JP2012507601A5 - - Google Patents
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- Publication number
- JP2012507601A5 JP2012507601A5 JP2011534647A JP2011534647A JP2012507601A5 JP 2012507601 A5 JP2012507601 A5 JP 2012507601A5 JP 2011534647 A JP2011534647 A JP 2011534647A JP 2011534647 A JP2011534647 A JP 2011534647A JP 2012507601 A5 JP2012507601 A5 JP 2012507601A5
- Authority
- JP
- Japan
- Prior art keywords
- weight
- thermoplastic composition
- terephthalamide
- composition according
- hexamethylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US19779208P | 2008-10-30 | 2008-10-30 | |
| US61/197,792 | 2008-10-30 | ||
| PCT/US2009/061869 WO2010056489A2 (en) | 2008-10-30 | 2009-10-23 | Thermoplastic composition including thermally conductive filler and hyperbranched polyesteramide |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012507601A JP2012507601A (ja) | 2012-03-29 |
| JP2012507601A5 true JP2012507601A5 (enExample) | 2012-11-22 |
| JP5647134B2 JP5647134B2 (ja) | 2014-12-24 |
Family
ID=42101334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011534647A Expired - Fee Related JP5647134B2 (ja) | 2008-10-30 | 2009-10-23 | 熱伝導性フィラーおよび超分岐ポリエステルアミドを含む熱可塑性組成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8293831B2 (enExample) |
| EP (1) | EP2350193B1 (enExample) |
| JP (1) | JP5647134B2 (enExample) |
| KR (1) | KR20110084971A (enExample) |
| CN (1) | CN102203188B (enExample) |
| WO (1) | WO2010056489A2 (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080153959A1 (en) * | 2006-12-20 | 2008-06-26 | General Electric Company | Thermally Conducting and Electrically Insulating Moldable Compositions and Methods of Manufacture Thereof |
| KR20110079146A (ko) * | 2009-12-31 | 2011-07-07 | 제일모직주식회사 | 백색도, 열전도성 및 압출 성형성이 우수한 폴리아마이드계 수지 조성물 및 그 제조방법 |
| BR112013007553B1 (pt) | 2010-09-30 | 2020-01-07 | Ube Industries, Ltd. | Composição de resina de poliamida e artigo moldado compreendendo a mesma |
| US20120080640A1 (en) * | 2010-09-30 | 2012-04-05 | E.I. Du Pont De Nemours And Company | Thermally conductive resin composition |
| US20120153217A1 (en) * | 2010-12-20 | 2012-06-21 | E.I.Du Pont De Nemours And Company | Thermally conductive polymeric resin composition |
| US8741998B2 (en) | 2011-02-25 | 2014-06-03 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof |
| US8552101B2 (en) | 2011-02-25 | 2013-10-08 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof |
| EP2718371B1 (en) | 2011-06-09 | 2019-08-14 | Solvay Specialty Polymers USA, LLC. | Polyamides compositions featuring improved thermal stability |
| US8915617B2 (en) * | 2011-10-14 | 2014-12-23 | Ovation Polymer Technology And Engineered Materials, Inc. | Thermally conductive thermoplastic for light emitting diode fixture assembly |
| KR101457016B1 (ko) * | 2011-12-30 | 2014-11-03 | 제일모직주식회사 | 내습성 및 열전도성이 우수한 열가소성 수지 조성물 및 성형품 |
| US9227347B2 (en) | 2013-02-25 | 2016-01-05 | Sabic Global Technologies B.V. | Method of making a heat sink assembly, heat sink assemblies made therefrom, and illumants using the heat sink assembly |
| US11286372B2 (en) | 2013-08-28 | 2022-03-29 | Eaton Intelligent Power Limited | Heat sink composition for electrically resistive and thermally conductive circuit breaker and load center and method of preparation therefor |
| CN103724993B (zh) * | 2013-12-17 | 2016-04-27 | 浙江普利特新材料有限公司 | 一种快速吸水玻璃纤维增强尼龙6复合材料及其制备方法 |
| CN104672495B (zh) * | 2015-01-28 | 2017-08-25 | 深圳航天科技创新研究院 | 一种有机‑无机复合导热填料及其制备方法及其应用 |
| CN106147221B (zh) * | 2015-04-28 | 2018-12-18 | 株洲时代新材料科技股份有限公司 | 玻纤增强阻燃导热半芳香共聚尼龙复合材料及其制备方法 |
| KR101792338B1 (ko) * | 2015-08-28 | 2017-11-01 | 롯데첨단소재(주) | 열가소성 수지 조성물 및 이로부터 제조된 성형품 |
