JP2008543991A5 - - Google Patents
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- Publication number
- JP2008543991A5 JP2008543991A5 JP2008516006A JP2008516006A JP2008543991A5 JP 2008543991 A5 JP2008543991 A5 JP 2008543991A5 JP 2008516006 A JP2008516006 A JP 2008516006A JP 2008516006 A JP2008516006 A JP 2008516006A JP 2008543991 A5 JP2008543991 A5 JP 2008543991A5
- Authority
- JP
- Japan
- Prior art keywords
- polyamide
- component according
- component
- thermally conductive
- mol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 229920006012 semi-aromatic polyamide Polymers 0.000 claims description 4
- 229920006122 polyamide resin Polymers 0.000 claims description 2
- 239000011342 resin composition Substances 0.000 claims description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 10
- 150000004985 diamines Chemical class 0.000 description 7
- 239000000178 monomer Substances 0.000 description 7
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 6
- -1 aliphatic dicarboxylic acids Chemical class 0.000 description 5
- 229920002647 polyamide Polymers 0.000 description 5
- 229920002292 Nylon 6 Polymers 0.000 description 4
- 239000004952 Polyamide Substances 0.000 description 4
- PGGROMGHWHXWJL-UHFFFAOYSA-N 4-(azepane-1-carbonyl)benzamide Chemical compound C1=CC(C(=O)N)=CC=C1C(=O)N1CCCCCC1 PGGROMGHWHXWJL-UHFFFAOYSA-N 0.000 description 3
- DJZKNOVUNYPPEE-UHFFFAOYSA-N tetradecane-1,4,11,14-tetracarboxamide Chemical group NC(=O)CCCC(C(N)=O)CCCCCCC(C(N)=O)CCCC(N)=O DJZKNOVUNYPPEE-UHFFFAOYSA-N 0.000 description 3
- LKWSTQPRPRGLDP-UHFFFAOYSA-N 4-(azacycloundecane-1-carbonyl)benzamide Chemical compound C1=CC(C(=O)N)=CC=C1C(=O)N1CCCCCCCCCC1 LKWSTQPRPRGLDP-UHFFFAOYSA-N 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 229910052580 B4C Inorganic materials 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 2
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 2
- 229910001634 calcium fluoride Inorganic materials 0.000 description 2
- YKJHGROHQZNCRV-UHFFFAOYSA-N 1-(azacycloundec-1-yl)dodecan-1-one Chemical compound CCCCCCCCCCCC(=O)N1CCCCCCCCCC1 YKJHGROHQZNCRV-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- FQLAJSQGBDYBAL-UHFFFAOYSA-N 3-(azepane-1-carbonyl)benzamide Chemical compound NC(=O)C1=CC=CC(C(=O)N2CCCCCC2)=C1 FQLAJSQGBDYBAL-UHFFFAOYSA-N 0.000 description 1
- WUIAYLSDSVSPRW-UHFFFAOYSA-N 4-(3-methylpiperidine-1-carbonyl)benzamide Chemical compound C1C(C)CCCN1C(=O)C1=CC=C(C(N)=O)C=C1 WUIAYLSDSVSPRW-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000010128 melt processing Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- NAYYNDKKHOIIOD-UHFFFAOYSA-N phthalamide Chemical compound NC(=O)C1=CC=CC=C1C(N)=O NAYYNDKKHOIIOD-UHFFFAOYSA-N 0.000 description 1
- 229920006115 poly(dodecamethylene terephthalamide) Polymers 0.000 description 1
- 229920006128 poly(nonamethylene terephthalamide) Polymers 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US68977505P | 2005-06-10 | 2005-06-10 | |
| US60/689,775 | 2005-06-10 | ||
