JP5368788B2 - 発光ダイオードリフレクターの用途で使用される、熱伝導性ポリアミドをベースとする構成部品 - Google Patents
発光ダイオードリフレクターの用途で使用される、熱伝導性ポリアミドをベースとする構成部品 Download PDFInfo
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- JP5368788B2 JP5368788B2 JP2008516006A JP2008516006A JP5368788B2 JP 5368788 B2 JP5368788 B2 JP 5368788B2 JP 2008516006 A JP2008516006 A JP 2008516006A JP 2008516006 A JP2008516006 A JP 2008516006A JP 5368788 B2 JP5368788 B2 JP 5368788B2
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- Prior art keywords
- polyamide
- thermally conductive
- acid
- terephthalic acid
- emitting diode
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- 229920002647 polyamide Polymers 0.000 title description 28
- 239000004952 Polyamide Substances 0.000 title description 27
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 68
- 239000000203 mixture Substances 0.000 claims description 35
- 239000000178 monomer Substances 0.000 claims description 21
- 150000004985 diamines Chemical class 0.000 claims description 17
- 229920006122 polyamide resin Polymers 0.000 claims description 17
- 239000011342 resin composition Substances 0.000 claims description 17
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 16
- 229920006012 semi-aromatic polyamide Polymers 0.000 claims description 16
- -1 aliphatic diamine Chemical class 0.000 claims description 14
- 125000004432 carbon atom Chemical group C* 0.000 claims description 13
- 239000004020 conductor Substances 0.000 claims description 12
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 5
- 229910052580 B4C Inorganic materials 0.000 claims description 5
- 229910052582 BN Inorganic materials 0.000 claims description 5
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 5
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims description 5
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 claims description 5
- 229910001634 calcium fluoride Inorganic materials 0.000 claims description 5
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 20
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 15
- 239000000463 material Substances 0.000 description 15
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 description 13
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 12
- 229920000642 polymer Polymers 0.000 description 12
- 235000011037 adipic acid Nutrition 0.000 description 10
- 239000001361 adipic acid Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 229920002292 Nylon 6 Polymers 0.000 description 8
- 238000000465 moulding Methods 0.000 description 8
- 125000003118 aryl group Chemical group 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- PGGROMGHWHXWJL-UHFFFAOYSA-N 4-(azepane-1-carbonyl)benzamide Chemical compound C1=CC(C(=O)N)=CC=C1C(=O)N1CCCCCC1 PGGROMGHWHXWJL-UHFFFAOYSA-N 0.000 description 6
- 125000001931 aliphatic group Chemical group 0.000 description 6
- TVIDDXQYHWJXFK-UHFFFAOYSA-N dodecanedioic acid Chemical compound OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 description 6
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 6
- 239000000945 filler Substances 0.000 description 6
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 6
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 6
- DJZKNOVUNYPPEE-UHFFFAOYSA-N tetradecane-1,4,11,14-tetracarboxamide Chemical compound NC(=O)CCCC(C(N)=O)CCCCCCC(C(N)=O)CCCC(N)=O DJZKNOVUNYPPEE-UHFFFAOYSA-N 0.000 description 6
