JP7517031B2 - 高圧水素に触れる中空成形品および高圧水素に触れる中空成形品の製造方法 - Google Patents
高圧水素に触れる中空成形品および高圧水素に触れる中空成形品の製造方法 Download PDFInfo
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- JP7517031B2 JP7517031B2 JP2020163117A JP2020163117A JP7517031B2 JP 7517031 B2 JP7517031 B2 JP 7517031B2 JP 2020163117 A JP2020163117 A JP 2020163117A JP 2020163117 A JP2020163117 A JP 2020163117A JP 7517031 B2 JP7517031 B2 JP 7517031B2
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- molded product
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- polyamide
- acid
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- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 6
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- CNPURSDMOWDNOQ-UHFFFAOYSA-N 4-methoxy-7h-pyrrolo[2,3-d]pyrimidin-2-amine Chemical compound COC1=NC(N)=NC2=C1C=CN2 CNPURSDMOWDNOQ-UHFFFAOYSA-N 0.000 description 4
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- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 4
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
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- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 2
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- QLBRROYTTDFLDX-UHFFFAOYSA-N [3-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCCC(CN)C1 QLBRROYTTDFLDX-UHFFFAOYSA-N 0.000 description 2
- OXIKYYJDTWKERT-UHFFFAOYSA-N [4-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCC(CN)CC1 OXIKYYJDTWKERT-UHFFFAOYSA-N 0.000 description 2
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- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 2
- QCTBMLYLENLHLA-UHFFFAOYSA-N aminomethylbenzoic acid Chemical compound NCC1=CC=C(C(O)=O)C=C1 QCTBMLYLENLHLA-UHFFFAOYSA-N 0.000 description 2
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- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
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- 238000006297 dehydration reaction Methods 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
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- QNFQYLRYCQTBEP-UHFFFAOYSA-L dipotassium;dibenzoate Chemical compound [K+].[K+].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 QNFQYLRYCQTBEP-UHFFFAOYSA-L 0.000 description 1
- LRUDDHYVRFQYCN-UHFFFAOYSA-L dipotassium;terephthalate Chemical compound [K+].[K+].[O-]C(=O)C1=CC=C(C([O-])=O)C=C1 LRUDDHYVRFQYCN-UHFFFAOYSA-L 0.000 description 1