| PCT/US2006/022722 WO2006135840A1 (en) | 2005-06-10 | 2006-06-09 | Thermally conductive polyamide-based components used in light emitting diode reflector applications |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008543991A JP2008543991A (ja) | 2008-12-04 |
| JP2008543991A5 true JP2008543991A5 (enExample) | 2009-05-14 |
| JP5368788B2 JP5368788B2 (ja) | 2013-12-18 |
Family
ID=36950087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008516006A Expired - Fee Related JP5368788B2 (ja) | 2005-06-10 | 2006-06-09 | 発光ダイオードリフレクターの用途で使用される、熱伝導性ポリアミドをベースとする構成部品 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20060293427A1 (enExample) |
| EP (1) | EP1888688B1 (enExample) |
| JP (1) | JP5368788B2 (enExample) |
| CA (1) | CA2611270A1 (enExample) |
| DE (1) | DE602006018001D1 (enExample) |
| WO (1) | WO2006135840A1 (enExample) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080153959A1 (en) * | 2006-12-20 | 2008-06-26 | General Electric Company | Thermally Conducting and Electrically Insulating Moldable Compositions and Methods of Manufacture Thereof |
| EP2170982A1 (en) * | 2007-07-23 | 2010-04-07 | DSM IP Assets B.V. | Plastic component for a lighting systems |
| ATE544803T1 (de) * | 2007-07-23 | 2012-02-15 | Dsm Ip Assets Bv | E/e-verbinder und darin verwendete polymerzusammensetzung |
| US20090130471A1 (en) * | 2007-11-16 | 2009-05-21 | E.I. Du Pont De Nemours And Company | Thermally conductive plastic resin composition |
| US7845829B2 (en) * | 2008-05-20 | 2010-12-07 | Abl Ip Holding Llc | Enclosures for LED circuit boards |
| US8293831B2 (en) * | 2008-10-30 | 2012-10-23 | E I Du Pont De Nemours And Company | Thermoplastic composition including thermally conductive filler and hyperbranched polyesteramide |
| US20100113669A1 (en) * | 2008-10-30 | 2010-05-06 | E.I. Du Pont De Nemours And Company | Thermoplastic composition including hyperbranched aromatic polyamide |
| CN102639638A (zh) * | 2008-12-24 | 2012-08-15 | 第一毛织株式会社 | 尼龙类合金树脂组合物及其led(发光二极管)反射器 |
| TWI403006B (zh) * | 2009-01-15 | 2013-07-21 | 億光電子工業股份有限公司 | 發光二極體元件封裝結構及其製造方法 |
| WO2011027296A1 (en) * | 2009-09-02 | 2011-03-10 | Koninklijke Philips Electronics N.V. | Window blind |
| AT509091B1 (de) * | 2009-12-01 | 2011-09-15 | Isovoltaic Ag | Solarmodul |
| EP2388293B1 (de) * | 2010-05-17 | 2012-12-26 | Ems-Patent Ag | Polyamidformmasse und deren Verwendung zur Herstellung von LED-Gehäusekomponenten |
| US20120080640A1 (en) * | 2010-09-30 | 2012-04-05 | E.I. Du Pont De Nemours And Company | Thermally conductive resin composition |
| US20120153217A1 (en) * | 2010-12-20 | 2012-06-21 | E.I.Du Pont De Nemours And Company | Thermally conductive polymeric resin composition |
| EP2468809A1 (de) * | 2010-12-23 | 2012-06-27 | LANXESS Deutschland GmbH | Zusammensetzungen |
| US8741998B2 (en) * | 2011-02-25 | 2014-06-03 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof |
| US8552101B2 (en) | 2011-02-25 | 2013-10-08 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof |
| EP2431419A1 (en) | 2011-06-21 | 2012-03-21 | DSM IP Assets B.V. | Anti-yellowing polyamide composition |
| JP2013053188A (ja) * | 2011-09-01 | 2013-03-21 | Unitika Ltd | ポリアミド樹脂組成物およびそれからなる成形体 |
