酸素ガス(O2 )及び窒素ガス(N2 )から形成された従来技術のプラズマと、本発明に従って形成されたプラズマとにおける、活性酸素に対する活性窒素の量の比較を示す棒グラフである。酸素ガス及び窒素ガスの従来技術のプラズマから算出される活性酸素に対する活性窒素の量よりも、本発明における活性酸素に対する活性窒素の量のほうが実質的に大きい。
ここでは、基板からフォトレジスト、埋没したフォトレジスト、高分子、残留物及び/又は有機材料を選択的に除去するためのプラズマを用いた灰化方法及び装置について開示する。ここで述べるように、プラズマを用いた灰化方法及び装置は、多くの利点とともに、下層材料(例えば高い誘電率を有する材料)について比較的高い灰化率、損失及び損傷を最小又はゼロ、並びにドーパント分布の変化を最小又はゼロにすることを提供する。結果として、ここで述べるプラズマを用いた灰化方法及び装置は、フォトレジスト除去工程で電気的特性を実質的に変化させる必要なく基板損失を最小(0.3オングストローム以下)に保たなければならない32ナノメートル以上の基板工程に適している。
本実施例において、シリコン基板上にコーティングされているフォトレジストは、Axcelis Technologies, Inc.から商業的に入手できるRpS320プラズマ灰化機器内にて、化学的に放出された一酸化二窒素にさらされた。フォトレジストはi線フォトレジストであり、Fuji Companyから商業的に入手できる商品名10iで、1.9ミクロンの厚さでシリコン基板上に設置された。プラズマ化学は、一酸化二窒素を7標準L/mim(slm)の流速で、圧力1トール、温度240℃、電力3500ワットで、プラズマ装置内で形成された。
本実施例においては、様々なプラズマに少量のCF4 を添加して、RpS320プラズマ灰化装置内で処理した。シリコン基板を様々なプラズマ化学にさらして、酸化成長を測定した。その結果は下記の表1に示している。それぞれの例では、圧力1トール、240℃及び電力3500ワットの設定におけるプラズマ灰化装置に混合ガスの流速7slmで送り込み、それぞれのプラズマを形成した。表に示した通り、プラズマ灰化装置内を流れたCF4 の量は、20cm3 /mim(sccm)であった。
本実施例においては、RpS320プラズマ灰化装置を使用して、一酸化二窒素から形成されるプラズマについてのシリコン損失、酸化成長及び酸化損失の観点から基板損失を測定し、少量のテトラフルオロカーボンを含有する場合及び含有しない場合における、O2 /フォーミングガスの混合ガスから形成される先行技術のプラズマと比較した。フォーミングガス組成物は窒素ガス中に3%の水素ガスを含む。その結果は図5Aにてグラフを用いて示されている。それぞれの例では、圧力1トール、240℃及び電力3500ワットの設定におけるプラズマ灰化装置に混合ガスの流速7slmで送り込み、それぞれのプラズマを形成した。プラズマ灰化装置内を流れるCF4 の量は、20cm3 /mim(sccm)であった。基板の損傷としては、(i)シリコン・オン・インシュレーター(SOI)からのシリコン損失、(ii)むき出しの試験用ウェハ上のシリコン−酸化成長及びシリコン熱酸化試験ウェハからのシリコン−酸化損失が含まれていた。パネル(b)及び(c)は、p−MOS高ドースイオン埋め込みクリーニング装置のポストの走査型電子顕微鏡画像を比較したものである。SEM画像は、O2 及びN2 /H2 の混合ガスから形成されたプラズマ(c)、並びに一酸化二窒素ガスから形成されるプラズマによる除去を行ない、脱イオン水による洗浄を行った後のものを示している。一酸化二窒素の混合ガスからのプラズマの残留物除去能力の方が実質的に改善されていることを示している。
