CN102203188B - 包含导热填料和超支化聚酯酰胺的热塑性组合物 - Google Patents

包含导热填料和超支化聚酯酰胺的热塑性组合物 Download PDF

Info

Publication number
CN102203188B
CN102203188B CN200980143541.7A CN200980143541A CN102203188B CN 102203188 B CN102203188 B CN 102203188B CN 200980143541 A CN200980143541 A CN 200980143541A CN 102203188 B CN102203188 B CN 102203188B
Authority
CN
China
Prior art keywords
weight
thermoplastic compounds
hexamethylene
terephthalamide
filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200980143541.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN102203188A (zh
Inventor
Y·萨加
W·W·张
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of CN102203188A publication Critical patent/CN102203188A/zh
Application granted granted Critical
Publication of CN102203188B publication Critical patent/CN102203188B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/16—Halogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C08L101/025—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/12—Polyester-amides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN200980143541.7A 2008-10-30 2009-10-23 包含导热填料和超支化聚酯酰胺的热塑性组合物 Expired - Fee Related CN102203188B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US19779208P 2008-10-30 2008-10-30
US61/197792 2008-10-30
PCT/US2009/061869 WO2010056489A2 (en) 2008-10-30 2009-10-23 Thermoplastic composition including thermally conductive filler and hyperbranched polyesteramide

Publications (2)

Publication Number Publication Date
CN102203188A CN102203188A (zh) 2011-09-28
CN102203188B true CN102203188B (zh) 2014-01-01

Family

ID=42101334

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980143541.7A Expired - Fee Related CN102203188B (zh) 2008-10-30 2009-10-23 包含导热填料和超支化聚酯酰胺的热塑性组合物

Country Status (6)