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- 238000004090 dissolution Methods 0.000 description 1
- GFQOFGWPGYRLAO-UHFFFAOYSA-N dodecanamide;ethene Chemical compound C=C.CCCCCCCCCCCC(N)=O.CCCCCCCCCCCC(N)=O GFQOFGWPGYRLAO-UHFFFAOYSA-N 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
- UAUDZVJPLUQNMU-KTKRTIGZSA-N erucamide Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(N)=O UAUDZVJPLUQNMU-KTKRTIGZSA-N 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- PFBWBEXCUGKYKO-UHFFFAOYSA-N ethene;n-octadecyloctadecan-1-amine Chemical compound C=C.CCCCCCCCCCCCCCCCCCNCCCCCCCCCCCCCCCCCC PFBWBEXCUGKYKO-UHFFFAOYSA-N 0.000 description 1
- MFGZXPGKKJMZIY-UHFFFAOYSA-N ethyl 5-amino-1-(4-sulfamoylphenyl)pyrazole-4-carboxylate Chemical compound NC1=C(C(=O)OCC)C=NN1C1=CC=C(S(N)(=O)=O)C=C1 MFGZXPGKKJMZIY-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
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- 238000011156 evaluation Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
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- 238000009730 filament winding Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
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- 239000004088 foaming agent Substances 0.000 description 1
- 239000001530 fumaric acid Chemical class 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
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- 230000009477 glass transition Effects 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 229910021482 group 13 metal Inorganic materials 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
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- 150000004820 halides Chemical class 0.000 description 1
- 238000009787 hand lay-up Methods 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- HSEMFIZWXHQJAE-UHFFFAOYSA-N hexadecanamide Chemical compound CCCCCCCCCCCCCCCC(N)=O HSEMFIZWXHQJAE-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- NMCUIPGRVMDVDB-UHFFFAOYSA-L iron dichloride Chemical compound Cl[Fe]Cl NMCUIPGRVMDVDB-UHFFFAOYSA-L 0.000 description 1
- GYCHYNMREWYSKH-UHFFFAOYSA-L iron(ii) bromide Chemical compound [Fe+2].[Br-].[Br-] GYCHYNMREWYSKH-UHFFFAOYSA-L 0.000 description 1
- BQZGVMWPHXIKEQ-UHFFFAOYSA-L iron(ii) iodide Chemical compound [Fe+2].[I-].[I-] BQZGVMWPHXIKEQ-UHFFFAOYSA-L 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
