CA2611270A1 - Thermally conductive polyamide-based components used in light emitting diode reflector applications - Google Patents
Thermally conductive polyamide-based components used in light emitting diode reflector applications Download PDFInfo
- Publication number
- CA2611270A1 CA2611270A1 CA002611270A CA2611270A CA2611270A1 CA 2611270 A1 CA2611270 A1 CA 2611270A1 CA 002611270 A CA002611270 A CA 002611270A CA 2611270 A CA2611270 A CA 2611270A CA 2611270 A1 CA2611270 A1 CA 2611270A1
- Authority
- CA
- Canada
- Prior art keywords
- component
- polyamide
- thermally conductive
- terephthalamide
- terephthalic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 229920002647 polyamide Polymers 0.000 title claims description 30
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 17
- 239000011342 resin composition Substances 0.000 claims abstract description 17
- 239000004020 conductor Substances 0.000 claims abstract description 11
- 239000000654 additive Substances 0.000 claims abstract description 6
- 239000000945 filler Substances 0.000 claims abstract description 6
- 229910052580 B4C Inorganic materials 0.000 claims abstract description 5
- 229910052582 BN Inorganic materials 0.000 claims abstract description 5
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 5
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims abstract description 5
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 claims abstract description 5
- 229910001634 calcium fluoride Inorganic materials 0.000 claims abstract description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052593 corundum Inorganic materials 0.000 claims abstract 3
- 229910001845 yogo sapphire Inorganic materials 0.000 claims abstract 3
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 66
- 239000000203 mixture Substances 0.000 claims description 33
- 239000004952 Polyamide Substances 0.000 claims description 27
- -1 poly(dodecamethylene terephthalamide) Polymers 0.000 claims description 24
- 239000000178 monomer Substances 0.000 claims description 19
- 229920006012 semi-aromatic polyamide Polymers 0.000 claims description 14
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 13
- 150000004985 diamines Chemical class 0.000 claims description 13
- 125000004432 carbon atom Chemical group C* 0.000 claims description 12
- PGGROMGHWHXWJL-UHFFFAOYSA-N 4-(azepane-1-carbonyl)benzamide Chemical compound C1=CC(C(=O)N)=CC=C1C(=O)N1CCCCCC1 PGGROMGHWHXWJL-UHFFFAOYSA-N 0.000 claims description 6
- 229920002292 Nylon 6 Polymers 0.000 claims description 6
- 125000001931 aliphatic group Chemical group 0.000 claims description 6
- 125000003118 aryl group Chemical group 0.000 claims description 6
- DJZKNOVUNYPPEE-UHFFFAOYSA-N tetradecane-1,4,11,14-tetracarboxamide Chemical compound NC(=O)CCCC(C(N)=O)CCCCCCC(C(N)=O)CCCC(N)=O DJZKNOVUNYPPEE-UHFFFAOYSA-N 0.000 claims description 6
- FQLAJSQGBDYBAL-UHFFFAOYSA-N 3-(azepane-1-carbonyl)benzamide Chemical compound NC(=O)C1=CC=CC(C(=O)N2CCCCCC2)=C1 FQLAJSQGBDYBAL-UHFFFAOYSA-N 0.000 claims description 4
- 239000003365 glass fiber Substances 0.000 claims description 3
- 239000011256 inorganic filler Substances 0.000 claims description 3
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 3
- LKWSTQPRPRGLDP-UHFFFAOYSA-N 4-(azacycloundecane-1-carbonyl)benzamide Chemical compound C1=CC(C(=O)N)=CC=C1C(=O)N1CCCCCCCCCC1 LKWSTQPRPRGLDP-UHFFFAOYSA-N 0.000 claims description 2
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims description 2
- 229920000299 Nylon 12 Polymers 0.000 claims description 2
