WO2016080151A1 - 高圧水素に触れる成形品用のポリアミド樹脂組成物およびそれを用いた成形品 - Google Patents
高圧水素に触れる成形品用のポリアミド樹脂組成物およびそれを用いた成形品 Download PDFInfo
- Publication number
- WO2016080151A1 WO2016080151A1 PCT/JP2015/080094 JP2015080094W WO2016080151A1 WO 2016080151 A1 WO2016080151 A1 WO 2016080151A1 JP 2015080094 W JP2015080094 W JP 2015080094W WO 2016080151 A1 WO2016080151 A1 WO 2016080151A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polyamide resin
- pressure hydrogen
- acid
- resin composition
- molded product
- Prior art date
Links
- 239000001257 hydrogen Substances 0.000 title claims abstract description 83
- 229910052739 hydrogen Inorganic materials 0.000 title claims abstract description 83
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 title claims abstract description 81
- 229920006122 polyamide resin Polymers 0.000 title claims abstract description 67
- 239000011342 resin composition Substances 0.000 title claims abstract description 35
- 239000004711 α-olefin Substances 0.000 claims abstract description 31
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims abstract description 29
- 239000005977 Ethylene Substances 0.000 claims abstract description 29
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims abstract description 27
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 claims abstract description 23
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims abstract description 16
- 125000001931 aliphatic group Chemical group 0.000 claims abstract description 12
- 150000001735 carboxylic acids Chemical class 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 30
- 238000000465 moulding Methods 0.000 claims description 20
- 125000004432 carbon atom Chemical group C* 0.000 claims description 14
- 230000003014 reinforcing effect Effects 0.000 claims description 9
- 150000002431 hydrogen Chemical class 0.000 claims description 8
- 239000002344 surface layer Substances 0.000 claims description 6
- 229910052796 boron Inorganic materials 0.000 claims description 2
- 238000011049 filling Methods 0.000 abstract description 20
- 238000002156 mixing Methods 0.000 abstract description 12
- 230000002950 deficient Effects 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 description 38
- 239000011347 resin Substances 0.000 description 38
- 239000000047 product Substances 0.000 description 25
- -1 Aliphatic diamines Chemical class 0.000 description 16
- 239000000835 fiber Substances 0.000 description 15
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 14
- 230000007547 defect Effects 0.000 description 13
- 229920001971 elastomer Polymers 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 9
- 239000008188 pellet Substances 0.000 description 9
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 239000005749 Copper compound Substances 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 150000001880 copper compounds Chemical class 0.000 description 6
- 239000000446 fuel Substances 0.000 description 6
- 238000001746 injection moulding Methods 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 6
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Chemical compound [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 description 6
- 239000004677 Nylon Substances 0.000 description 5
- 229920002292 Nylon 6 Polymers 0.000 description 5
- 239000012765 fibrous filler Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229920001778 nylon Polymers 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000004898 kneading Methods 0.000 description 4
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 229920000571 Nylon 11 Polymers 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229920006231 aramid fiber Polymers 0.000 description 3
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- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 2
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N 1-Heptene Chemical compound CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 2
- VQOXUMQBYILCKR-UHFFFAOYSA-N 1-Tridecene Chemical compound CCCCCCCCCCCC=C VQOXUMQBYILCKR-UHFFFAOYSA-N 0.000 description 2
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 2
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical compound CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 2
- ADOBXTDBFNCOBN-UHFFFAOYSA-N 1-heptadecene Chemical compound CCCCCCCCCCCCCCCC=C ADOBXTDBFNCOBN-UHFFFAOYSA-N 0.000 description 2
- GQEZCXVZFLOKMC-UHFFFAOYSA-N 1-hexadecene Chemical compound CCCCCCCCCCCCCCC=C GQEZCXVZFLOKMC-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N 1-nonene Chemical compound CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 2
- PJLHTVIBELQURV-UHFFFAOYSA-N 1-pentadecene Chemical compound CCCCCCCCCCCCCC=C PJLHTVIBELQURV-UHFFFAOYSA-N 0.000 description 2
- HFDVRLIODXPAHB-UHFFFAOYSA-N 1-tetradecene Chemical compound CCCCCCCCCCCCC=C HFDVRLIODXPAHB-UHFFFAOYSA-N 0.000 description 2
- DCTOHCCUXLBQMS-UHFFFAOYSA-N 1-undecene Chemical compound CCCCCCCCCC=C DCTOHCCUXLBQMS-UHFFFAOYSA-N 0.000 description 2
- PBLZLIFKVPJDCO-UHFFFAOYSA-N 12-aminododecanoic acid Chemical compound NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- CNPURSDMOWDNOQ-UHFFFAOYSA-N 4-methoxy-7h-pyrrolo[2,3-d]pyrimidin-2-amine Chemical compound COC1=NC(N)=NC2=C1C=CN2 CNPURSDMOWDNOQ-UHFFFAOYSA-N 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229910021595 Copper(I) iodide Inorganic materials 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical compound CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 229920000305 Nylon 6,10 Polymers 0.000 description 2
- BTZVDPWKGXMQFW-UHFFFAOYSA-N Pentadecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCC(O)=O BTZVDPWKGXMQFW-UHFFFAOYSA-N 0.000 description 2
- 229930182556 Polyacetal Natural products 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- 239000004959 Rilsan Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 239000004760 aramid Substances 0.000 description 2