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- 238000003475 lamination Methods 0.000 description 1
- 229940031993 lithium benzoate Drugs 0.000 description 1
- HGPXWXLYXNVULB-UHFFFAOYSA-M lithium stearate Chemical compound [Li+].CCCCCCCCCCCCCCCCCC([O-])=O HGPXWXLYXNVULB-UHFFFAOYSA-M 0.000 description 1
- LDJNSLOKTFFLSL-UHFFFAOYSA-M lithium;benzoate Chemical compound [Li+].[O-]C(=O)C1=CC=CC=C1 LDJNSLOKTFFLSL-UHFFFAOYSA-M 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- PJJZFXPJNUVBMR-UHFFFAOYSA-L magnesium benzoate Chemical compound [Mg+2].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 PJJZFXPJNUVBMR-UHFFFAOYSA-L 0.000 description 1
- OTCKOJUMXQWKQG-UHFFFAOYSA-L magnesium bromide Chemical compound [Mg+2].[Br-].[Br-] OTCKOJUMXQWKQG-UHFFFAOYSA-L 0.000 description 1
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- 229910001629 magnesium chloride Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
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- BLQJIBCZHWBKSL-UHFFFAOYSA-L magnesium iodide Chemical compound [Mg+2].[I-].[I-] BLQJIBCZHWBKSL-UHFFFAOYSA-L 0.000 description 1
- 229910001641 magnesium iodide Inorganic materials 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 239000011565 manganese chloride Substances 0.000 description 1
- 235000002867 manganese chloride Nutrition 0.000 description 1
- QWYFOIJABGVEFP-UHFFFAOYSA-L manganese(ii) iodide Chemical compound [Mn+2].[I-].[I-] QWYFOIJABGVEFP-UHFFFAOYSA-L 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- NKHAVTQWNUWKEO-IHWYPQMZSA-N methyl hydrogen fumarate Chemical compound COC(=O)\C=C/C(O)=O NKHAVTQWNUWKEO-IHWYPQMZSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Chemical class OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- 239000003345 natural gas Substances 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- IPLJNQFXJUCRNH-UHFFFAOYSA-L nickel(2+);dibromide Chemical compound [Ni+2].[Br-].[Br-] IPLJNQFXJUCRNH-UHFFFAOYSA-L 0.000 description 1
- BFSQJYRFLQUZKX-UHFFFAOYSA-L nickel(ii) iodide Chemical compound I[Ni]I BFSQJYRFLQUZKX-UHFFFAOYSA-L 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- FJDUDHYHRVPMJZ-UHFFFAOYSA-N nonan-1-amine Chemical compound CCCCCCCCCN FJDUDHYHRVPMJZ-UHFFFAOYSA-N 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- SJYNFBVQFBRSIB-UHFFFAOYSA-N norbornadiene Chemical compound C1=CC2C=CC1C2 SJYNFBVQFBRSIB-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 1