本実施例においては、一酸化二窒素ガス、フォーミングガス(3%H2 、97%N2 )、酸素ガス(90%)及びフォーミングガス(10%)並びに高濃度の水素ガスを有するフォーミングガス(90%H2 及び10%N2 )から形成される種々のプラズマを用いて、プラズマ工程間でのドーパント損失、基板損失及び灰化率を観測した。ガス流速7slm及びマイクロ波電力3500ワットですべてのプラズマを形成した。プラズマ工程間は240℃で基板を加熱した。シリコン酸化工程の時間は5分間であった。レジスト除去を決定する工程時間は8〜15秒であった。ドーパント分布試験のため、覆われたシリコンウェハは2keVのエネルギー及び5.0E14のドースでAs又はBF2 を埋め込んだ。ウェハを5分間、様々な灰化プラズマにさらし、10秒間、1050℃で焼きなました。ドーパントの外形を決定するために二次イオン質量スペクトル(SIMS)分析を行ない、また、シート抵抗を測定するためにシート抵抗(Rs)測定を行った。結果を図6にグラフに示す。
本実施例においては、活性窒素を高濃度に構成した場合の効果について示す。サファイア管(活性窒素を高める構成)を有するRpS320プラズマ源を構成することにより、石英管(活性窒素を高める構成は無い)で構成した場合に比べて、シリコン酸化が減少するという結果を示した(図7)。この典型的な窒素を高める構成(石英プラズマ管に対するサファイアプラズマ管)は活性窒素を増加するという結果を示した一方、活性酸素の量は実質的に変化しないままで、活性酸素に対する活性窒素の比率は増加させたことを、図8は示している。図7は、最適化されたマイクロ波電力、温度及び実質的にシリコン酸化を減らすことを示すプラズマ管構成からなる一酸化二窒素プラズマにとって最適化された構成を更に示している。
本実施例においては、90%酸素ガス及び10%フォーミングガス(3%H2 /97%N2 )から形成した通常のプラズマ工程と比較した一酸化二窒素から形成したプラズマを分析するために、発光スペクトルを用いた。それぞれのガスからのプラズマを3500ワット及びガス流速7slmでRpS320内にて形成した。プラズマの光学発光は、ウェハレバーでのプロセスチャンバ上にあるのぞき窓を通じて、オーシャン・オプティクス(Ocean Optics)の光学発光分光計を用いて集められた。
本実施例においては、一酸化二窒素から形成されたプラズマに対するマイクロ波プラズマと活性酸素に対する活性窒素の比率との関係を測定するために、光学発光スペクトルを用いた。RapidStrip320灰化装置を用いて、プラズマ化学を、プラズマ灰化装置内を圧力1.0トール及び温度240℃、一酸化二窒素ガスの流速を7標準L/mim(slm)にして形成した。図10で示されている通り、マイクロ波電力の低下に応じて、比率が増加し、また比率1.2が、2.5kWのもっとも低い設定で確認された。実験した一酸化二窒素プラズマ条件下におけるシリコン表面酸化の相対量については、活性プラズマ窒素及び活性酸素の比率に対するシリコン酸化の量が良い相関であることを示している。
本実施例においては、(i)一酸化二窒素ガス、(ii)CF4 を添加物として含む一酸化二窒素ガス、(iii)90%酸素ガス及び10%フォーミングガス(3%H2 /97%N2 )の混合ガス、及び、(iv)90%酸素ガス及び10%窒素ガスの混合ガスのそれぞれから形成されるプラズマの、活性酸素に対する活性窒素の比率を測定するために、光学発光スペクトルを用いた。説明のため、図11に示されているそれぞれのプラズマについての活性酸素及び活性窒素の測定量を、O2 +N2 プラズマにおける測定値を反映させるために標準化した。活性酸素に対する活性窒素の比率は、一酸化二窒素ガス混合物から形成されるプラズマによる値は実質的により高く、O2 及びFGガス混合物から形成されるプラズマによる値は実質的により低いものである。これは、初期に報告されたシリコン酸化の量とよく相関している。活性酸素の量は四つの評価されたプラズマすべてで比較的似ていること、及びプラズマの活性窒素の量に顕著な違いがあることは言及するに値する。