- 239000010425 asbestos Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
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- 230000008901 benefit Effects 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- YEOCHZFPBYUXMC-UHFFFAOYSA-L copper benzoate Chemical compound [Cu+2].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 YEOCHZFPBYUXMC-UHFFFAOYSA-L 0.000 description 2
- RFKZUAOAYVHBOY-UHFFFAOYSA-M copper(1+);acetate Chemical compound [Cu+].CC([O-])=O RFKZUAOAYVHBOY-UHFFFAOYSA-M 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- LSXDOTMGLUJQCM-UHFFFAOYSA-M copper(i) iodide Chemical compound I[Cu] LSXDOTMGLUJQCM-UHFFFAOYSA-M 0.000 description 2
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 2
- QTMDXZNDVAMKGV-UHFFFAOYSA-L copper(ii) bromide Chemical compound [Cu+2].[Br-].[Br-] QTMDXZNDVAMKGV-UHFFFAOYSA-L 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- XBZSBBLNHFMTEB-UHFFFAOYSA-N cyclohexane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCCC(C(O)=O)C1 XBZSBBLNHFMTEB-UHFFFAOYSA-N 0.000 description 2
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- TVIDDXQYHWJXFK-UHFFFAOYSA-N dodecanedioic acid Chemical compound OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 description 2
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- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
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- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical compound [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 description 2
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- HSZCZNFXUDYRKD-UHFFFAOYSA-M lithium iodide Chemical compound [Li+].[I-] HSZCZNFXUDYRKD-UHFFFAOYSA-M 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- HNEGQIOMVPPMNR-NSCUHMNNSA-N mesaconic acid Chemical compound OC(=O)C(/C)=C/C(O)=O HNEGQIOMVPPMNR-NSCUHMNNSA-N 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
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- 239000012046 mixed solvent Substances 0.000 description 2
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- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
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- 229920006324 polyoxymethylene Polymers 0.000 description 2
- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 description 2
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- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
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- JHJLBTNAGRQEKS-UHFFFAOYSA-M sodium bromide Chemical compound [Na+].[Br-] JHJLBTNAGRQEKS-UHFFFAOYSA-M 0.000 description 2
- 235000009518 sodium iodide Nutrition 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
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- LPWUGKDQSNKUOQ-UHFFFAOYSA-N 12-ethyltetradec-1-ene Chemical compound CCC(CC)CCCCCCCCCC=C LPWUGKDQSNKUOQ-UHFFFAOYSA-N 0.000 description 1
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- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- DPQHRXRAZHNGRU-UHFFFAOYSA-N 2,4,4-trimethylhexane-1,6-diamine Chemical compound NCC(C)CC(C)(C)CCN DPQHRXRAZHNGRU-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
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- 229920005990 polystyrene resin Polymers 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910052903 pyrophyllite Inorganic materials 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000001175 rotational moulding Methods 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920006345 thermoplastic polyamide Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- KLNPWTHGTVSSEU-UHFFFAOYSA-N undecane-1,11-diamine Chemical compound NCCCCCCCCCCCN KLNPWTHGTVSSEU-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- F16L11/00—Hoses, i.e. flexible pipes
- F16L11/04—Hoses, i.e. flexible pipes made of rubber or flexible plastics
- F16L11/10—Hoses, i.e. flexible pipes made of rubber or flexible plastics with reinforcements not embedded in the wall
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B1/00—Layered products having a non-planar shape
- B32B1/08—Tubular products
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/06—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- F16L57/00—Protection of pipes or objects of similar shape against external or internal damage or wear
- F16L57/06—Protection of pipes or objects of similar shape against external or internal damage or wear against wear
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/04—Auxiliary arrangements, e.g. for control of pressure or for circulation of fluids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/18—Applications used for pipes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/06—Polymer mixtures characterised by other features having improved processability or containing aids for moulding methods
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/50—Fuel cells
Definitions
- the present invention relates to a polyamide resin composition for molded articles that are exposed to high-pressure hydrogen and a molded article formed by molding the same.
- a tank used for storage of hydrogen gas of a fuel cell electric vehicle for example, a metal end part, a polyamide resin liner surrounding the end part, and a fiber impregnated with a thermosetting resin surrounding the liner
- a tank including a structural layer has been studied (for example, see Patent Document 1).
- a hydrogen tank liner having excellent gas barrier properties and excellent impact resistance even at low temperatures for example, a hydrogen tank liner material made of a polyamide resin composition containing polyamide 6, copolymer polyamide, and an impact resistant material is molded.
- a hydrogen tank liner is being studied (for example, see Patent Document 2).