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 1
- 229960002446 octanoic acid Drugs 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- LPNBBFKOUUSUDB-UHFFFAOYSA-N p-toluic acid Chemical compound CC1=CC=C(C(O)=O)C=C1 LPNBBFKOUUSUDB-UHFFFAOYSA-N 0.000 description 1
- 229940100684 pentylamine Drugs 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000233 poly(alkylene oxides) Polymers 0.000 description 1
- 229920000747 poly(lactic acid) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920006394 polyamide 410 Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 239000004626 polylactic acid Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 1
- 239000004300 potassium benzoate Substances 0.000 description 1
- 235000010235 potassium benzoate Nutrition 0.000 description 1
- 229940103091 potassium benzoate Drugs 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- FRMWBRPWYBNAFB-UHFFFAOYSA-M potassium salicylate Chemical compound [K+].OC1=CC=CC=C1C([O-])=O FRMWBRPWYBNAFB-UHFFFAOYSA-M 0.000 description 1
- 229960003629 potassium salicylate Drugs 0.000 description 1
- 159000000001 potassium salts Chemical class 0.000 description 1
- 229940114930 potassium stearate Drugs 0.000 description 1
- ANBFRLKBEIFNQU-UHFFFAOYSA-M potassium;octadecanoate Chemical compound [K+].CCCCCCCCCCCCCCCCCC([O-])=O ANBFRLKBEIFNQU-UHFFFAOYSA-M 0.000 description 1
- PYJBVGYZXWPIKK-UHFFFAOYSA-M potassium;tetradecanoate Chemical compound [K+].CCCCCCCCCCCCCC([O-])=O PYJBVGYZXWPIKK-UHFFFAOYSA-M 0.000 description 1
- 229910052903 pyrophyllite Inorganic materials 0.000 description 1
- 238000001175 rotational moulding Methods 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- WXMKPNITSTVMEF-UHFFFAOYSA-M sodium benzoate Chemical compound [Na+].[O-]C(=O)C1=CC=CC=C1 WXMKPNITSTVMEF-UHFFFAOYSA-M 0.000 description 1
- 239000004299 sodium benzoate Substances 0.000 description 1
- 235000010234 sodium benzoate Nutrition 0.000 description 1
- 229960003885 sodium benzoate Drugs 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- BTURAGWYSMTVOW-UHFFFAOYSA-M sodium dodecanoate Chemical compound [Na+].CCCCCCCCCCCC([O-])=O BTURAGWYSMTVOW-UHFFFAOYSA-M 0.000 description 1
- 235000009518 sodium iodide Nutrition 0.000 description 1
- 229940082004 sodium laurate Drugs 0.000 description 1
- 229940045845 sodium myristate Drugs 0.000 description 1