本実施例においては、図12は、酸化プラズマに対して、電子温度に対するシリコン酸化の量をグラフで表したものである。90%酸素ガス及び10%フォーミングガスから形成されたプラズマは、プラズマの電子温度が上昇するにつれ、シリコン酸化が指数関数的に増加していることを示している。シリコン酸化を低くするには、約5.0電子ボルト以下の電子温度に保つ必要がある。
Claims (37)
- 反応チャンバ内に、フォトレジスト、高分子及び/又は残留物を含んでいる基板を設置する工程と、
酸素ガス及び窒素ガスの混合物から形成されるプラズマから算出される活性酸素に対する活性窒素の比率よりも大きい、活性酸素に対する活性窒素の比率を有するプラズマを、酸素元素及び窒素元素を含む混合ガスから形成する工程と、
上記基板からフォトレジスト、高分子及び/又は残留物を選択的に取り除くために、上記基板をプラズマにさらす工程と、
を含む、フォトレジスト、埋没したフォトレジスト、高分子及び/又は残留物を上記基板から除去する、基板工程(front end of line) のプラズマ灰化方法。 - 少なくとも一つの上記酸素元素及び窒素元素を含む混合ガスが、一酸化二窒素である、請求項1に記載の基板工程の灰化方法。
- 活性窒素の生成を増進させる触媒に、上記酸素元素及び窒素元素を含む混合ガスをさらす工程を含む、請求項1に記載の基板工程の灰化方法。
- 活性窒素の生成を増進させるためのガスを、上記酸素元素及び窒素元素を含む混合ガスに加える工程を含む、請求項1に記載の基板工程の灰化方法。
- 石英によって形成されているプラズマ管内で、プラズマを発生させる工程を含む、請求項1に記載の基板工程の灰化方法。
- 上記混合ガス中の活性酸素の量を減らすためのフィルターに、プラズマを通過させる、請求項1に記載の基板工程の灰化方法。
- 上記混合ガス中の活性酸素の量を減らすためのゲッタリング剤に、プラズマをさらす工程を含む、請求項1に記載の基板工程の灰化方法。
- 活性窒素の生成を増進させるために、プラズマ及び上記基板を収容しているチャンバ内の圧力を減らす工程を含む、請求項1に記載の基板工程の灰化方法。
- 上記酸素元素及び窒素元素を含む混合ガスを、無線周波エネルギーにさらしてプラズマを形成する工程を含む、請求項1に記載の基板工程の灰化方法。
- 上記酸素元素及び窒素元素を含む混合ガスを、極超短波エネルギーにさらしてプラズマを形成する工程を含む、請求項1に記載の基板工程の灰化方法。
- 上記基板をプラズマにさらす工程の前に、反応種から実質的に全ての荷電粒子を除去する工程を含む、請求項1に記載の基板工程の灰化方法。
- プラズマが5電子ボルト以下の電子を有する、請求項1に記載の基板工程の灰化方法。
- 上記混合ガスがさらにCF4 を含んでいる、請求項2に記載の基板工程の灰化方法。
- 反応チャンバ内にフォトレジスト、高分子及び/又は残留物を含んでいる基板を設置する工程と、
プラズマを発生させる工程と、
上記基板からフォトレジスト、高分子及び/又は残留物を選択的に取り除くために、酸素ガスと窒素ガスの混合物から形成されるプラズマから算出される活性窒素及び活性酸素の比率よりも大きい活性窒素及び活性酸素の比率を有するプラズマに、上記基板をさらす工程と、
を含む、フォトレジスト、高分子及び/又は残留物を上記基板から除去する、基板工程のプラズマ灰化方法。 - 活性酸素と比較して活性窒素の方の生成を増進させる触媒に、上記プラズマをさらして、酸素ガス及び窒素ガスを含む混合ガスのプラズマから得られる活性窒素及び活性酸素の比率より大きい活性酸素及び活性窒素の比率を有するプラズマを形成する、請求項14に記載の基板工程の灰化方法。
- プラズマを発生させるための混合ガスに、ガスを加えることで、酸素ガス及び窒素ガスを含む混合ガスのプラズマから算出される活性窒素及び活性酸素の比率より大きい活性酸素及び活性窒素の比率を有するプラズマを形成する、請求項14に記載の基板工程の灰化方法。
- 上記基板をプラズマにさらす前に、プラズマ内の活性酸素の量を減らすために、プラズマをフィルターにさらすことで、酸素ガス及び窒素ガスを含む混合ガスのプラズマから算出される活性窒素及び活性酸素の比率より大きい活性酸素及び活性窒素の比率を有するプラズマを形成する、請求項14に記載の基板工程の灰化方法。