- the gas permeability coefficient of dry hydrogen gas at a temperature of 90 ° C. is 1 ⁇ 10 ⁇ 8 cc ⁇ cm / cm 2 ⁇ sec.
- a nylon resin having a cmHg or less is used, there is no detailed description of what kind of nylon resin is concrete.
- general nylon resins are not sufficiently flexible and heat cycle resistant to be used for hydrogen filling hoses.
- the present invention provides a polyamide resin that is excellent in flexibility and heat cycle resistance, and can obtain a molded product in which generation of defect points is suppressed even when high-pressure hydrogen filling and releasing are repeated. It is an object to provide a composition.
- the present invention has the following configuration.
- the present invention includes a molded article formed by molding the above polyamide resin composition and in contact with high-pressure hydrogen.
- the present invention includes a high-pressure hydrogen hose that is formed by molding the polyamide resin composition and is in contact with high-pressure hydrogen.
- the present invention includes a high-pressure hydrogen hose provided with a reinforcing layer on the outer side of an inner surface layer formed by molding the polyamide resin composition.
- the molded article has excellent flexibility and heat cycle resistance, and generation of defect points is suppressed even after repeated filling and releasing of high-pressure hydrogen.
- the molded product of the present invention is excellent in flexibility and heat cycle resistance, and is used as a molded product that is used for applications that come into contact with high-pressure hydrogen, taking advantage of the fact that defects do not easily occur even after repeated filling and releasing of high-pressure hydrogen. It becomes possible to develop usefully.
- polyamide resin composition for molded articles that is exposed to high-pressure hydrogen of the present invention
- polyamide resin composition includes at least a unit derived from hexamethylenediamine and an aliphatic dicarboxylic acid having 8 to 12 carbon atoms.
- Polyamide resin (A) containing an acid-derived unit hereinafter sometimes simply referred to as “polyamide resin (A)”
- a blend (B) hereinafter sometimes simply referred to as “ethylene / ⁇ -olefin copolymer (B)” is blended.
- the polyamide resin (A) containing a unit derived from hexamethylenediamine and a unit derived from an aliphatic dicarboxylic acid having 8 to 12 carbon atoms is excellent in moldability and gas barrier properties. Moreover, since it is excellent in a softness
- the polyamide resin (A) used in the present invention is a polyamide resin mainly composed of a unit derived from hexamethylenediamine and a unit derived from an aliphatic dicarboxylic acid having 8 to 12 carbon atoms. Other monomers may be copolymerized as long as the object of the present invention is not impaired.
- the term “main structural unit” refers to a unit derived from hexamethylenediamine and a unit derived from an aliphatic dicarboxylic acid having 8 to 12 carbon atoms in a total of 100 mol% of monomer units constituting the polyamide resin. It means that it contains 50 mol% or more in total.
- the unit derived from hexamethylenediamine and the unit derived from an aliphatic dicarboxylic acid having 8 to 12 carbon atoms are contained in an amount of 70 mol% or more, and more preferably 90 mol% or more.
- Examples of the aliphatic dicarboxylic acid having 8 to 12 carbon atoms include sebacic acid, suberic acid, azelaic acid, undecanedioic acid, and dodecanedioic acid. Two or more of these may be used. Of these, sebacic acid or dodecanedioic acid, which is excellent in the balance of crystallinity and strength of the obtained polyamide resin composition, is preferable, and sebacic acid is particularly preferable.
- Examples of other monomers to be copolymerized include amino acids such as 6-aminocaproic acid, 11-aminoundecanoic acid, 12-aminododecanoic acid and paraaminomethylbenzoic acid; and lactams such as ⁇ -caprolactam and ⁇ -laurolactam. ; Tetramethylenediamine, pentamethylenediamine, 2-methylpentamethylenediamine, undecamethylenediamine, dodecamethylenediamine, 2,2,4- / 2,4,4-trimethylhexamethylenediamine, 5-methylnonamethylenediamine, etc.
- amino acids such as 6-aminocaproic acid, 11-aminoundecanoic acid, 12-aminododecanoic acid and paraaminomethylbenzoic acid
- lactams such as ⁇ -caprolactam and ⁇ -laurolactam.
- Tetramethylenediamine pentamethylenediamine, 2-methylpentamethylenediamine
- Aliphatic diamines aromatic diamines such as metaxylenediamine and paraxylylenediamine; 1,3-bis (aminomethyl) cyclohexane, 1,4-bis (aminomethyl) cyclohexane, 1-amino-3-aminomethyl- 3,5,5-trimethylcyclohex Fats such as sun, bis (4-aminocyclohexyl) methane, bis (3-methyl-4-aminocyclohexyl) methane, 2,2-bis (4-aminocyclohexyl) propane, bis (aminopropyl) piperazine, aminoethylpiperazine Cyclic diamines; aliphatic dicarboxylic acids such as adipic acid, malonic acid, succinic acid, glutaric acid, pimelic acid, tetradecanedioic acid, pentadecanedioic acid, octadecanedioic acid; terephthalic
- the degree of polymerization of the polyamide resin (A) is not particularly limited, but the relative viscosity measured at 25 ° C. in a 98% concentrated sulfuric acid solution having a resin concentration of 0.01 g / ml is in the range of 1.5 to 7.0. Preferably there is.
