JP5547644B2 - 熱伝導性樹脂組成物 - Google Patents
熱伝導性樹脂組成物 Download PDFInfo
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- JP5547644B2 JP5547644B2 JP2010534177A JP2010534177A JP5547644B2 JP 5547644 B2 JP5547644 B2 JP 5547644B2 JP 2010534177 A JP2010534177 A JP 2010534177A JP 2010534177 A JP2010534177 A JP 2010534177A JP 5547644 B2 JP5547644 B2 JP 5547644B2
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- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- WPUMVKJOWWJPRK-UHFFFAOYSA-N naphthalene-2,7-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=CC2=CC(C(=O)O)=CC=C21 WPUMVKJOWWJPRK-UHFFFAOYSA-N 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- NZIDBRBFGPQCRY-UHFFFAOYSA-N octyl 2-methylprop-2-enoate Chemical compound CCCCCCCCOC(=O)C(C)=C NZIDBRBFGPQCRY-UHFFFAOYSA-N 0.000 description 1
- 150000002924 oxiranes Chemical group 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- GYDSPAVLTMAXHT-UHFFFAOYSA-N pentyl 2-methylprop-2-enoate Chemical compound CCCCCOC(=O)C(C)=C GYDSPAVLTMAXHT-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001279 poly(ester amides) Polymers 0.000 description 1
- 229920006180 poly(hexamethylene terephthalamide)-poly(2-methyl pentamethylene diamine) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- BOQSSGDQNWEFSX-UHFFFAOYSA-N propan-2-yl 2-methylprop-2-enoate Chemical compound CC(C)OC(=O)C(C)=C BOQSSGDQNWEFSX-UHFFFAOYSA-N 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229920006012 semi-aromatic polyamide Polymers 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- BPILDHPJSYVNAF-UHFFFAOYSA-M sodium;diiodomethanesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C(I)I BPILDHPJSYVNAF-UHFFFAOYSA-M 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000003017 thermal stabilizer Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- VJDDQSBNUHLBTD-UHFFFAOYSA-N trans-crotonic acid-anhydride Natural products CC=CC(=O)OC(=O)C=CC VJDDQSBNUHLBTD-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Iron Core Of Rotating Electric Machines (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US343007P | 2007-11-16 | 2007-11-16 | |
| US61/003,430 | 2007-11-16 | ||
| PCT/US2008/083401 WO2009064883A1 (en) | 2007-11-16 | 2008-11-13 | Thermally conductive resin compositions |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011503328A JP2011503328A (ja) | 2011-01-27 |
| JP2011503328A5 JP2011503328A5 (enExample) | 2011-11-24 |
| JP5547644B2 true JP5547644B2 (ja) | 2014-07-16 |
Family
ID=40292433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010534177A Expired - Fee Related JP5547644B2 (ja) | 2007-11-16 | 2008-11-13 | 熱伝導性樹脂組成物 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20090152491A1 (enExample) |
| EP (1) | EP2209844A1 (enExample) |
| JP (1) | JP5547644B2 (enExample) |
| CN (1) | CN101861353B (enExample) |
| WO (1) | WO2009064883A1 (enExample) |
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| US20080153959A1 (en) * | 2006-12-20 | 2008-06-26 | General Electric Company | Thermally Conducting and Electrically Insulating Moldable Compositions and Methods of Manufacture Thereof |
| JP5177089B2 (ja) * | 2008-07-30 | 2013-04-03 | 東レ株式会社 | ポリアリーレンスルフィド樹脂組成物、ポリアリーレンスルフィド樹脂組成物錠剤およびそれらから得られる成形品 |
| WO2010054241A2 (en) * | 2008-11-07 | 2010-05-14 | Saint-Gobain Performance Plastics Corporation | Large diameter thermoplastic seal |