- 上記基板をプラズマにさらす前に、プラズマ内の活性酸素の量を減らすためのゲッタリング剤に、プラズマをさらすことで、酸素ガス及び窒素ガスを含む混合ガスのプラズマから算出される活性窒素及び活性酸素の比率より大きい活性酸素及び活性窒素の比率を有するプラズマを形成する、請求項14に記載の基板工程の灰化方法。
- プラズマ及び基板を収容している反応チャンバ内の圧力を、活性酸素に対して活性窒素の生成を高めるために効果的な圧力に減少させることで、酸素ガス及び窒素ガスを含む混合ガスのプラズマから算出される活性窒素及び活性酸素の比率より大きい活性酸素及び活性窒素の比率を有するプラズマを形成する、請求項14に記載の基板工程の灰化方法。
- 上記基板をプラズマにさらす前に、プラズマを石英製の調整板(バッフル;baffle)に接触させることで、酸素ガス及び窒素ガスを含む混合ガスのプラズマから算出される活性窒素及び活性酸素の比率より大きい活性酸素及び活性窒素の比率を有するプラズマを形成する、請求項14に記載の基板工程の灰化方法。
- 酸素ガス及び窒素ガスを含む混合ガスのプラズマから算出される活性窒素及び活性酸素の比率より大きい活性窒素及び活性酸素の比率を含んでいるプラズマを、石英によって形成されているプラズマ管内で形成する、請求項14に記載の基板工程の灰化方法。
- 酸素ガス及び窒素ガスからなる混合ガスのプラズマから算出される活性窒素及び活性酸素の比率より大きい活性窒素及び活性酸素の比率を含んでいるプラズマを、酸素元素及び窒素元素の両方を含む少なくとも一つのガスを含む混合ガスで形成する、請求項14に記載の基板工程の灰化方法。
- プラズマが5電子ボルト以下の電子温度を有する、請求項14に記載の基板工程の灰化方法。
- 少なくとも一つの上記酸素元素及び窒素元素を含む混合ガスが一酸化二窒素である、請求項22に記載の基板工程の灰化方法。
- 窒素元素を含むガスが窒素のとき、酸素元素を含むガスが酸素でなく、及び酸素元素を含むガスが酸素のとき、窒素元素を含むガスが窒素でない、という条件で、混合ガスが窒素元素を含むガス及び酸素元素を含むガスを含む、請求項22に記載の基板工程の灰化方法。
- プラズマを形成するための、プラズマ形成構成物であって、酸素ガス及び窒素ガスの混合物が形成するプラズマから算出される活性窒素及び活性酸素の比率よりも大きい活性窒素及び活性酸素の比率を有するように構成されているプラズマ形成構成物と、
プラズマ形成構成物とを流動的に接続しており、基板を収容しているプロセスチャンバと、
上記基板にプラズマをさらす前に、プラズマから活性酸素を除去するように構成されている、プラズマ及び上記基板を仲介する物質と、
を備える、フォトレジスト、高分子、及び/又は残留物を基板から灰化するためのプラズマ装置。 - 上記物質がゲッタリング剤である、請求項26に記載のプラズマ装置。
- 上記物質が、表面再結合フィルター、触媒フィルター及び気相再結合フィルターからなる群より選択される一つである、請求項26に記載のプラズマ装置。
- フィルターが酸化アルミニウムセラミックス又はサファイアから形成されている、請求項26に記載のプラズマ装置。
- プラズマを形成するためのプラズマ形成構成物と、
基板を収容しており、上記プラズマ形成構成物と流動的に接続しているプロセスチャンバと、
プラズマ内の活性窒素の量を高める、プラズマ及び基板を媒介する物質と、
を備える、フォトレジスト、高分子及び/又は残留物を基板から灰化するためのプラズマ装置。 - 上記物質が触媒である、請求項30に記載のプラズマ装置。
- 5電子ボルト以下の電子温度を有する、請求項30に記載のプラズマ装置。
- 別々のプラズマ発生域と流動的に接続している、少なくとも二つの独立したガス供給源を有しているガス輸送部と、
基板に、混合されたプラズマをさらす前に別々のプラズマ発生域内で形成したプラズマを混合するために構成されている、上記別々のプラズマ発生域と流動的に接続している基板を収容しているプロセスチャンバと、