- the relative viscosity is 1.5 or more, the viscosity of the polyamide resin composition becomes moderately high, air entrainment during molding can be suppressed, and moldability can be further improved.
- the relative viscosity is more preferably 1.8 or more.
- the relative viscosity is 7.0 or less, the viscosity of the polyamide resin composition is appropriately lowered, and the moldability can be further improved.
- the amount of amino terminal groups of the polyamide resin (A) is not particularly limited, but is preferably in the range of 1.0 to 10.0 ⁇ 10 ⁇ 5 mol / g.
- the amino terminal group amount is in the range of 1.0 to 10.0 ⁇ 10 ⁇ 5 mol / g, a sufficient degree of polymerization can be obtained, and the mechanical strength of the molded product can be improved.
- the amino terminal group of the polyamide resin (A) is prepared by dissolving the polyamide resin (A) in a phenol / ethanol mixed solvent (83.5: 16.5 (volume ratio)) and using a 0.02N aqueous hydrochloric acid solution. Can be obtained by titration.
- the ethylene / ⁇ -olefin copolymer (B) used in the present invention is an ethylene / ⁇ -olefin copolymer modified with an unsaturated carboxylic acid and / or a derivative thereof.
- the derivative of unsaturated carboxylic acid is a compound obtained by substituting the hydroxy group portion of the carboxyl group of unsaturated carboxylic acid with another substituent, and includes a metal salt, an acid halide, an ester, an acid of unsaturated carboxylic acid. Anhydrides, amides and imides.
- unsaturated carboxylic acids and / or derivatives thereof include acrylic acid, methacrylic acid, maleic acid, fumaric acid, itaconic acid, crotonic acid, methylmaleic acid, methylfumaric acid, mesaconic acid, citraconic acid, glutaconic acid, and the like.
- Metal salt of carboxylic acid methyl hydrogen maleate, hydrogen itaconic acid methyl, methyl acrylate, ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, hydroxyethyl acrylate, methyl methacrylate, 2-ethylhexyl methacrylate
- Unsaturated carboxylic acid esters such as hydroxyethyl methacrylate, aminoethyl methacrylate, dimethyl maleate, dimethyl itaconate; maleic anhydride, itaconic anhydride, citraconic anhydride, endobicyclo- (2,2,1) -5 Acid anhydrides such as butene-2,3-dicarboxylic acid, endobicyclo- (2,2,1) -5-heptene-2,3-dicarboxylic anhydride; maleimide, N-ethylmaleimide, N-butylmaleimide, N-phenylmaleimide, glycidyl
- an ethylene / ⁇ -olefin copolymer and an unsaturated carboxylic acid and / or derivative thereof are co-polymerized.
- examples thereof include a polymerization method and a method of grafting an unsaturated carboxylic acid and / or a derivative thereof into an unmodified ethylene / ⁇ -olefin copolymer using a radical initiator.
- the ethylene / ⁇ -olefin copolymer is preferably a copolymer of ethylene and an ⁇ -olefin having 3 to 20 carbon atoms.
- Specific examples of the ⁇ -olefin having 3 to 20 carbon atoms include propylene, 1-butene, 1-pentene, 1-hexene, 1-heptene, 1-octene, 1-nonene, 1-decene and 1-undecene.
- ⁇ -olefins having 3 to 12 carbon atoms are preferable from the viewpoint of improving mechanical strength.
- non-conjugated dienes such as 1,4-hexadiene, dicyclopentadiene, 2,5-norbornadiene, 5-ethylidene norbornene, 5-ethyl-2,5-norbornadiene, 5- (1′-propenyl) -2-norbornene At least one of these may be copolymerized.
- the ⁇ -olefin content of the ethylene / ⁇ -olefin copolymer is preferably 1 to 30 mol%, more preferably 2 to 25 mol%, still more preferably 3 to 20 mol%.
- the ethylene / ⁇ -olefin copolymer (B) is not particularly limited, but from the viewpoint of further improving the heat cycle resistance of the molded product obtained from the polyamide resin composition, the Shore of the molded product measured according to ASTM D2240-05. A hardness of 90 A or less is preferable, and 80 A or less is more preferable.
- the blending amount of the polyamide resin (A) and the ethylene / ⁇ -olefin copolymer (B) in the polyamide resin composition of the present invention is not particularly limited, but ethylene / A with respect to 100 parts by weight of the polyamide resin (A). It is preferable to blend 5 to 100 parts by weight of the ⁇ -olefin copolymer (B).
- the blending amount of the ethylene / ⁇ -olefin copolymer (B) By setting the blending amount of the ethylene / ⁇ -olefin copolymer (B) to 5 parts by weight or more, the flexibility and heat cycle resistance of the molded product can be further improved.