Country Link
US (1) US8293831B2 (enExample)
EP (1) EP2350193B1 (enExample)
JP (1) JP5647134B2 (enExample)
KR (1) KR20110084971A (enExample)
CN (1) CN102203188B (enExample)
WO (1) WO2010056489A2 (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080153959A1 (en) * 2006-12-20 2008-06-26 General Electric Company Thermally Conducting and Electrically Insulating Moldable Compositions and Methods of Manufacture Thereof
KR20110079146A (ko) * 2009-12-31 2011-07-07 제일모직주식회사 백색도, 열전도성 및 압출 성형성이 우수한 폴리아마이드계 수지 조성물 및 그 제조방법
BR112013007553B1 (pt) 2010-09-30 2020-01-07 Ube Industries, Ltd. Composição de resina de poliamida e artigo moldado compreendendo a mesma
US20120080640A1 (en) * 2010-09-30 2012-04-05 E.I. Du Pont De Nemours And Company Thermally conductive resin composition
US20120153217A1 (en) * 2010-12-20 2012-06-21 E.I.Du Pont De Nemours And Company Thermally conductive polymeric resin composition
US8741998B2 (en) 2011-02-25 2014-06-03 Sabic Innovative Plastics Ip B.V. Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof
US8552101B2 (en) 2011-02-25 2013-10-08 Sabic Innovative Plastics Ip B.V. Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof
EP2718371B1 (en) 2011-06-09 2019-08-14 Solvay Specialty Polymers USA, LLC. Polyamides compositions featuring improved thermal stability
US8915617B2 (en) * 2011-10-14 2014-12-23 Ovation Polymer Technology And Engineered Materials, Inc. Thermally conductive thermoplastic for light emitting diode fixture assembly
KR101457016B1 (ko) * 2011-12-30 2014-11-03 제일모직주식회사 내습성 및 열전도성이 우수한 열가소성 수지 조성물 및 성형품
US9227347B2 (en) 2013-02-25 2016-01-05 Sabic Global Technologies B.V. Method of making a heat sink assembly, heat sink assemblies made therefrom, and illumants using the heat sink assembly
US11286372B2 (en) 2013-08-28 2022-03-29 Eaton Intelligent Power Limited Heat sink composition for electrically resistive and thermally conductive circuit breaker and load center and method of preparation therefor
CN103724993B (zh) * 2013-12-17 2016-04-27 浙江普利特新材料有限公司 一种快速吸水玻璃纤维增强尼龙6复合材料及其制备方法
CN104672495B (zh) * 2015-01-28 2017-08-25 深圳航天科技创新研究院 一种有机‑无机复合导热填料及其制备方法及其应用
CN106147221B (zh) * 2015-04-28 2018-12-18 株洲时代新材料科技股份有限公司 玻纤增强阻燃导热半芳香共聚尼龙复合材料及其制备方法
KR101792338B1 (ko) * 2015-08-28 2017-11-01 롯데첨단소재(주) 열가소성 수지 조성물 및 이로부터 제조된 성형품
CN106189223A (zh) * 2016-08-18 2016-12-07 威海晨源分子新材料有限公司 一种基于超支化聚（酯‑酰胺）的高流尼龙及其制备方法
CN107385545B (zh) * 2017-06-26 2019-10-29 杭州师范大学 一种氧化石墨烯改性的共聚酯酰胺及其纤维的制备方法与应用
CN107385542B (zh) * 2017-06-26 2019-10-29 杭州师范大学 一种poss接枝氧化石墨烯改性的尼龙复合树脂及其纤维的制备方法与应用
WO2021151850A1 (en) * 2020-01-27 2021-08-05 Basf Se Thermoplastic polyamide molding compositions that resist heat
CN112745672B (zh) * 2020-12-16 2022-06-14 金发科技股份有限公司 一种聚酰胺模塑组合物及其制备方法和应用
CN112724667B (zh) * 2020-12-16 2022-06-14 金发科技股份有限公司 一种聚酰胺模塑组合物及其制备方法和应用
CN113257366B (zh) * 2021-05-21 2024-01-26 中国矿业大学 一种支化度对超支化聚酯改性的纳米复合环氧树脂导热性影响的分子动力学模拟方法
CN115418101A (zh) * 2022-09-01 2022-12-02 浙江元盛塑业股份有限公司 一种利用超支化聚酯制备高导热pa66复合材料的方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1424360A1 (de) * 2002-11-26 2004-06-02 Bayer Aktiengesellschaft Hochfliessfähige Polymerzusammensetzungen mit verzweigten Fliesshilfsmitteln
CN1656175A (zh) * 2002-05-20 2005-08-17 3M创新有限公司 可挤出的热塑性组合物

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2170593B (en) 1985-02-01 1988-09-14 Central Electr Generat Board Temperature measurement
DE3667779D1 (de) 1985-03-23 1990-02-01 Nitto Boseki Co Ltd Glasspinnfaden und verfahren zu seiner herstellung.
SE509240C2 (sv) 1996-05-28 1998-12-21 Perstorp Ab Termoplastisk kompound bestående av en termoplastisk polymer bunden till en dendritisk eller hyperförgrenad makromolekyl samt komposition och produkt därav
JPH1017767A (ja) 1996-07-02 1998-01-20 Du Pont Kk 高流動性ポリアミド樹脂組成物
NL1007186C2 (nl) * 1997-10-01 1999-04-07 Dsm Nv ß-hydroxyalkylamide groepen bevattend condensatiepolymeer.
FR2833604B1 (fr) * 2001-12-17 2004-03-12 Rhodianyl Composition polymere thermoplastique comprenant un copolyamide hyperbranche, et articles realises a partir de cette composition
WO2003051993A1 (fr) * 2001-12-17 2003-06-26 Rhodianyl Composition thermoplastique comprenant un additif polymere hyperbranche, articles realises a partir de ce materiau
JP2004059638A (ja) * 2002-07-25 2004-02-26 Kuraray Co Ltd ポリアミド組成物
US20040242737A1 (en) * 2003-04-14 2004-12-02 Georgios Topulos Polyamide composition for blow molded articles
US20050176835A1 (en) * 2004-01-12 2005-08-11 Toshikazu Kobayashi Thermally conductive thermoplastic resin compositions
DE102004051241A1 (de) * 2004-10-20 2006-05-04 Basf Ag Fließfähige Polyamide mit hyperverzweigten Polyestern/Polycarbonaten
US20060293427A1 (en) * 2005-06-10 2006-12-28 Martens Marvin M Thermally conductive polyamide-based components used in light emitting diode reflector applications
JP2007231051A (ja) * 2006-02-27 2007-09-13 Toray Ind Inc 樹脂組成物およびそれからなる成形品
US20090130471A1 (en) * 2007-11-16 2009-05-21 E.I. Du Pont De Nemours And Company Thermally conductive plastic resin composition
US20100113669A1 (en) * 2008-10-30 2010-05-06 E.I. Du Pont De Nemours And Company Thermoplastic composition including hyperbranched aromatic polyamide