- RYYKJJJTJZKILX-UHFFFAOYSA-M sodium octadecanoate Chemical compound [Na+].CCCCCCCCCCCCCCCCCC([O-])=O RYYKJJJTJZKILX-UHFFFAOYSA-M 0.000 description 1
- 229960004025 sodium salicylate Drugs 0.000 description 1
- ZHROMWXOTYBIMF-UHFFFAOYSA-M sodium;1,3,7,9-tetratert-butyl-11-oxido-5h-benzo[d][1,3,2]benzodioxaphosphocine 11-oxide Chemical compound [Na+].C1C2=CC(C(C)(C)C)=CC(C(C)(C)C)=C2OP([O-])(=O)OC2=C1C=C(C(C)(C)C)C=C2C(C)(C)C ZHROMWXOTYBIMF-UHFFFAOYSA-M 0.000 description 1
- JUQGWKYSEXPRGL-UHFFFAOYSA-M sodium;tetradecanoate Chemical compound [Na+].CCCCCCCCCCCCCC([O-])=O JUQGWKYSEXPRGL-UHFFFAOYSA-M 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 150000003871 sulfonates Chemical class 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920006230 thermoplastic polyester resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N tolylenediamine group Chemical group CC1=C(C=C(C=C1)N)N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Chemical class CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- KOECRLKKXSXCPB-UHFFFAOYSA-K triiodobismuthane Chemical compound I[Bi](I)I KOECRLKKXSXCPB-UHFFFAOYSA-K 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229940005605 valeric acid Drugs 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 229940102001 zinc bromide Drugs 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/32—Hydrogen storage
Landscapes
- Filling Or Discharging Of Gas Storage Vessels (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
結晶化度=(結晶域の散乱強度)/(結晶域の散乱強度+非晶域での散乱強度)×100。
各実施例および比較例により得られたペレットを、実施例および比較例に示した方法にて射出成形、押出成形またはブロー成形を行い、射出成形および押出成形の場合は直径100mm、長さ300mm、厚さ1mmt、2mmt、または3mmtの円筒状中空成形品、ブロー成形の場合は直径100mm、長さ300mm、厚さ3mmtの中空成形品をそれぞれ成形した。得られた円筒状中空成形品または中空成形品のストレート部から長さ100mm、幅10mm、厚さ1mmt、2mmt、または3mmtの短冊状試験片を作製した。作製した試験片について、支点間距離80mm、引張速度50mm/min、温度23℃×相対湿度50RH%条件下で引張破断伸度を測定した。
各実施例および比較例により得られたペレットを、実施例および比較例に示した方法にて射出成形、押出成形またはブロー成形を行い、(1)と同様に、円筒状中空成形品、または中空成形品を成形した。得られた円筒状中空成形品または中空成形品のストレート部から試料を切り出し、切り出した試料の樹脂流れ方向と平行になる断面が露出するように、ミクロトームを用いて面出しを行った。面出しした試料からRENISHAW社製「in Via」を用いて中空成形品外面から深さ100μmまで、および中空成形品内面から深さ100μmまでをそれぞれライン上にラマンスペクトルを取得した。測定モードは顕微ラマンモードで行い、対物レンズ:×100、ビーム径:1×10μm Line、光源:半導体レーザー 785nm、レーザーパワー:100mW、回折格子:Single 1200gr/mm、スリット:65μm、検出器:CCD/RENISHAW 1024×256の設定で測定を行った。得られたラマンスペクトルから結晶性に相関するパラメータとして1635cm-1付近のC=O伸縮バンドのバンド半値幅を算出し、ポリアミド6の二軸延伸フィルムで得られたバンド半値幅と結晶化度の関係から近似プロットを行い、そこから中空成形品外面平均結晶化度および中空成形品内面平均結晶化度を算出した。ポリアミド6の二軸延伸フィルムの結晶化度については、リガク社製の回転対陰極型X線回折装置(RINT-TRIII型)を用いて、フィルム面に平行にX線を入射し、X線回折法(ルーランド法)により測定した上で、所定の計算式に基づき算出した。すなわち、広角X線回折プロファイルから、非晶域に由来する散乱領域と結晶領域に由来する散乱領域とを分離し、以下の式にしたがって、全散乱強度に対する結晶域での散乱強度の比として、結晶化度を算出した。