- JZUHIOJYCPIVLQ-UHFFFAOYSA-N 2-methylpentane-1,5-diamine Chemical compound NCC(C)CCCN JZUHIOJYCPIVLQ-UHFFFAOYSA-N 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- LKWSTQPRPRGLDP-UHFFFAOYSA-N 4-(azacycloundecane-1-carbonyl)benzamide Chemical compound C1=CC(C(=O)N)=CC=C1C(=O)N1CCCCCCCCCC1 LKWSTQPRPRGLDP-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 3
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 239000011541 reaction mixture Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- YKJHGROHQZNCRV-UHFFFAOYSA-N 1-(azacycloundec-1-yl)dodecan-1-one Chemical compound CCCCCCCCCCCC(=O)N1CCCCCCCCCC1 YKJHGROHQZNCRV-UHFFFAOYSA-N 0.000 description 2
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 description 2
- FQLAJSQGBDYBAL-UHFFFAOYSA-N 3-(azepane-1-carbonyl)benzamide Chemical compound NC(=O)C1=CC=CC(C(=O)N2CCCCCC2)=C1 FQLAJSQGBDYBAL-UHFFFAOYSA-N 0.000 description 2
- WUIAYLSDSVSPRW-UHFFFAOYSA-N 4-(3-methylpiperidine-1-carbonyl)benzamide Chemical compound C1C(C)CCCN1C(=O)C1=CC=C(C(N)=O)C=C1 WUIAYLSDSVSPRW-UHFFFAOYSA-N 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 2
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 2
- 229920000299 Nylon 12 Polymers 0.000 description 2
- 229920002302 Nylon 6,6 Polymers 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000007792 addition Methods 0.000 description 2
- 235000012211 aluminium silicate Nutrition 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 238000010102 injection blow moulding Methods 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- 150000003951 lactams Chemical class 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 150000002739 metals Chemical group 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229920006115 poly(dodecamethylene terephthalamide) Polymers 0.000 description 2
- 229920006128 poly(nonamethylene terephthalamide) Polymers 0.000 description 2
- 239000012266 salt solution Substances 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 229920001897 terpolymer Polymers 0.000 description 2
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 1
- 239000004953 Aliphatic polyamide Substances 0.000 description 1
- OXIKYYJDTWKERT-UHFFFAOYSA-N [4-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCC(CN)CC1 OXIKYYJDTWKERT-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229920003231 aliphatic polyamide Polymers 0.000 description 1
- 150000001412 amines Chemical group 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- WEUCVIBPSSMHJG-UHFFFAOYSA-N calcium titanate Chemical compound [O-2].[O-2].[O-2].[Ca+2].[Ti+4] WEUCVIBPSSMHJG-UHFFFAOYSA-N 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 150000003841 chloride salts Chemical class 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000002482 conductive additive Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- ZAYVYUIRCBOASP-UHFFFAOYSA-N dodecane;terephthalic acid Chemical compound CCCCCCCCCCCC.OC(=O)C1=CC=C(C(O)=O)C=C1 ZAYVYUIRCBOASP-UHFFFAOYSA-N 0.000 description 1
- MGPUUXGHLCLLKJ-UHFFFAOYSA-N dodecanedioic acid;terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1.OC(=O)CCCCCCCCCCC(O)=O MGPUUXGHLCLLKJ-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- QZUPTXGVPYNUIT-UHFFFAOYSA-N isophthalamide Chemical compound NC(=O)C1=CC=CC(C(N)=O)=C1 QZUPTXGVPYNUIT-UHFFFAOYSA-N 0.000 description 1
