JP2011503328A5 - - Google Patents

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Publication number
JP2011503328A5
JP2011503328A5 JP2010534177A JP2010534177A JP2011503328A5 JP 2011503328 A5 JP2011503328 A5 JP 2011503328A5 JP 2010534177 A JP2010534177 A JP 2010534177A JP 2010534177 A JP2010534177 A JP 2010534177A JP 2011503328 A5 JP2011503328 A5 JP 2011503328A5
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JP
Japan
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composition
polymer
composition according
volume percent
thermally conductive
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JP2010534177A
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English (en)
Japanese (ja)
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JP2011503328A (ja
JP5547644B2 (ja
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Priority claimed from PCT/US2008/083401 external-priority patent/WO2009064883A1/en
Publication of JP2011503328A publication Critical patent/JP2011503328A/ja
Publication of JP2011503328A5 publication Critical patent/JP2011503328A5/ja
Application granted granted Critical
Publication of JP5547644B2 publication Critical patent/JP5547644B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010534177A 2007-11-16 2008-11-13 熱伝導性樹脂組成物 Expired - Fee Related JP5547644B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US343007P 2007-11-16 2007-11-16
US61/003,430 2007-11-16
PCT/US2008/083401 WO2009064883A1 (en) 2007-11-16 2008-11-13 Thermally conductive resin compositions

Publications (3)

Publication Number Publication Date
JP2011503328A JP2011503328A (ja) 2011-01-27
JP2011503328A5 true JP2011503328A5 (enExample) 2011-11-24
JP5547644B2 JP5547644B2 (ja) 2014-07-16

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010534177A Expired - Fee Related JP5547644B2 (ja) 2007-11-16 2008-11-13 熱伝導性樹脂組成物

Country Status (5)

Country Link
US (1) US20090152491A1 (enExample)
EP (1) EP2209844A1 (enExample)
JP (1) JP5547644B2 (enExample)
CN (1) CN101861353B (enExample)
WO (1) WO2009064883A1 (enExample)

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