結晶化度=(結晶域の散乱強度)/(結晶域の散乱強度+非晶域での散乱強度)×100
各実施例および比較例により得られたペレットを、実施例および比較例に示した方法にて射出成形、押出成形またはブロー成形を行い、(1)と同様に、円筒状中空成形品、または中空成形品を成形した。得られた円筒中空成形品または中空成形品のストレート部から長手方向10mm×円周方向5mm×厚さ1mmt、2mmt、または3mmtのサンプルを切り出し、TMAを用いて温度条件-70℃~105℃まで5℃/minで昇温した。その際の-60℃~80℃までの線膨張率を測定した。
各実施例および比較例により得られたペレットを実施例および比較例に示した方法にて射出成形、押出成形またはブロー成形を行い、(1)と同様に、円筒状中空成形品、または中空成形品を成形した。得られた円筒中空成形品または中空成形品のストレート部から長手方向10mm×円周方向30mm×厚さ1mmt、または2mmt、または3mmtのサンプルを切り出し、X-CT解析を行い、欠陥点の有無を確認した。欠陥点のないサンプルをオートクレーブに入れた後、オートクレーブ中に水素ガスを圧力30MPaまで3分間かけて注入し、2時間保持した後、1分間かけて常圧になるまで減圧した。これを1サイクルとして700サイクル繰り返した。700サイクル繰り返した後の中空成形品について、同様にX線CT解析を行い、10μm以上の欠陥点の有無を観察した。
各実施例および比較例において配合したポリアミド6樹脂(A)およびポリアミド樹脂(B)について、示差走査熱量計(パーキンエルマー社製DSC-7)を用い、2点校正(インジウム、鉛)、ベースライン補正を行った後、サンプル量を8~10mgとして、昇温速度20℃/分の条件で昇温して得られる融解曲線の最大値を示す温度より15℃高い温度で1分間保持した後、降温速度20℃/分の条件で30℃まで冷却した。さらに、30℃で1分間保持した後、20℃/分の速度で2回目の昇温工程を行った。この2回目の昇温工程において、観測された融解吸熱ピーク温度を融点とした。
各実施例および比較例において配合したポリアミド6樹脂(A)およびポリアミド樹脂(B)について、8~10mgをカバーガラスに挟み、リンカム社製ホットステージ「CSS-450W」に供し、温度250℃で30秒保持し、サンプルを溶融させた。その後、20℃/分の速度で、180℃まで降温させた。その際、大塚電子株式会社製高分子フィルムダイナミックス解析装置「DYNA-3000」を使用し、モード:1次元スキャン(1×512)、X方向:中央部4素子分を積算し1データとしてカウント、NDフィルター:5%、測定間隔:1秒、露光時間:500ミリ秒、ゴニオ角度:20度の条件で、降温開始時点を0とした時の、インバリアントQの立ち上がり時間を計測した。
ポリアミド6樹脂1:ポリアミド6樹脂(融点223℃、樹脂濃度0.01g/mlの98%濃硝酸溶液中の25℃における相対粘度2.70、インバリアントQの立ち上がり時間175秒)
ポリアミド6樹脂2:ポリアミド6(融点223℃、樹脂濃度0.01g/mlの98%濃硝酸溶液中の25℃における相対粘度4.40、インバリアントQの立ち上がり時間180秒)
ポリアミド610樹脂:ポリアミド610樹脂(融点226℃、樹脂濃度0.01g/mlの98%濃硝酸溶液中の25℃における相対粘度2.70、インバリアントQの立ち上がり時間165秒)
ポリアミド6/ポリアミド66共重合体:ポリアミド6/ポリアミド66共重合体(融点190℃、樹脂濃度0.01g/mlの98%濃硫酸溶液中25℃における相対粘度4.20)
アミド系ワックス:エチレンジアミン・ステアリン酸・セバシン酸重縮合物「“ライトアマイド”WH-255」(共栄社化学(株)、融点255℃)
耐衝撃材1:無水マレイン酸変性エチレン/1―ブテン共重合体「“タフマー”(登録商標)MH5020」
金属ハロゲン化物1:ヨウ化銅(I)(和光純薬工業(株)製)
金属ハロゲン化物2:ヨウ化カリウム(和光純薬工業(株)製)。
表1に記載の原料を、シリンダー温度を270℃に設定し、ニーディングゾーンを2つ設けたスクリューアレンジとし、スクリュー回転数150rpmとした2軸スクリュー押出機(JSW社製TEX30α-35BW-7V)(L/D=45(なお、ここでのLは原料供給口から吐出口までの長さであり、Dはスクリューの直径である))に供給して溶融混練し、ダイから吐出後のガットを10℃に温調した水を満たした冷却バス中を15秒間かけて通過させることで急冷し構造を固定した後、ストランドカッターでペレタイズしペレットを得た。得られたペレットを用いて1000トンの射出成形機と油循環型金型温調機を2台使用し、樹脂温度270℃、冷却時間180秒、金型温度120℃の条件で射出成形を行い、直径100mm、長さ300mm、厚さ3mmtの円筒状中空成形品を成形した。