- 238000010128 melt processing Methods 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- NAYYNDKKHOIIOD-UHFFFAOYSA-N phthalamide Chemical compound NC(=O)C1=CC=CC=C1C(N)=O NAYYNDKKHOIIOD-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000012667 polymer degradation Methods 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229920006114 semi-crystalline semi-aromatic polyamide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 238000003878 thermal aging Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000003039 volatile agent Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
- C08K3/14—Carbides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
(a)約15〜約70重量%の半芳香族ポリアミドと、
(b)約30〜約85重量%の熱伝導性材料と
を含むポリアミド樹脂組成物を含み、重量%は該組成物の総重量を基準とする発光ダイオードアセンブリの熱伝導性構成部品が開示および特許請求される。
(a)反応器にカルボン酸およびジアミンの混合物の水性塩溶液を供給すること;
(b)反応器から排出されている水(蒸気の形態で)および他の揮発性物質によって、反応器の圧力が少なくとも約1300kPaに到達するまで、圧力下で水性塩溶液を加熱すること;
(c)反応混合物の温度が少なくとも約270℃、好ましくは280〜320℃の温度に到達した時、反応混合物の過度の発泡を避ける様式で少なくとも15分間かけて反応器の圧力を気圧まで低下させること;
(d)形成されるポリアミドがあらかじめ決められた分子量に到達するまで、ほぼ気圧より高くない圧力、好ましくは真空下で反応混合物を維持すること;および
(e)ポリアミドを反応器から排出すること。
以下に、本発明の好ましい態様を示す。
[1] 発光ダイオードアセンブリの熱伝導性構成部品であって、該構成部品は、
(a)約15〜約70重量%の半芳香族ポリアミドと、
(b)約30〜約85重量%の熱伝導性材料と
を含むポリアミド樹脂組成物を含み、重量%は該組成物の総重量を基準とすることを特徴とする発光ダイオードアセンブリの熱伝導性構成部品。
[2] 半芳香族ポリアミドが、ヘキサメチレンアジパミド/ヘキサメチレンテレフタルアミドコポリアミド(ポリアミド6,T/6,6);ヘキサメチレンテレフタルアミド/2−メチルペンタメチレンテレフタルアミドコポリアミド(ポリアミド6,T/D,T);ポリ(ドデカメチレンテレフタルアミド)(ポリアミド12,T);ポリ(デカメチレンテレフタルアミド)(ポリアミド10,T);デカメチレンテレフタルアミド/デカメチレンドデカノアミドコポリアミド(10,T/10,12);ポリ(ノナメチレンテレフタルアミド)(ポリアミド9,T);ヘキサメチレンイソフタルアミドおよびヘキサメチレンアジパミドのポリアミド(ポリアミド6,I/6,6);ヘキサメチレンテレフタルアミド、ヘキサメチレンイソフタルアミドおよびヘキサメチレンアジパミドのポリアミド(ポリアミド6,T/6,I/6,6)の1つまたは複数であることを特徴とする[1]に記載の構成部品。
[3] 半芳香族ポリアミドが、
(a)テレフタル酸、ならびに任意選択的に1つまたは複数の追加の芳香族および/または脂肪族ジカルボン酸を含むジカルボン酸モノマーと、
(b)8〜20個の炭素原子を有する1つまたは複数の脂肪族ジアミン、および任意選択的に1つまたは複数の追加のジアミンを含むジアミンモノマーと、
(c)任意選択的に1つまたは複数のアミノカルボン酸および/またはラクタムと
から誘導されることを特徴とする[1]に記載の構成部品。
[4] 成分(b)が、10〜20個の炭素原子を有する1つまたは複数の脂肪族ジアミン、および任意選択的に1つまたは複数の追加のジアミンであることを特徴とする[3]に記載の構成部品。
[5] ジカルボン酸モノマーが、約75〜100モル%のテレフタル酸を含むことを特徴とする[3]に記載の構成部品。
[6] ジカルボン酸モノマーが、約80〜95モル%のテレフタル酸を含むことを特徴とする[3]に記載の構成部品。
[7] ジアミンモノマーが、約75〜100モル%の、8〜20個の炭素原子を有する脂肪族ジアミンを含むことを特徴とする[3]に記載の構成部品。
[8] ジカルボン酸モノマーがテレフタル酸約50〜100モル%と、テレフタル酸以外の少なくとも1つの芳香族ジカルボン酸および/または4〜20個の炭素原子を有する少なくとも1つの脂肪族ジカルボン酸0〜約50モル%とを含み、
ジアミンモノマーが、10〜20個の炭素原子を有する1つまたは複数のジアミン約50〜100モル%、1,9−ジアミノノナン以外の4〜9個の炭素原子を有する少なくとも1つの脂肪族ジアミン0〜約50モル%を含むことを特徴とする[3]に記載の構成部品。
[9] ハウジング、リフレクター、リフレクターカップおよびスクランブラーよりなる群からさらに選択されることを特徴とする[1]に記載の構成部品。
[10] 約10重量%未満の無機充填材をさらに含むことを特徴とする[1]に記載の構成部品。
[11] 前記充填材が、ガラス繊維およびガラスフレークから選択されることを特徴とする[10]に記載の構成部品。
[12] 1つまたは複数の添加剤をさらに含むことを特徴とする[10]に記載の構成部品。
[13] 前記1つまたは複数の添加剤が、安定剤、酸化防止剤、潤滑剤、難燃剤および着色剤よりなる群から独立して選択されることを特徴とする[12]に記載の構成部品。
[14] 前記熱伝導性材料が、約25〜約70重量%の量で組み入れられることを特徴とする[1]に記載の構成部品。
[15] 前記熱伝導性材料が、約30〜約50重量%の量で組み入れられることを特徴とする[1]に記載の構成部品。
[16] 前記熱伝導性材料が、Al2O3、窒化ホウ素、炭化ホウ素、フッ化カルシウムおよび窒化アルミニウムよりなる群から選択されることを特徴とする[1]に記載の構成部品。
[17] 前記熱伝導性材料が、Al2O3、窒化ホウ素、フッ化カルシウムおよび炭化ホウ素よりなる群から選択されることを特徴とする[16]に記載の構成部品。
Claims (1)
- 発光ダイオードアセンブリの熱伝導性構成部品であって、該構成部品は、
(a)15〜70重量%の半芳香族ポリアミドと、
(b)30〜85重量%の熱伝導性材料と
を含むポリアミド樹脂組成物を含み、
前記半芳香族ポリアミドは、75〜100モル%のテレフタル酸を含むジカルボン酸モノマーと、75〜100モル%の炭素数10〜20の脂肪族ジアミンを含むジアミンモノマーと、から誘導され、
前記熱伝導性材料は、Al2O3、窒化ホウ素、炭化ホウ素、フッ化カルシウム、及び窒化アルミニウムからなる群から選択され、
重量%は該組成物の総重量を基準とすることを特徴とする発光ダイオードアセンブリの熱伝導性構成部品。
Applications Claiming Priority (3)
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US68977505P | 2005-06-10 | 2005-06-10 | |
US60/689,775 | 2005-06-10 | ||