| CN106189223A (zh) * | 2016-08-18 | 2016-12-07 | 威海晨源分子新材料有限公司 | 一种基于超支化聚（酯‑酰胺）的高流尼龙及其制备方法 |
| CN107385545B (zh) * | 2017-06-26 | 2019-10-29 | 杭州师范大学 | 一种氧化石墨烯改性的共聚酯酰胺及其纤维的制备方法与应用 |
| CN107385542B (zh) * | 2017-06-26 | 2019-10-29 | 杭州师范大学 | 一种poss接枝氧化石墨烯改性的尼龙复合树脂及其纤维的制备方法与应用 |
| WO2021151850A1 (en) * | 2020-01-27 | 2021-08-05 | Basf Se | Thermoplastic polyamide molding compositions that resist heat |
| CN112745672B (zh) * | 2020-12-16 | 2022-06-14 | 金发科技股份有限公司 | 一种聚酰胺模塑组合物及其制备方法和应用 |
| CN112724667B (zh) * | 2020-12-16 | 2022-06-14 | 金发科技股份有限公司 | 一种聚酰胺模塑组合物及其制备方法和应用 |
| CN113257366B (zh) * | 2021-05-21 | 2024-01-26 | 中国矿业大学 | 一种支化度对超支化聚酯改性的纳米复合环氧树脂导热性影响的分子动力学模拟方法 |
| CN115418101A (zh) * | 2022-09-01 | 2022-12-02 | 浙江元盛塑业股份有限公司 | 一种利用超支化聚酯制备高导热pa66复合材料的方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2170593B (en) | 1985-02-01 | 1988-09-14 | Central Electr Generat Board | Temperature measurement |
| DE3667779D1 (de) | 1985-03-23 | 1990-02-01 | Nitto Boseki Co Ltd | Glasspinnfaden und verfahren zu seiner herstellung. |
| SE509240C2 (sv) | 1996-05-28 | 1998-12-21 | Perstorp Ab | Termoplastisk kompound bestående av en termoplastisk polymer bunden till en dendritisk eller hyperförgrenad makromolekyl samt komposition och produkt därav |
| JPH1017767A (ja) | 1996-07-02 | 1998-01-20 | Du Pont Kk | 高流動性ポリアミド樹脂組成物 |
| NL1007186C2 (nl) * | 1997-10-01 | 1999-04-07 | Dsm Nv | ß-hydroxyalkylamide groepen bevattend condensatiepolymeer. |
| FR2833604B1 (fr) * | 2001-12-17 | 2004-03-12 | Rhodianyl | Composition polymere thermoplastique comprenant un copolyamide hyperbranche, et articles realises a partir de cette composition |
| WO2003051993A1 (fr) * | 2001-12-17 | 2003-06-26 | Rhodianyl | Composition thermoplastique comprenant un additif polymere hyperbranche, articles realises a partir de ce materiau |
| US6818695B2 (en) * | 2002-05-20 | 2004-11-16 | 3M Innovative Properties Company | Extrudable thermoplastic compositions |
| JP2004059638A (ja) * | 2002-07-25 | 2004-02-26 | Kuraray Co Ltd | ポリアミド組成物 |
| DE10255044A1 (de) | 2002-11-26 | 2004-06-03 | Bayer Ag | Verwendung von verzweigten Fließhilfsmitteln in hochfließfähigen Polymerzusammensetzungen |
| US20040242737A1 (en) * | 2003-04-14 | 2004-12-02 | Georgios Topulos | Polyamide composition for blow molded articles |
| US20050176835A1 (en) * | 2004-01-12 | 2005-08-11 | Toshikazu Kobayashi | Thermally conductive thermoplastic resin compositions |
| DE102004051241A1 (de) * | 2004-10-20 | 2006-05-04 | Basf Ag | Fließfähige Polyamide mit hyperverzweigten Polyestern/Polycarbonaten |
| US20060293427A1 (en) * | 2005-06-10 | 2006-12-28 | Martens Marvin M | Thermally conductive polyamide-based components used in light emitting diode reflector applications |
| JP2007231051A (ja) * | 2006-02-27 | 2007-09-13 | Toray Ind Inc | 樹脂組成物およびそれからなる成形品 |
| US20090130471A1 (en) * | 2007-11-16 | 2009-05-21 | E.I. Du Pont De Nemours And Company | Thermally conductive plastic resin composition |
| US20100113669A1 (en) * | 2008-10-30 | 2010-05-06 | E.I. Du Pont De Nemours And Company | Thermoplastic composition including hyperbranched aromatic polyamide |
-
2009
- 2009-10-21 US US12/582,758 patent/US8293831B2/en not_active Expired - Fee Related
- 2009-10-23 CN CN200980143541.7A patent/CN102203188B/zh not_active Expired - Fee Related
- 2009-10-23 WO PCT/US2009/061869 patent/WO2010056489A2/en not_active Ceased
- 2009-10-23 JP JP2011534647A patent/JP5647134B2/ja not_active Expired - Fee Related
- 2009-10-23 EP EP09752571.1A patent/EP2350193B1/en not_active Not-in-force
- 2009-10-23 KR KR1020117012082A patent/KR20110084971A/ko not_active Withdrawn
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