- the blending amount of the ethylene / ⁇ -olefin copolymer (B) is more preferably 80 parts by weight or less, further preferably 70 parts by weight or less, and most preferably 50 parts by weight or less.
- other components other than the component (A) and the component (B) may be blended as necessary within a range not impairing the characteristics.
- other components include fillers, thermoplastic resins other than the component (A), impact resistant materials other than the component (B), and various additives.
- the shape of the filler may be fibrous or non-fibrous, or a combination of fibrous filler and non-fibrous filler may be used.
- the fibrous filler include glass fiber, glass milled fiber, carbon fiber, potassium titanate whisker, zinc oxide whisker, aluminum borate whisker, aramid fiber, alumina fiber, silicon carbide fiber, ceramic fiber, asbestos fiber, and stone powder. Examples thereof include fibers and metal fibers.
- Non-fibrous fillers include, for example, silicates such as wollastonite, zeolite, sericite, kaolin, mica, clay, pyrophyllite, bentonite, asbestos, talc, alumina silicate; alumina, silicon oxide, magnesium oxide, oxidation Metal oxides such as zirconium, titanium oxide and iron oxide; metal carbonates such as calcium carbonate, magnesium carbonate and dolomite; metal sulfates such as calcium sulfate and barium sulfate; magnesium hydroxide, calcium hydroxide and aluminum hydroxide Metal hydroxide; glass beads, ceramic beads, boron nitride, silicon carbide and the like. These may be hollow.
- silicates such as wollastonite, zeolite, sericite, kaolin, mica, clay, pyrophyllite, bentonite, asbestos, talc, alumina silicate
- alumina silicon oxide, magnesium oxide, oxidation Metal oxides such as zircon
- these fibrous and / or non-fibrous fillers after pretreatment with a coupling agent from the viewpoint of obtaining more excellent mechanical properties.
- a coupling agent include isocyanate compounds, organic silane compounds, organic titanate compounds, organic borane compounds, and epoxy compounds.
- thermoplastic resins examples include polyamide resins other than the component (A), polyester resins, polyphenylene sulfide resins, polyphenylene oxide resins, polycarbonate resins, polylactic acid resins, polyacetal resins, polysulfone resins, tetrafluoropolyethylene resins, poly Examples include etherimide resins, polyamideimide resins, polyimide resins, polyethersulfone resins, polyetherketone resins, polythioetherketone resins, polyetheretherketone resins, styrene resins such as polystyrene resins and ABS resins, and polyalkylene oxide resins. It is done. It is also possible to blend two or more of such thermoplastic resins. In addition, when mix
- the impact resistant material examples include olefin resins other than the component (B), acrylic rubber, silicone rubber, fluorine rubber, styrene rubber, nitrile rubber, vinyl rubber, urethane rubber, polyamide elastomer, Examples include polyester elastomers and ionomers. Two or more of these may be blended.
- the structure of the impact-resistant material is not particularly limited.
- it may be a so-called core-shell type multilayer structure including at least one layer made of rubber and one or more layers made of different polymers.
- the number of layers constituting the multilayer structure may be two or more, and may be three or more or four or more, but preferably has one or more rubber layers (core layers) inside.
- the type of rubber constituting the rubber layer of the multilayer structure is not particularly limited.
- acrylic component, silicone component, styrene component, nitrile component, conjugated diene component, urethane component, ethylene component, propylene component, isobutene examples thereof include rubber obtained by polymerizing components.
- the kind of the different polymer constituting the layer other than the rubber layer of the multilayer structure is not particularly limited as long as it is a polymer having thermoplasticity, but there is a polymer having a glass transition temperature higher than that of the rubber layer. preferable.
- the polymer having thermoplasticity for example, an unsaturated carboxylic acid alkyl ester unit, an unsaturated carboxylic acid unit, an unsaturated glycidyl group-containing unit, an unsaturated dicarboxylic acid anhydride unit, an aliphatic vinyl unit, an aromatic vinyl unit, Examples thereof include polymers containing vinyl cyanide units, maleimide units, unsaturated dicarboxylic acid units and other vinyl units.
- additives include, for example, anti-coloring agents, antioxidants such as hindered phenols and hindered amines, mold release agents such as ethylene bisstearyl amide and higher fatty acid esters, plasticizers, heat stabilizers, lubricants, and UV inhibitors. , Colorants, flame retardants, foaming agents and the like.
- the copper compound include cuprous chloride, cupric chloride, cuprous bromide, cupric bromide, cuprous iodide, cupric iodide, cupric sulfate, cupric nitrate. , Copper phosphate, cuprous acetate, cupric acetate, cupric salicylate, cupric stearate, cupric benzoate and inorganic copper halides and xylylenediamine, 2-mercaptobenzimidazole, benzimidazole And complex compounds. Two or more of these may be blended.
- the compounding amount of the copper compound is preferably 0.01 parts by weight or more, more preferably 0.015 parts by weight or more with respect to 100 parts by weight of the polyamide resin (A).