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1656175A (zh) * 2002-05-20 2005-08-17 3M创新有限公司 可挤出的热塑性组合物
EP1424360A1 (de) * 2002-11-26 2004-06-02 Bayer Aktiengesellschaft Hochfliessfähige Polymerzusammensetzungen mit verzweigten Fliesshilfsmitteln

Also Published As

Publication number Publication date
JP5647134B2 (ja) 2014-12-24
EP2350193B1 (en) 2016-03-23
JP2012507601A (ja) 2012-03-29
US20100113668A1 (en) 2010-05-06
EP2350193A2 (en) 2011-08-03
WO2010056489A2 (en) 2010-05-20
CN102203188A (zh) 2011-09-28
KR20110084971A (ko) 2011-07-26
WO2010056489A3 (en) 2010-07-22
US8293831B2 (en) 2012-10-23

Similar Documents

Publication Publication Date Title
CN102203188B (zh) 包含导热填料和超支化聚酯酰胺的热塑性组合物
JP5337692B2 (ja) ポリアミドおよびセピオライト型粘土のナノ複合材料組成物
CN1097072C (zh) 阻燃热塑性模塑组合物及由其制得的模制品
JP7150717B2 (ja) ポリフェニレンスルフィド（ｐｐｓ）およびポリアミド６（ｐａ６）を含有する充填組成物
US20100120972A1 (en) Composite compositions including semi-aromatic polyamides and carbon fiber, and articles thereof
KR20180089546A (ko) 흐름이 향상된 강화 폴리이미드 조성물
WO2007080754A1 (ja) 携帯電子機器用ポリアミド樹脂組成物および携帯電子機器用成形品
JPWO2020184270A1 (ja) 難燃性ポリアミド樹脂組成物
CN102203187A (zh) 包含超支化芳族聚酰胺的热塑性组合物
JP2013500352A (ja) 熱伝導性ポリマー組成物およびそれから製造される物品
JP6361352B2 (ja) ポリアミドエラストマー組成物、及びそれを用いた成形体
JP2000313803A (ja) ポリアミド樹脂組成物
WO2012088206A2 (en) Thermally conductive polymeric resin composition
JP5669627B2 (ja) ポリアミド樹脂組成物及び成形品
JP7524361B2 (ja) ポリアミド組成物、成形体、及び装置の振動又は音の伝搬を抑制する方法
JP2024010978A (ja) ポリアミド組成物、及び成形体
JP3009724B2 (ja) コネクター用熱可塑性樹脂組成物
JP5959190B2 (ja) ポリアミド樹脂組成物及び成形品
JP5593788B2 (ja) 導電性ポリアミド樹脂組成物及び導電性ポリアミドフィルム
JP7150716B2 (ja) ポリフェニレンスルフィド（ｐｐｓ）を含有するポリマー組成物における熱老化安定剤としてのポリアミド６（ｐａ６）の使用
JPH07126516A (ja) 芳香族ポリアミド樹脂組成物
CN116790115B (zh) 一种无卤阻燃高温尼龙复合材料以及制备方法与应用
WO2025089285A1 (ja) ポリアミド組成物及び成形品
JP2013116967A (ja) ポリアミド樹脂組成物及び成形品

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140101

Termination date: 20201023