表1に記載の原料を、シリンダー温度を270℃に設定し、ニーディングゾーンを2つ設けたスクリューアレンジとし、スクリュー回転数150rpmとした2軸スクリュー押出機(JSW社製TEX30α-35BW-7V)(L/D=45(なお、ここでのLは原料供給口から吐出口までの長さであり、Dはスクリューの直径である))に供給して溶融混練し、ダイから吐出後のガットを10℃に温調した水を満たした冷却バス中を15秒間かけて通過させることで急冷し構造を固定した後、ストランドカッターでペレタイズしペレットを得た。得られたペレットを用いて1000トンの射出成形機と油循環型金型温調機を2台使用し、樹脂温度270℃、冷却時間180秒、金型温度120℃の条件で射出成形を行い、直径100mm、長さ300mm、厚さ1mmtの円筒状中空成形品を成形した。
表1に記載の原料を、シリンダー温度を270℃に設定し、ニーディングゾーンを2つ設けたスクリューアレンジとし、スクリュー回転数150rpmとした2軸スクリュー押出機(JSW社製TEX30α-35BW-7V)(L/D=45(なお、ここでのLは原料供給口から吐出口までの長さであり、Dはスクリューの直径である))に供給して溶融混練し、ダイから吐出後のガットを10℃に温調した水を満たした冷却バス中を15秒間かけて通過させることで急冷し構造を固定した後、ストランドカッターでペレタイズしペレットを得た。得られたペレットを用いて1000トンの射出成形機と油循環型金型温調機を2台使用し、樹脂温度270℃、冷却時間180秒、金型温度120℃の条件で射出成形を行い、直径100mm、長さ300mm、厚さ2mmtの円筒状中空成形品を成形した。
表2に記載の原料を、シリンダー温度を270℃に設定し、ニーディングゾーンを2つ設けたスクリューアレンジとし、スクリュー回転数150rpmとした2軸スクリュー押出機(JSW社製TEX30α-35BW-7V)(L/D=45(なお、ここでのLは原料供給口から吐出口までの長さであり、Dはスクリューの直径である))に供給して溶融混練し、ダイから吐出後のガットを10℃に温調した水を満たした冷却バス中を15秒間かけて通過させることで急冷し構造を固定した後、ストランドカッターでペレタイズしペレットを得た。得られたペレットを用いて1000トンの射出成形機と水循環型金型温調機を2台使用し、樹脂温度270℃、冷却時間180秒、金型温度30℃に設定し樹脂を賦形した10秒後に80℃の熱媒を流して加熱する条件で射出成形を行い、直径100mm、長さ300mm、厚さ3mmtの円筒状中空成形品を成形した。
表2に記載の原料を、シリンダー温度を270℃に設定し、ニーディングゾーンを2つ設けたスクリューアレンジとし、スクリュー回転数150rpmとした2軸スクリュー押出機(JSW社製TEX30α-35BW-7V)(L/D=45(なお、ここでのLは原料供給口から吐出口までの長さであり、Dはスクリューの直径である))に供給して溶融混練し、ダイから吐出後のガットを10℃に温調した水を満たした冷却バス中を15秒間かけて通過させることで急冷し構造を固定した後、ストランドカッターでペレタイズしペレットを得た。得られたペレットを用いて1000トンの射出成形機と水循環型金型温調機を2台使用し、樹脂温度270℃、冷却時間180秒、金型温度80℃の条件で射出成形を行い、直径100mm、長さ300mm、厚さ3mmtの円筒状中空成形品を成形した。
表3に記載の原料を、シリンダー温度を270℃に設定し、ニーディングゾーンを2つ設けたスクリューアレンジとし、スクリュー回転数150rpmとした2軸スクリュー押出機(JSW社製TEX30α-35BW-7V)(L/D=45(なお、ここでのLは原料供給口から吐出口までの長さであり、Dはスクリューの直径である))に供給して溶融混練し、ダイから吐出後のガットを10℃に温調した水を満たした冷却バス中を15秒間かけて通過させることで急冷し構造を固定した後、ストランドカッターでペレタイズしペレットを得た。得られたペレットを用いて押出成形機を用いて樹脂温度250℃で押出成形を行い、直径100mm、長さ300mm、厚さ3mmtの円筒状中空成形品を成形した。このとき、サイジングダイスにヒーターを2つ取り付け、押出機吐出口側に近いヒーターの設定温度150℃、もう片方のヒーターの設定温度80℃の条件で押出成形を行った。
表3に記載の原料を、シリンダー温度を270℃に設定し、ニーディングゾーンを2つ設けたスクリューアレンジとし、スクリュー回転数150rpmとした2軸スクリュー押出機(JSW社製TEX30α-35BW-7V)(L/D=45(なお、ここでのLは原料供給口から吐出口までの長さであり、Dはスクリューの直径である))に供給して溶融混練し、ダイから吐出後のガットを10℃に温調した水を満たした冷却バス中を15秒間かけて通過させることで急冷し構造を固定した後、ストランドカッターでペレタイズしペレットを得た。得られたペレットを用いて押出成形機を用いて樹脂温度250℃で押出成形を行い、直径100mm、長さ300mm、厚さ1mmtの円筒状中空成形品を成形した。このとき、サイジングダイスにヒーターを2つ取り付け、押出機吐出口側に近いヒーターの設定温度150℃、もう片方のヒーターの設定温度80℃の条件で押出成形を行った。
表3に記載の原料を、シリンダー温度を270℃に設定し、ニーディングゾーンを2つ設けたスクリューアレンジとし、スクリュー回転数150rpmとした2軸スクリュー押出機(JSW社製TEX30α-35BW-7V)(L/D=45(なお、ここでのLは原料供給口から吐出口までの長さであり、Dはスクリューの直径である))に供給して溶融混練し、ダイから吐出後のガットを10℃に温調した水を満たした冷却バス中を15秒間かけて通過させることで急冷し構造を固定した後、ストランドカッターでペレタイズしペレットを得た。得られたペレットを用いて押出成形機を用いて樹脂温度250℃で押出成形を行い、直径100mm、長さ300mm、厚さ2mmtの円筒状中空成形品を成形した。このとき、サイジングダイスにヒーターを2つ取り付け、押出機吐出口側に近いヒーターの設定温度150℃、もう片方のヒーターの設定温度80℃の条件で押出成形を行った。