- the amount of the copper compound is preferably 2 parts by weight or less, and more preferably 1 part by weight or less, from the viewpoint of suppressing coloration due to liberation of metallic copper during molding.
- alkali halide examples include lithium chloride, lithium bromide, lithium iodide, potassium chloride, potassium bromide, potassium iodide, sodium bromide and sodium iodide. Two or more of these may be blended. Potassium iodide and sodium iodide are particularly preferred.
- the method for producing the thermoplastic polyamide resin composition of the present invention is not particularly limited.
- the polyamide resin (A), the ethylene / ⁇ -olefin copolymer (B) and other components as necessary are kneaded together.
- the method etc. are mentioned.
- a kneading apparatus for example, a known kneading apparatus such as a Banbury mixer, a roll, or an extruder can be employed.
- a kneading apparatus for example, a known kneading apparatus such as a Banbury mixer, a roll, or an extruder can be employed.
- blending other components such as various additives into the polyamide resin composition of the present invention, these can be blended at any stage.
- the polyamide resin composition of the present invention is produced by a twin-screw extruder
- the polyamide resin (A) and the ethylene / ⁇ -olefin copolymer (B) are compounded
- a method of blending the polyamide resin (A) and the ethylene / ⁇ -olefin copolymer (B) with other components by a method such as side feed during the melt-kneading, or the polyamide resin (A) and the ethylene / ⁇ -olefin in advance is a twin-screw extruder
- the polyamide resin composition of the present invention is preferably used for molded articles that come into contact with high-pressure hydrogen.
- the molded product that is in contact with high-pressure hydrogen here is a molded product that is in contact with hydrogen at a pressure higher than normal pressure. Since it has the effect of suppressing the generation of defect points when repeated filling and releasing of high-pressure hydrogen, it is preferably used for molded products that come into contact with hydrogen at 20 MPa or more, and more preferably used for molded products that come into contact with hydrogen at 30 MPa or more. Used.
- a molded product application that comes into contact with hydrogen of 200 MPa or less is preferably used for a molded product application that comes into contact with hydrogen of 150 MPa or less, and is more preferably used for a molded product application that comes into contact with hydrogen of 100 MPa or less.
- the polyamide resin composition of the present invention can be molded by any method to obtain a molded product, and the molded shape can be any shape.
- the molding method include extrusion molding, injection molding, hollow molding, calendar molding, compression molding, vacuum molding, foam molding, blow molding, and rotational molding.
- the molded shape include shapes such as a pellet shape, a plate shape, a fiber shape, a strand shape, a film or sheet shape, a pipe shape, a hollow shape, and a box shape.
- the molded article of the present invention is superior in heat cycle resistance and takes advantage of the excellent feature that the occurrence of defects is suppressed even after repeated filling and releasing of high-pressure hydrogen.
- Stop valve High pressure hydrogen pressure reducing valve, High pressure hydrogen pressure regulating valve, High pressure hydrogen seal, High pressure hydrogen hose, High pressure hydrogen tank, High pressure hydrogen liner, High pressure hydrogen pipe, High pressure hydrogen packing, High pressure hydrogen pressure It can be suitably used for sensors, high-pressure hydrogen pumps, high-pressure hydrogen tubes, high-pressure hydrogen regulators, high-pressure hydrogen films, high-pressure hydrogen sheets, high-pressure hydrogen fibers, high-pressure hydrogen joints, and the like.
- the molded product of the present invention is excellent in both flexibility and heat cycle resistance, it can be suitably used as a high-pressure hydrogen hose.
- the high-pressure hydrogen hose is used as a hose for filling hydrogen gas from a hydrogen station to a fuel cell vehicle.
- High-pressure hydrogen hoses are required to be flexible, and are repeatedly subjected to temperature changes (heat cycle) from -40 ° C or lower to 90 ° C or higher due to repeated filling and releasing of high-pressure hydrogen. Is required.
- a hose provided with a reinforcing layer on the outer side of the inner surface layer formed by molding the polyamide resin composition of the present invention into a tube shape is preferable.
- the reinforcing layer on the outer side pressure resistance is improved while keeping the flexibility of the hose.
- what provided the weathering layer in the outermost layer is more preferable. Since the hydrogen station is often installed outdoors, deterioration of the high-pressure hydrogen hose can be prevented by having a weather resistant layer as the outermost layer.
- a cross-sectional view of such a hose is shown in FIG.
- a reinforcing layer 2 is provided outside the tubular inner layer 1 made of the polyamide resin composition of the present invention, and a weathering layer 3 is provided as the outermost layer.
- the material of the reinforcing layer is preferably an aramid fiber or polyparaphenylene benzbisoxazole fiber from the viewpoint of high pressure resistance and flexibility, and more preferably polyparaphenylene benzbisoxazole fiber from the viewpoint of higher pressure resistance.
- the reinforcing layer is preferably provided by concentrically covering the inner surface layer with these fibers.
