ATE544803T1 - E/e-verbinder und darin verwendete polymerzusammensetzung - Google Patents

E/e-verbinder und darin verwendete polymerzusammensetzung

Info

Publication number
ATE544803T1
ATE544803T1 AT08784852T AT08784852T ATE544803T1 AT E544803 T1 ATE544803 T1 AT E544803T1 AT 08784852 T AT08784852 T AT 08784852T AT 08784852 T AT08784852 T AT 08784852T AT E544803 T1 ATE544803 T1 AT E544803T1
Authority
AT
Austria
Prior art keywords
mole
terephthalic acid
dicarboxylic acids
aliphatic
semi
Prior art date
Application number
AT08784852T
Other languages
English (en)
Inventor
Rudy Rulkens
Van Pelt
Kang-Tse Hsu
Peter Dufour
Hiromi Iribe
Original Assignee
Dsm Ip Assets Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dsm Ip Assets Bv filed Critical Dsm Ip Assets Bv
Application granted granted Critical
Publication of ATE544803T1 publication Critical patent/ATE544803T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/016—Flame-proofing or flame-retarding additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
    • H01R13/527—Flameproof cases
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/18—Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Polyamides (AREA)
AT08784852T 2007-07-23 2008-07-17 E/e-verbinder und darin verwendete polymerzusammensetzung ATE544803T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP07014395 2007-07-23
PCT/EP2008/005872 WO2009012936A1 (en) 2007-07-23 2008-07-17 E/e connector and polymer composition used therein

Publications (1)

Publication Number Publication Date
ATE544803T1 true ATE544803T1 (de) 2012-02-15

Family

ID=38521208

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08784852T ATE544803T1 (de) 2007-07-23 2008-07-17 E/e-verbinder und darin verwendete polymerzusammensetzung

Country Status (8)

Country Link
US (1) US9080029B2 (de)
EP (1) EP2170978B1 (de)
JP (1) JP5303764B2 (de)
KR (1) KR101576307B1 (de)
CN (1) CN101772528B (de)
AT (1) ATE544803T1 (de)
TW (1) TWI471357B (de)
WO (1) WO2009012936A1 (de)

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Publication number Priority date Publication date Assignee Title
CN106928704A (zh) 2009-01-16 2017-07-07 帝斯曼知识产权资产管理有限公司 用于柔性印刷电路板的聚酰胺膜
CN102292378A (zh) * 2009-01-21 2011-12-21 帝斯曼知识产权资产管理有限公司 塑料容器和管道
WO2011135018A1 (en) * 2010-04-29 2011-11-03 Dsm Ip Assets B.V. Semi-aromatic polyamide
FR2961518B1 (fr) 2010-06-22 2012-07-27 Rhodia Operations Composition polyamide pour composants montes en surface
KR101908167B1 (ko) * 2011-07-27 2018-10-15 디에스엠 아이피 어셋츠 비.브이. 난연성 폴리아미드 조성물
WO2013092302A2 (en) * 2011-12-22 2013-06-27 Dsm Ip Assets B.V. Plastic part for a railway vehicle
JP2015507049A (ja) * 2012-02-07 2015-03-05 ディーエスエム アイピー アセッツ ビー．ブイ． ブリスタリングが発生しないポリアミド組成物
EP2841503B1 (de) * 2012-04-27 2018-08-29 DSM IP Assets B.V. Elektrisch leitfähiges polyamidsubstrat
WO2013167436A1 (en) * 2012-05-09 2013-11-14 Dsm Ip Assets B.V. Plastic engine cover
US12490936B2 (en) * 2013-03-15 2025-12-09 Philips Image Guided Therapy Corporation Smart interface cable for coupling a diagnostic medical device with a medical measurement system
KR102257608B1 (ko) * 2013-12-20 2021-05-28 디에스엠 아이피 어셋츠 비.브이. 미세 피치 커넥터 소켓
FR3019553B1 (fr) * 2014-04-02 2020-07-31 Arkema France Nouvelle composition thermoplastique modifiee choc presentant une plus grande fluidite a l'etat fondu
CN104810629B (zh) * 2015-03-30 2017-03-15 国家电网公司 一种多用途导线连接装置
CN106147223B (zh) * 2015-05-12 2019-02-19 上海凯赛生物技术研发中心有限公司 聚酰胺5x作为阻燃材料的应用
CN106571354B (zh) * 2015-10-09 2018-11-16 台达电子工业股份有限公司 电源变换器及其制造方法
US9954291B2 (en) * 2016-06-06 2018-04-24 Te Connectivity Corporation Electrical device having reduced arc tracking
TWI758369B (zh) * 2016-12-08 2022-03-21 荷蘭商帝斯曼知識產權資產管理有限公司 熱塑性組成物、其製得之模製部件以及其在汽車及e&e應用之用途
JP7467483B2 (ja) 2019-01-22 2024-04-15 ソルベイ スペシャルティ ポリマーズ ユーエスエー， エルエルシー 半芳香族半結晶性ポリアミドポリマー並びに対応するポリマー組成物及び物品
WO2021110882A1 (en) * 2019-12-05 2021-06-10 Dsm Ip Assets B.V. Compression limiter
KR102838097B1 (ko) * 2020-07-29 2025-07-25 삼성전자주식회사 손상 방지를 위한 보강 구조를 포함하는 전자 장치
CN114058009B (zh) * 2021-12-13 2023-11-10 山东广垠新材料有限公司 减少二胺单体损失的半芳族聚酰胺制备方法及半芳族聚酰胺和模塑组合物

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JPS6131217A (ja) * 1984-07-25 1986-02-13 Toray Ind Inc ポリテトラメチレンアジパミド射出成形品
JPH02240161A (ja) * 1989-03-14 1990-09-25 Unitika Ltd 耐熱性に優れた表面実装用コネクター
JP2904859B2 (ja) * 1990-03-29 1999-06-14 三井化学株式会社 ポリアミド樹脂組成物
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JP4519663B2 (ja) * 2004-01-30 2010-08-04 三井化学株式会社 難燃性ポリアミド組成物およびその用途
US8426549B2 (en) * 2005-04-15 2013-04-23 Mitsui Chemicals, Inc. Resin composition for reflector, and reflector
US20060293427A1 (en) * 2005-06-10 2006-12-28 Martens Marvin M Thermally conductive polyamide-based components used in light emitting diode reflector applications
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Also Published As

Publication number Publication date
US9080029B2 (en) 2015-07-14
US20100279550A1 (en) 2010-11-04
JP5303764B2 (ja) 2013-10-02
KR101576307B1 (ko) 2015-12-09
EP2170978A1 (de) 2010-04-07
TW200911880A (en) 2009-03-16
EP2170978B1 (de) 2012-02-08
CN101772528B (zh) 2013-06-12
WO2009012936A1 (en) 2009-01-29
JP2010534258A (ja) 2010-11-04
KR20100051666A (ko) 2010-05-17
CN101772528A (zh) 2010-07-07
TWI471357B (zh) 2015-02-01

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