表4に記載の原料を、シリンダー温度を270℃に設定し、ニーディングゾーンを2つ設けたスクリューアレンジとし、スクリュー回転数150rpmとした2軸スクリュー押出機(JSW社製TEX30α-35BW-7V)(L/D=45(なお、ここでのLは原料供給口から吐出口までの長さであり、Dはスクリューの直径である))に供給して溶融混練し、ダイから吐出後のガットを10℃に温調した水を満たした冷却バス中を15秒間かけて通過させることで急冷し構造を固定した後、ストランドカッターでペレタイズしペレットを得た。得られたペレットを用いて押出成形機を用いて樹脂温度250℃で押出成形を行い、直径100mm、長さ300mm、厚さ3mmtの円筒状中空成形品を成形した。このとき、サイジングダイスにヒーターを取り付け、設定温度80℃にて押出成形を行った。
表5に記載の原料を、シリンダー温度を270℃に設定し、ニーディングゾーンを2つ設けたスクリューアレンジとし、スクリュー回転数150rpmとした2軸スクリュー押出機(JSW社製TEX30α-35BW-7V)(L/D=45(なお、ここでのLは原料供給口から吐出口までの長さであり、Dはスクリューの直径である)))に供給して溶融混練し、ダイから吐出後のガットを10℃に温調した水を満たした冷却バス中を15秒間かけて通過させることで急冷し構造を固定した後、ストランドカッターでペレタイズしペレットを得た。得られたペレットを用いてブロー成形機と油循環型金型温調機を2台用いて樹脂温度250℃、冷却時間180秒、金型温度120℃の条件でブロー成形を行い、直径100mm、長さ300mm、厚さ3mmtの中空成形品を成形した。
表6に記載の原料を、シリンダー温度を270℃に設定し、ニーディングゾーンを2つ設けたスクリューアレンジとし、スクリュー回転数150rpmとした2軸スクリュー押出機(JSW社製TEX30α-35BW-7V)(L/D=45(なお、ここでのLは原料供給口から吐出口までの長さであり、Dはスクリューの直径である))に供給して溶融混練し、ダイから吐出後のガットを10℃に温調した水を満たした冷却バス中を15秒間かけて通過させることで急冷し構造を固定した後、ストランドカッターでペレタイズしペレットを得た。得られたペレットを用いてブロー成形機と水循環型金型温調機を2台用いて樹脂温度250℃、冷却時間180秒、金型温度30℃の条件でブロー成形を行い、直径100mm、長さ300mm、厚さ3mmtの中空成形品を成形した。
Claims (6)
- 高圧水素に触れる中空成形品であって、前記中空成形品の、中空成形品外面から深さ方向に100μmまでの平均結晶化度、および中空成形品内面から深さ方向に100μmまでの平均結晶化度が、それぞれ15%以上であることを特徴とする高圧水素に触れる中空成形品であり、前記中空成形品が、ポリアミド6樹脂(A)100重量部に対して、DSC測定による融点が245℃以下であり、光散乱測定において温度250℃から20℃/分の速度で冷却して測定した際のインバリアントQの立ち上がり時間がポリアミド6樹脂(A)のインバリアントQの立ち上がり時間よりも短いポリアミド樹脂(B)を0.01~5重量部配合してなるポリアミド樹脂組成物からなることを特徴とする中空成形品。
- 高圧水素に触れる中空成形品であって、前記中空成形品の、中空成形品外面から深さ方向に100μmまでの平均結晶化度、および中空成形品内面から深さ方向に100μmまでの平均結晶化度が、それぞれ15%以上であることを特徴とする高圧水素に触れる中空成形品であり、前記中空成形品が、ポリアミド6樹脂(A)100重量部に対し、アミド系ワックス(C)を0.01~10重量部配合してなるポリアミド樹脂組成物からなることを特徴とする中空成形品。
- 高圧水素に触れる中空成形品であって、前記中空成形品の、中空成形品外面から深さ方向に100μmまでの平均結晶化度、および中空成形品内面から深さ方向に100μmまでの平均結晶化度が、それぞれ15%以上であることを特徴とする高圧水素に触れる中空成形品であり、前記中空成形品が、ポリアミド6樹脂(A)100重量部に対し、耐衝撃材(D)を1~50重量部配合してなるポリアミド樹脂組成物からなることを特徴とする中空成形品。
- 高圧水素に触れる中空成形品であって、前記中空成形品の、中空成形品外面から深さ方向に100μmまでの平均結晶化度、および中空成形品内面から深さ方向に100μmまでの平均結晶化度が、それぞれ15%以上であることを特徴とする高圧水素に触れる中空成形品であり、前記中空成形品が、ポリアミド6樹脂(A)100重量部に対し、金属ハロゲン化物(E)を0.01~1重量部配合してなるポリアミド樹脂組成物からなることを特徴とする中空成形品。
- 請求項1~4のいずれかに記載の中空成形品の製造方法であって、射出成形、押出成形、ブロー成形より選ばれたいずれかの成形方法により成形する、中空成形品の製造方法。
- 押出成形により成形する、請求項5に記載の中空成形品の製造方法。
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