- the material of the weather resistant layer examples include aramid fibers, polyester fibers, polyamide fibers, aramid resins, polyester resins, polyamide resins and the like.
- the weathering layer is preferably provided by concentrically covering the periphery of the reinforcing layer with these resins.
- the bending elastic modulus of the obtained molded product was evaluated at a temperature of 23 ° C. according to ASTM D790: 95. The average value of the three measured values was taken as the flexural modulus.
- the three obtained metal / resin composite molded products were allowed to stand at a temperature of ⁇ 45 ° C. for 1 hour, then allowed to stand at a temperature of 90 ° C. for 1 hour, and the composite molded product was visually observed to determine the presence or absence of cracks. This operation was repeated, and the number of cycles in which all three composite molded products were broken was set to A for 1500 times or more, B for 1200 to 1499 times, and C for 1199 times or less.
- the obtained 63.5 mm ⁇ 12.6 mm ⁇ 12.6 mm prismatic test piece was processed into a 5 mm ⁇ 5 mm ⁇ 5 mm cube by milling.
- the processed specimen was subjected to X-ray CT analysis using TDM1000-IS manufactured by Yamato Scientific Co., Ltd., and the presence or absence of defect points was observed.
- hydrogen gas was injected into the autoclave to 20 MPa over 5 minutes, held for 1 hour, and then decompressed to normal pressure over 5 minutes. This was repeated as 100 cycles for 100 cycles.
- test piece after 100 cycles was subjected to X-ray CT analysis using TDM1000-IS manufactured by Yamato Scientific Co., Ltd., and the presence or absence of a defect point of 1 ⁇ m or more was observed. Those with defect points were defined as “present”.
- the reaction product was discharged into a water bath and pelletized with a strand cutter to obtain polyamide 610 resin pellets.
- the obtained pellet was 3.5.
- dissolving the obtained pellet in a phenol-ethanol mixed solvent (83.5: 16.5 (volume ratio)) and titrating using 0.02N hydrochloric acid aqueous solution amino terminal group amount is 3.5x. It was 10 ⁇ 5 mol / g.
- PA6 Polyamide 6 resin (melting point 224 ° C., temperature drop crystallization temperature 175 ° C., relative viscosity 2.70 at 25 ° C.
- PA11 Polyamide 11 resin “Rilsan (registered trademark) BESN TL” (manufactured by ARKEMA)
- PA 6/66 Polyamide 6/66 resin ““ UBE nylon ”(registered trademark) 5034B” (manufactured by Ube Industries, Ltd.)
- Impact-resistant material 1 ethylene / ⁇ -olefin copolymer (B) modified with unsaturated carboxylic acid and / or derivative thereof): maleic anhydride modified ethylene / 1-butene copolymer “Toughmer” (registered trademark) ) MH7020 "(Mitsui Chemicals, Inc.) (Shore A hardness 70A)
- Impact-resistant material 2 Glycidyl methacrylate-modified polyethylene copolymer ““ Bond First ”(registered trademark) 7L” (manufactured by Sumitomo Chemical Co., Ltd.) (
- L is the length from the raw material supply port to the discharge port, D is the screw diameter
- the gut discharged from the die is heated to 5 ° C.
- the sample was quenched by passing it through a cooling bath filled with prepared water over 20 seconds, and pelletized with a strand cutter to obtain pellets.
- Table 1 shows the results of evaluation by the above method using pellets of polyamide 11 resin “Rilsan” (registered trademark) BESN TL (manufactured by ARKEMA).
- the polyamide resin (A) containing a unit derived from hexamethylenediamine and a unit derived from an aliphatic dicarboxylic acid having 8 to 12 carbon atoms and ethylene / ⁇ -modified with an unsaturated carboxylic acid and / or a derivative thereof are used.
- the molded product obtained by molding the polyamide resin composition obtained by blending the olefin copolymer (B) is excellent in flexibility and heat cycle resistance, and is defective even after repeated filling and releasing of high-pressure hydrogen. It was found that the generation of dots was suppressed.
- the polyamide resin composition of the present invention it is possible to obtain a molded article that is excellent in flexibility and heat cycle resistance and in which the occurrence of defect points is suppressed even when high-pressure hydrogen filling and releasing are repeated. Molded articles formed by molding the polyamide resin composition of the present invention can be widely used for molded articles that come into contact with high-pressure hydrogen utilizing these characteristics.