- 239000003963 antioxidant agent Substances 0.000 claims description 2
- 239000003086 colorant Substances 0.000 claims description 2
- 239000003063 flame retardant Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 150000003951 lactams Chemical class 0.000 claims description 2
- 239000000314 lubricant Substances 0.000 claims description 2
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 claims description 2
- 229920006115 poly(dodecamethylene terephthalamide) Polymers 0.000 claims description 2
- 229920006128 poly(nonamethylene terephthalamide) Polymers 0.000 claims description 2
- 239000003381 stabilizer Substances 0.000 claims description 2
- 229910017083 AlN Inorganic materials 0.000 claims 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims 1
- 230000000712 assembly Effects 0.000 abstract description 2
- 238000000429 assembly Methods 0.000 abstract description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 abstract description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 20
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 description 15
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 15
- 239000000463 material Substances 0.000 description 15
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 14
- 238000000465 moulding Methods 0.000 description 12
- 235000011037 adipic acid Nutrition 0.000 description 10
- 239000001361 adipic acid Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 229920000642 polymer Polymers 0.000 description 9
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 6
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 6
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 6
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 3
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 150000001991 dicarboxylic acids Chemical class 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 239000011541 reaction mixture Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000005995 Aluminium silicate Substances 0.000 description 2
- 229920002302 Nylon 6,6 Polymers 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 235000012211 aluminium silicate Nutrition 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- MGPUUXGHLCLLKJ-UHFFFAOYSA-N dodecanedioic acid;terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1.OC(=O)CCCCCCCCCCC(O)=O MGPUUXGHLCLLKJ-UHFFFAOYSA-N 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 238000010102 injection blow moulding Methods 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000012266 salt solution Substances 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 229920001897 terpolymer Polymers 0.000 description 2
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 1
- JZUHIOJYCPIVLQ-UHFFFAOYSA-N 2-methylpentane-1,5-diamine Chemical compound NCC(C)CCCN JZUHIOJYCPIVLQ-UHFFFAOYSA-N 0.000 description 1
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 1
- 239000004953 Aliphatic polyamide Substances 0.000 description 1
- OXIKYYJDTWKERT-UHFFFAOYSA-N [4-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCC(CN)CC1 OXIKYYJDTWKERT-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 229920003231 aliphatic polyamide Polymers 0.000 description 1
- 150000001412 amines Chemical group 0.000 description 1