| US9434870B2 (en) | 2012-09-19 | 2016-09-06 | Momentive Performance Materials Inc. | Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics |
| US8946333B2 (en) | 2012-09-19 | 2015-02-03 | Momentive Performance Materials Inc. | Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics |
| US20140077125A1 (en) * | 2012-09-19 | 2014-03-20 | Kang Yi Lin | Composition comprising exfoliated boron nitride and method for forming such compositions |
| US9227347B2 (en) | 2013-02-25 | 2016-01-05 | Sabic Global Technologies B.V. | Method of making a heat sink assembly, heat sink assemblies made therefrom, and illumants using the heat sink assembly |
| CN104774456A (zh) * | 2015-04-01 | 2015-07-15 | 芜湖市鸿坤汽车零部件有限公司 | 一种夜光尼龙插座连接件 |
| CN105238042A (zh) * | 2015-10-27 | 2016-01-13 | 江门市道生工程塑料有限公司 | 一种高导热高韧性尼龙66复合材料及其制备方法 |
| CN105602241B (zh) * | 2016-02-04 | 2018-04-17 | 广东奇德新材料股份有限公司 | 一种纳米导电导热复合材料 |
| CN105542450A (zh) * | 2016-02-04 | 2016-05-04 | 广东奇德新材料股份有限公司 | 一种纳米导电导热复合材料的制备方法 |
| CN106947243A (zh) * | 2017-03-24 | 2017-07-14 | 合肥羿振电力设备有限公司 | 一种灯具外壳及其制备方法 |
| EP3502174B1 (de) | 2017-12-22 | 2020-03-04 | EMS-Patent AG | Wärmeleitfähige polyamid-formmassen |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3833547A (en) * | 1970-10-20 | 1974-09-03 | Standard Oil Co | Polydodecamethylene terephthalamide copolyamide |
| US5319005A (en) * | 1992-01-27 | 1994-06-07 | Hitachi Chemical Co., Ltd. | Epoxy resin molding material for sealing of electronic component |
| JPH07228776A (ja) * | 1994-02-18 | 1995-08-29 | Kuraray Co Ltd | 成形材料用ポリアミド組成物 |
| JPH0959511A (ja) * | 1995-08-18 | 1997-03-04 | Tokai Rubber Ind Ltd | 熱伝導性樹脂組成物 |
| JP4117130B2 (ja) * | 2001-12-26 | 2008-07-16 | 大塚化学ホールディングス株式会社 | 紫外線発生源用反射板材料 |
| CN1585796A (zh) * | 2002-04-05 | 2005-02-23 | 三井化学株式会社 | 发光二极管反射板用树脂组合物 |
| US20030220432A1 (en) * | 2002-04-15 | 2003-11-27 | James Miller | Thermoplastic thermally-conductive interface articles |
| CA2432522C (en) * | 2002-06-21 | 2010-09-21 | Hideaki Oka | Polyamide composition |
| JP2004075994A (ja) * | 2002-06-21 | 2004-03-11 | Kuraray Co Ltd | ポリアミド組成物 |
| JP2004059638A (ja) * | 2002-07-25 | 2004-02-26 | Kuraray Co Ltd | ポリアミド組成物 |
| US7709568B2 (en) * | 2002-10-15 | 2010-05-04 | Solvay Advanced Polymers, Llc | Anti-yellowing polycondensation polymer compositions and articles |
| US6976769B2 (en) * | 2003-06-11 | 2005-12-20 | Cool Options, Inc. | Light-emitting diode reflector assembly having a heat pipe |
| JP4419529B2 (ja) * | 2003-11-19 | 2010-02-24 | 東レ株式会社 | 樹脂組成物、それから得られる成形品 |
-
2006
- 2006-06-08 US US11/449,364 patent/US20060293427A1/en not_active Abandoned
- 2006-06-09 EP EP06772863A patent/EP1888688B1/en not_active Not-in-force
- 2006-06-09 CA CA002611270A patent/CA2611270A1/en not_active Abandoned
- 2006-06-09 WO PCT/US2006/022722 patent/WO2006135840A1/en not_active Ceased
- 2006-06-09 JP JP2008516006A patent/JP5368788B2/ja not_active Expired - Fee Related
- 2006-06-09 DE DE602006018001T patent/DE602006018001D1/de active Active
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