JP2014503675A5 - - Google Patents

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Publication number
JP2014503675A5
JP2014503675A5 JP2013551427A JP2013551427A JP2014503675A5 JP 2014503675 A5 JP2014503675 A5 JP 2014503675A5 JP 2013551427 A JP2013551427 A JP 2013551427A JP 2013551427 A JP2013551427 A JP 2013551427A JP 2014503675 A5 JP2014503675 A5 JP 2014503675A5
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JP
Japan
Prior art keywords
aliphatic
carbon atoms
percent
weight
thermoplastic composition
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JP2013551427A
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English (en)
Japanese (ja)
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JP5916762B2 (ja
JP2014503675A (ja
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Priority claimed from PCT/US2012/023276 external-priority patent/WO2012106309A2/en
Publication of JP2014503675A publication Critical patent/JP2014503675A/ja
Publication of JP2014503675A5 publication Critical patent/JP2014503675A5/ja
Application granted granted Critical
Publication of JP5916762B2 publication Critical patent/JP5916762B2/ja
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JP2013551427A 2011-01-31 2012-01-31 溶融ブレンドされた熱可塑性組成物 Active JP5916762B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161437840P 2011-01-31 2011-01-31
US61/437,840 2011-01-31
PCT/US2012/023276 WO2012106309A2 (en) 2011-01-31 2012-01-31 Melt-blended thermoplastic composition

Publications (3)

Publication Number Publication Date
JP2014503675A JP2014503675A (ja) 2014-02-13
JP2014503675A5 true JP2014503675A5 (enExample) 2015-01-08
JP5916762B2 JP5916762B2 (ja) 2016-05-11

Family

ID=46577853

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013551427A Active JP5916762B2 (ja) 2011-01-31 2012-01-31 溶融ブレンドされた熱可塑性組成物

Country Status (6)

Country Link
US (1) US8691911B2 (enExample)
EP (1) EP2670805B1 (enExample)
JP (1) JP5916762B2 (enExample)
CN (1) CN103339201B (enExample)
BR (1) BR112013019343B8 (enExample)
WO (1) WO2012106309A2 (enExample)

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CN109334171B (zh) 2013-08-30 2022-03-29 康宁股份有限公司 轻量化、高刚度玻璃层叠结构
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EP3069872B1 (de) * 2015-03-17 2017-07-05 Evonik Degussa GmbH Mehrschichtverbund mit schichten aus teilaromatischen polyamiden
EP3069871B1 (de) 2015-03-17 2017-07-19 Evonik Degussa GmbH Mehrschichtverbund mit einer evoh-schicht
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US10350861B2 (en) 2015-07-31 2019-07-16 Corning Incorporated Laminate structures with enhanced damping properties
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JP6810565B2 (ja) * 2016-09-21 2021-01-06 三菱エンジニアリングプラスチックス株式会社 ポリカーボネート樹脂組成物
KR102652698B1 (ko) * 2017-09-20 2024-03-28 바스프 에스이 내열성 폴리아미드 조성물
US20210199909A1 (en) * 2017-10-20 2021-07-01 Dsm Ip Assets B.V. Optical fibre cable element and optical fiber cable construction comprising the same
KR101940418B1 (ko) * 2017-10-30 2019-01-18 롯데첨단소재(주) 폴리아미드 수지 조성물 및 이를 포함하는 성형품
US11577496B2 (en) 2017-12-31 2023-02-14 Lotte Chemical Corporation Polyamide resin composition and molded article comprising the same
KR102171421B1 (ko) 2017-12-31 2020-10-29 롯데첨단소재(주) 폴리아미드 수지 조성물 및 이를 포함하는 성형품
KR102198388B1 (ko) 2018-05-31 2021-01-05 롯데첨단소재(주) 폴리아미드 수지 조성물 및 이를 포함하는 성형품
CN110117415A (zh) * 2019-05-17 2019-08-13 山东广垠新材料有限公司 一种用于管道涂覆的聚酰胺材料的制备方法
CN110951073A (zh) * 2019-12-16 2020-04-03 山东东辰瑞森新材料科技有限公司 一种共聚尼龙612材料
WO2021231590A1 (en) * 2020-05-14 2021-11-18 Ascend Performance Materials Operations Llc Polyamide formulations for improved noise vibration and harshness
KR20220089301A (ko) * 2020-12-21 2022-06-28 현대자동차주식회사 자동차 내장재용 친환경 핫멜트 조성물
CN115260751B (zh) * 2022-09-27 2023-01-13 广东永鑫华新型材料有限公司 一种挤出级超韧尼龙的制备方法
WO2025081007A1 (en) * 2023-10-13 2025-04-17 Dupont Polymers, Inc. Thermoplastic polymer composition having enhanced sag resistance
WO2025184266A1 (en) * 2024-02-29 2025-09-04 Basf Se Polyamide compositions for improved damping performance

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