- WEUCVIBPSSMHJG-UHFFFAOYSA-N calcium titanate Chemical compound [O-2].[O-2].[O-2].[Ca+2].[Ti+4] WEUCVIBPSSMHJG-UHFFFAOYSA-N 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 150000003841 chloride salts Chemical class 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000002482 conductive additive Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000010128 melt processing Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- OFVXDJYBTSEQDW-UHFFFAOYSA-N nonane-1,8-diamine Chemical compound CC(N)CCCCCCCN OFVXDJYBTSEQDW-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000012667 polymer degradation Methods 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229920006114 semi-crystalline semi-aromatic polyamide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
- C08K3/14—Carbides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US68977505P | 2005-06-10 | 2005-06-10 | |
| US60/689,775 | 2005-06-10 | ||
| PCT/US2006/022722 WO2006135840A1 (en) | 2005-06-10 | 2006-06-09 | Thermally conductive polyamide-based components used in light emitting diode reflector applications |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2611270A1 true CA2611270A1 (en) | 2006-12-21 |
Family
ID=36950087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002611270A Abandoned CA2611270A1 (en) | 2005-06-10 | 2006-06-09 | Thermally conductive polyamide-based components used in light emitting diode reflector applications |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20060293427A1 (enExample) |
| EP (1) | EP1888688B1 (enExample) |
| JP (1) | JP5368788B2 (enExample) |
| CA (1) | CA2611270A1 (enExample) |
| DE (1) | DE602006018001D1 (enExample) |
| WO (1) | WO2006135840A1 (enExample) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080153959A1 (en) * | 2006-12-20 | 2008-06-26 | General Electric Company | Thermally Conducting and Electrically Insulating Moldable Compositions and Methods of Manufacture Thereof |
| EP2170982A1 (en) * | 2007-07-23 | 2010-04-07 | DSM IP Assets B.V. | Plastic component for a lighting systems |
| ATE544803T1 (de) * | 2007-07-23 | 2012-02-15 | Dsm Ip Assets Bv | E/e-verbinder und darin verwendete polymerzusammensetzung |
| US20090130471A1 (en) * | 2007-11-16 | 2009-05-21 | E.I. Du Pont De Nemours And Company | Thermally conductive plastic resin composition |
| US7845829B2 (en) * | 2008-05-20 | 2010-12-07 | Abl Ip Holding Llc | Enclosures for LED circuit boards |
| US8293831B2 (en) * | 2008-10-30 | 2012-10-23 | E I Du Pont De Nemours And Company | Thermoplastic composition including thermally conductive filler and hyperbranched polyesteramide |
| US20100113669A1 (en) * | 2008-10-30 | 2010-05-06 | E.I. Du Pont De Nemours And Company | Thermoplastic composition including hyperbranched aromatic polyamide |
| CN102639638A (zh) * | 2008-12-24 | 2012-08-15 | 第一毛织株式会社 | 尼龙类合金树脂组合物及其led(发光二极管)反射器 |
| TWI403006B (zh) * | 2009-01-15 | 2013-07-21 | 億光電子工業股份有限公司 | 發光二極體元件封裝結構及其製造方法 |
| WO2011027296A1 (en) * | 2009-09-02 | 2011-03-10 | Koninklijke Philips Electronics N.V. | Window blind |
| AT509091B1 (de) * | 2009-12-01 | 2011-09-15 | Isovoltaic Ag | Solarmodul |
| EP2388293B1 (de) * | 2010-05-17 | 2012-12-26 | Ems-Patent Ag | Polyamidformmasse und deren Verwendung zur Herstellung von LED-Gehäusekomponenten |
| US20120080640A1 (en) * | 2010-09-30 | 2012-04-05 | E.I. Du Pont De Nemours And Company | Thermally conductive resin composition |
| US20120153217A1 (en) * | 2010-12-20 | 2012-06-21 | E.I.Du Pont De Nemours And Company | Thermally conductive polymeric resin composition |
| EP2468809A1 (de) * | 2010-12-23 | 2012-06-27 | LANXESS Deutschland GmbH | Zusammensetzungen |
| US8741998B2 (en) * | 2011-02-25 | 2014-06-03 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof |
| US8552101B2 (en) | 2011-02-25 | 2013-10-08 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof |
| EP2431419A1 (en) | 2011-06-21 | 2012-03-21 | DSM IP Assets B.V. | Anti-yellowing polyamide composition |
| JP2013053188A (ja) * | 2011-09-01 | 2013-03-21 | Unitika Ltd | ポリアミド樹脂組成物およびそれからなる成形体 |
| US9434870B2 (en) | 2012-09-19 | 2016-09-06 | Momentive Performance Materials Inc. | Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics |
| US8946333B2 (en) | 2012-09-19 | 2015-02-03 | Momentive Performance Materials Inc. | Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics |
| US20140077125A1 (en) * | 2012-09-19 | 2014-03-20 | Kang Yi Lin | Composition comprising exfoliated boron nitride and method for forming such compositions |
| US9227347B2 (en) | 2013-02-25 | 2016-01-05 | Sabic Global Technologies B.V. | Method of making a heat sink assembly, heat sink assemblies made therefrom, and illumants using the heat sink assembly |
| CN104774456A (zh) * | 2015-04-01 | 2015-07-15 | 芜湖市鸿坤汽车零部件有限公司 | 一种夜光尼龙插座连接件 |
| CN105238042A (zh) * | 2015-10-27 | 2016-01-13 | 江门市道生工程塑料有限公司 | 一种高导热高韧性尼龙66复合材料及其制备方法 |
| CN105602241B (zh) * | 2016-02-04 | 2018-04-17 | 广东奇德新材料股份有限公司 | 一种纳米导电导热复合材料 |
| CN105542450A (zh) * | 2016-02-04 | 2016-05-04 | 广东奇德新材料股份有限公司 | 一种纳米导电导热复合材料的制备方法 |
| CN106947243A (zh) * | 2017-03-24 | 2017-07-14 | 合肥羿振电力设备有限公司 | 一种灯具外壳及其制备方法 |
| EP3502174B1 (de) | 2017-12-22 | 2020-03-04 | EMS-Patent AG | Wärmeleitfähige polyamid-formmassen |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3833547A (en) * | 1970-10-20 | 1974-09-03 | Standard Oil Co | Polydodecamethylene terephthalamide copolyamide |
| US5319005A (en) * | 1992-01-27 | 1994-06-07 | Hitachi Chemical Co., Ltd. | Epoxy resin molding material for sealing of electronic component |
| JPH07228776A (ja) * | 1994-02-18 | 1995-08-29 | Kuraray Co Ltd | 成形材料用ポリアミド組成物 |
| JPH0959511A (ja) * | 1995-08-18 | 1997-03-04 | Tokai Rubber Ind Ltd | 熱伝導性樹脂組成物 |
| JP4117130B2 (ja) * | 2001-12-26 | 2008-07-16 | 大塚化学ホールディングス株式会社 | 紫外線発生源用反射板材料 |
| CN1585796A (zh) * | 2002-04-05 | 2005-02-23 | 三井化学株式会社 | 发光二极管反射板用树脂组合物 |
| US20030220432A1 (en) * | 2002-04-15 | 2003-11-27 | James Miller | Thermoplastic thermally-conductive interface articles |
| CA2432522C (en) * | 2002-06-21 | 2010-09-21 | Hideaki Oka | Polyamide composition |
| JP2004075994A (ja) * | 2002-06-21 | 2004-03-11 | Kuraray Co Ltd | ポリアミド組成物 |
| JP2004059638A (ja) * | 2002-07-25 | 2004-02-26 | Kuraray Co Ltd | ポリアミド組成物 |
| US7709568B2 (en) * | 2002-10-15 | 2010-05-04 | Solvay Advanced Polymers, Llc | Anti-yellowing polycondensation polymer compositions and articles |
| US6976769B2 (en) * | 2003-06-11 | 2005-12-20 | Cool Options, Inc. | Light-emitting diode reflector assembly having a heat pipe |
| JP4419529B2 (ja) * | 2003-11-19 | 2010-02-24 | 東レ株式会社 | 樹脂組成物、それから得られる成形品 |
-
2006
- 2006-06-08 US US11/449,364 patent/US20060293427A1/en not_active Abandoned
- 2006-06-09 EP EP06772863A patent/EP1888688B1/en not_active Not-in-force
- 2006-06-09 CA CA002611270A patent/CA2611270A1/en not_active Abandoned
- 2006-06-09 WO PCT/US2006/022722 patent/WO2006135840A1/en not_active Ceased
- 2006-06-09 JP JP2008516006A patent/JP5368788B2/ja not_active Expired - Fee Related
- 2006-06-09 DE DE602006018001T patent/DE602006018001D1/de active Active
Also Published As
| Publication number | Publication date |
|---|---|
| EP1888688B1 (en) | 2010-11-03 |
| JP5368788B2 (ja) | 2013-12-18 |
| WO2006135840A1 (en) | 2006-12-21 |
| US20060293427A1 (en) | 2006-12-28 |
| JP2008543991A (ja) | 2008-12-04 |
| EP1888688A1 (en) | 2008-02-20 |
| DE602006018001D1 (de) | 2010-12-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| FZDE | Discontinued |
Effective date: 20140414 |