PCT/US2006/022722 WO2006135840A1 (en) | 2005-06-10 | 2006-06-09 | Thermally conductive polyamide-based components used in light emitting diode reflector applications |
Publications (3)
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JP2008543991A JP2008543991A (ja) | 2008-12-04 |
JP2008543991A5 JP2008543991A5 (ja) | 2009-05-14 |
JP5368788B2 true JP5368788B2 (ja) | 2013-12-18 |
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JP2008516006A Expired - Fee Related JP5368788B2 (ja) | 2005-06-10 | 2006-06-09 | 発光ダイオードリフレクターの用途で使用される、熱伝導性ポリアミドをベースとする構成部品 |
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US (1) | US20060293427A1 (ja) |
EP (1) | EP1888688B1 (ja) |
JP (1) | JP5368788B2 (ja) |
CA (1) | CA2611270A1 (ja) |
DE (1) | DE602006018001D1 (ja) |
WO (1) | WO2006135840A1 (ja) |
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US20090130471A1 (en) * | 2007-11-16 | 2009-05-21 | E.I. Du Pont De Nemours And Company | Thermally conductive plastic resin composition |
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WO2010074417A2 (ko) * | 2008-12-24 | 2010-07-01 | 제일모직 주식회사 | 나일론계 얼로이 수지 조성물 및 이를 이용한 LED(발광다이오드) 반사체(reflector) |
TWI403006B (zh) * | 2009-01-15 | 2013-07-21 | Everlight Electronics Co Ltd | 發光二極體元件封裝結構及其製造方法 |
WO2011027296A1 (en) * | 2009-09-02 | 2011-03-10 | Koninklijke Philips Electronics N.V. | Window blind |
AT509091B1 (de) * | 2009-12-01 | 2011-09-15 | Isovoltaic Ag | Solarmodul |
EP2388293B1 (de) * | 2010-05-17 | 2012-12-26 | Ems-Patent Ag | Polyamidformmasse und deren Verwendung zur Herstellung von LED-Gehäusekomponenten |
US20120080640A1 (en) * | 2010-09-30 | 2012-04-05 | E.I. Du Pont De Nemours And Company | Thermally conductive resin composition |
US20120153217A1 (en) * | 2010-12-20 | 2012-06-21 | E.I.Du Pont De Nemours And Company | Thermally conductive polymeric resin composition |
EP2468809A1 (de) | 2010-12-23 | 2012-06-27 | LANXESS Deutschland GmbH | Zusammensetzungen |
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EP2431419A1 (en) | 2011-06-21 | 2012-03-21 | DSM IP Assets B.V. | Anti-yellowing polyamide composition |
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US9434870B2 (en) | 2012-09-19 | 2016-09-06 | Momentive Performance Materials Inc. | Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics |
US20140077125A1 (en) * | 2012-09-19 | 2014-03-20 | Kang Yi Lin | Composition comprising exfoliated boron nitride and method for forming such compositions |
US8946333B2 (en) | 2012-09-19 | 2015-02-03 | Momentive Performance Materials Inc. | Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics |
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-
2006
- 2006-06-08 US US11/449,364 patent/US20060293427A1/en not_active Abandoned
- 2006-06-09 DE DE602006018001T patent/DE602006018001D1/de active Active
- 2006-06-09 WO PCT/US2006/022722 patent/WO2006135840A1/en active Application Filing
- 2006-06-09 JP JP2008516006A patent/JP5368788B2/ja not_active Expired - Fee Related
- 2006-06-09 CA CA002611270A patent/CA2611270A1/en not_active Abandoned
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EP1888688B1 (en) | 2010-11-03 |
EP1888688A1 (en) | 2008-02-20 |
DE602006018001D1 (de) | 2010-12-16 |
JP2008543991A (ja) | 2008-12-04 |
WO2006135840A1 (en) | 2006-12-21 |
US20060293427A1 (en) | 2006-12-28 |
CA2611270A1 (en) | 2006-12-21 |
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