を備える、フォトレジスト、高分子、及び/又は残留物を基板から灰化するためのプラズマ装置。 - 窒素を含むガスを供給するためのガス供給源、及び、酸素を含むガスを供給するためのガス供給源の、少なくとも二つの独立したガス供給源を備える、請求項33に記載のプラズマ装置。
- 5電子ボルト以下の電子温度を有する、請求項33に記載の基板工程の灰化方法。
- プラズマを発生させるための第一ガスを輸送する第一ガス供給源と、
プラズマが、酸素ガス及び窒素ガスの混合物から形成するプラズマから算出される活性窒素及び活性酸素の比率よりも大きい活性窒素及び活性酸素の比率を有するように、活性窒素の生成を増進させるために、プラズマへ第二ガスを輸送する第二ガス供給源と、
を備える、フォトレジスト、高分子、及び/又は残留物を基板から灰化するためのプラズマ装置。 - 5電子ボルト以下の電子温度を有する、請求項36に記載の基板工程の灰化方法。
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- 2008-11-21 US US12/275,394 patent/US20100130017A1/en not_active Abandoned
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2009
- 2009-11-20 JP JP2011537435A patent/JP2012509592A/ja active Pending
- 2009-11-20 CN CN200980145871XA patent/CN102232243B/zh active Active
- 2009-11-20 EP EP09801835A patent/EP2347439A2/en not_active Withdrawn
- 2009-11-20 WO PCT/US2009/006270 patent/WO2010059252A2/en active Application Filing
- 2009-11-20 KR KR1020117014294A patent/KR20110095908A/ko not_active Application Discontinuation
- 2009-11-23 TW TW098139692A patent/TW201030798A/zh unknown
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CN110088882A (zh) * | 2016-12-14 | 2019-08-02 | 马特森技术有限公司 | 与快速热活化工艺相结合的使用等离子体的原子层刻蚀工艺 |
JP2020502794A (ja) * | 2016-12-14 | 2020-01-23 | マットソン テクノロジー インコーポレイテッドMattson Technology, Inc. | 急速熱活性化プロセスと連係した、プラズマを使用する原子層エッチングプロセス |
Also Published As
Publication number | Publication date |
---|---|
WO2010059252A2 (en) | 2010-05-27 |
CN102232243B (zh) | 2013-11-06 |
KR20110095908A (ko) | 2011-08-25 |
CN102232243A (zh) | 2011-11-02 |
US20100130017A1 (en) | 2010-05-27 |
EP2347439A2 (en) | 2011-07-27 |
WO2010059252A3 (en) | 2010-07-15 |
TW201030798A (en) | 2010-08-16 |
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