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Abstract
Description
ヘキサメチレンジアミン由来の単位と炭素数8~12の脂肪族ジカルボン酸由来の単位を含むポリアミド樹脂(A)および不飽和カルボン酸および/またはその誘導体で変性されたエチレン/α-オレフィン共重合体(B)を配合してなる、高圧水素に触れる成形品用のポリアミド樹脂組成物。
各実施例および比較例により得られたペレットを、住友重機械工業(株)製射出成形機(SE-75DUZ-C250)を用いて、金型温度80℃、射出速度100mm/秒、冷却時間20秒の成形条件で、厚さ1/8インチASTM D-790準拠の曲げ試験片を成形した。なお、射出成形機の温度は、ホッパ下から先端に向かって、230℃-235℃-240℃-240℃に設定した。
各実施例および比較例により得られたペレットを、住友重機械工業(株)製射出成形機(SE-75DUZ-C250)を用いて、金型温度80℃、射出速度100mm/秒、冷却時間20秒の成形条件で、48.6mm×48.6mm×28.6mmの金属コアに厚み0.7mmでオーバーモールドした。なお、射出成形機の温度は、ホッパ下から先端に向かって、250℃-255℃-260℃-260℃に設定した。
各実施例および比較例により得られたペレットから、住友重機械工業(株)製射出成形機(SG-75H-MIV)を用いて、金型温度80℃、射出速度10mm/秒、保圧10MPa、保圧時間10秒、冷却時間20秒の成形条件で、63.5mm×12.6mm×12.6mmの角柱試験片を射出成形した。なお、射出成形機の温度は、ホッパ下から先端に向かって、220℃-225℃-230℃-230℃に設定した。
ヘキサメチレンジアミンとセバシン酸の当モル塩を重合缶に投入し、投入した等モル塩と同量の純水を加え、重合缶内をN2で置換した。その後、撹拌しながら重合缶を加熱し、缶内圧力を最大1.96MPaに調整しながら、最終到達温度を280℃として反応させた。反応物を水浴中に吐出し、ストランドカッターでペレタイズしてポリアミド610樹脂のペレットを得た。得られたペレットについて、樹脂濃度0.01g/mlの98%濃硫酸溶液中25℃における相対粘度を測定した結果、3.5であった。また、得られたペレットをフェノール・エタノール混合溶媒(83.5:16.5(体積比))に溶解し、0.02N塩酸水溶液を用いて滴定した結果、アミノ末端基量は3.5×10-5mol/gであった。
PA6:ポリアミド6樹脂(融点224℃、降温結晶化温度175℃、樹脂濃度0.01g/mlの98%濃硫酸溶液中25℃における相対粘度2.70)
PA11:ポリアミド11樹脂「“Rilsan” (登録商標)BESN TL」(ARKEMA社製)
PA6/66:ポリアミド6/66樹脂「“UBEナイロン”(登録商標)5034B」(宇部興産(株)製)
耐衝撃材1(不飽和カルボン酸および/またはその誘導体で変性されたエチレン/α-オレフィン共重合体(B)):無水マレイン酸変性エチレン/1-ブテン共重合体「“タフマー”(登録商標)MH7020」(三井化学(株)製)(ショアA硬度70A)
耐衝撃材2:グリシジルメタクリレート変性ポリエチレン共重合体「“ボンドファースト”(登録商標)7L」(住友化学(株)製)(ショアA硬度60A)。
表1記載の各原料を、シリンダー温度を240℃に設定し、ニーディングゾーンを2つ設けたスクリューアレンジとし、スクリュー回転数を200rpmとした2軸スクリュー押出機(JSW社製TEX30XSSST)(L/D=45.5(なお、ここでのLは原料供給口から吐出口までの長さ、Dはスクリュー径である)に供給して溶融混練した。ダイから吐出されたガットを5℃に温調した水を満たした冷却バス中を20秒間かけて通過させることで急冷した後、ストランドカッターでペレタイズし、ペレットを得た。得られたペレットを用いて、前述の方法により評価した結果を表1に記載した。
[比較例4]
ポリアミド11樹脂「“Rilsan” (登録商標)BESN TL」(ARKEMA社製)のペレットを用いて、前述の方法により評価した結果を表1に記載した。
2 補強層
3 耐候層
Claims (6)
- ヘキサメチレンジアミン由来の単位と炭素数8~12の脂肪族ジカルボン酸由来の単位を含むポリアミド樹脂(A)および不飽和カルボン酸および/またはその誘導体で変性されたエチレン/α-オレフィン共重合体(B)を配合してなる、高圧水素に触れる成形品用のポリアミド樹脂組成物。
- ヘキサメチレンジアミン由来の単位と炭素数8~12の脂肪族ジカルボン酸由来の単位を含むポリアミド樹脂(A)100重量部に対して、不飽和カルボン酸および/またはその誘導体で変性されたエチレン/α-オレフィン共重合体(B)を5~100重量部配合してなる、請求項1記載のポリアミド樹脂組成物。
- 請求項1または2に記載のポリアミド樹脂組成物を成形してなる、高圧水素に触れる成形品。
- 請求項1または2に記載のポリアミド樹脂組成物を成形してなる、高圧水素に触れる高圧水素用ホース。
- 請求項1または2に記載のポリアミド樹脂組成物を成形してなる内面層の外側に補強層を備える高圧水素用ホース。
- さらに、最外層に耐候層を備える請求項5に記載の高圧水素用ホース。
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CN107075251B (zh) | 2020-07-14 |
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JP5928668B1 (ja) | 2016-06-01 |
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