| US20120080640A1 (en) * | 2010-09-30 | 2012-04-05 | E.I. Du Pont De Nemours And Company | Thermally conductive resin composition |
| EP2646154A2 (en) * | 2010-11-30 | 2013-10-09 | Quantumdx Group Limited | The design, fabrication and use of a microfluidics multitemperature flexible reaction device |
| US20120157600A1 (en) * | 2010-12-20 | 2012-06-21 | E.I.Du Pont De Nemours And Company | Molded thermoplastic articles comprising thermally conductive polymers |
| US20120153217A1 (en) * | 2010-12-20 | 2012-06-21 | E.I.Du Pont De Nemours And Company | Thermally conductive polymeric resin composition |
| CN102070899B (zh) * | 2010-12-30 | 2012-11-07 | 广东银禧科技股份有限公司 | 一种绝缘导热聚酰胺复合材料及制备方法 |
| CN102593338A (zh) * | 2011-01-07 | 2012-07-18 | 昆山雅森电子材料科技有限公司 | 薄型高导热金属基板及其制作方法 |
| US8741998B2 (en) | 2011-02-25 | 2014-06-03 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof |
| US8552101B2 (en) | 2011-02-25 | 2013-10-08 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof |
| JP2012238819A (ja) * | 2011-05-13 | 2012-12-06 | Nitto Denko Corp | 熱伝導性シート、絶縁シートおよび放熱部材 |
| JP2012238820A (ja) * | 2011-05-13 | 2012-12-06 | Nitto Denko Corp | 熱伝導性シート、絶縁シートおよび放熱部材 |
| JP5819703B2 (ja) * | 2011-10-27 | 2015-11-24 | 株式会社神戸製鋼所 | 電動機 |
| TWI424014B (zh) * | 2011-11-08 | 2014-01-21 | Kenner Material & System Co Ltd | 阻燃導熱塑膠組成物 |
| CN103160134A (zh) * | 2011-12-14 | 2013-06-19 | 中国钢铁股份有限公司 | 导热性聚合物复合材料 |
| KR101457016B1 (ko) | 2011-12-30 | 2014-11-03 | 제일모직주식회사 | 내습성 및 열전도성이 우수한 열가소성 수지 조성물 및 성형품 |
| CN102617886A (zh) * | 2012-01-06 | 2012-08-01 | 上海同立电工材料有限公司 | 导热填料在vpi真空压力浸渍树脂中的应用 |
| CN102627937B (zh) * | 2012-03-27 | 2014-04-30 | 合肥工业大学 | 一种双组分导热聚氨酯灌封胶及其制备方法 |
| KR20130110037A (ko) * | 2012-03-27 | 2013-10-08 | 레미 테크놀러지스 엘엘씨 | 열 전도성 화합물을 갖는 ipm 기계 |
| JP5932480B2 (ja) | 2012-05-02 | 2016-06-08 | デュポン株式会社 | 黒鉛が充填されたポリエステル組成物 |
| US10093069B2 (en) | 2012-05-23 | 2018-10-09 | Saint-Gobain Performance Plastics Corporation | Method of forming large diameter thermoplastic seal |
| KR101596546B1 (ko) * | 2013-02-21 | 2016-03-07 | 제일모직주식회사 | 내충격성이 우수한 열전도성 폴리카보네이트 수지조성물 |
| US9227347B2 (en) | 2013-02-25 | 2016-01-05 | Sabic Global Technologies B.V. | Method of making a heat sink assembly, heat sink assemblies made therefrom, and illumants using the heat sink assembly |
| JP6316556B2 (ja) * | 2013-08-29 | 2018-04-25 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ | 電気絶縁性および熱伝導性のポリマー組成物 |
| JP2015059130A (ja) * | 2013-09-17 | 2015-03-30 | 明和化成株式会社 | エポキシ樹脂組成物、その用途及びエポキシ樹脂組成物用充填材 |
| EP3152260B1 (en) * | 2014-06-09 | 2021-03-31 | SHPP Global Technologies B.V. | Thermal conductive compositions having good impact performance |
| JP6580851B2 (ja) * | 2015-03-31 | 2019-10-02 | 国立大学法人広島大学 | 高熱伝導性電気絶縁組成物 |
| FR3034771B1 (fr) | 2015-04-13 | 2019-04-19 | Hutchinson | Materiaux conducteurs thermiques et/ou electriques et leur procede de preparation |
| FR3034775B1 (fr) | 2015-04-13 | 2018-09-28 | Hutchinson | Materiau pour le stockage thermique |
| CN107787349A (zh) * | 2015-06-29 | 2018-03-09 | 沙特基础工业全球技术公司 | 导热聚合物复合材料 |
| TWI708806B (zh) | 2015-08-17 | 2020-11-01 | 美商堤康那責任有限公司 | 用於相機模組之液晶聚合物組合物 |
| JP6335374B2 (ja) * | 2017-07-25 | 2018-05-30 | 明和化成株式会社 | エポキシ樹脂組成物及びその用途 |
| JP7248217B2 (ja) * | 2017-12-04 | 2023-03-29 | 積水ポリマテック株式会社 | 熱伝導性組成物 |
| CN108587155A (zh) * | 2018-05-25 | 2018-09-28 | 郑州智锦电子科技有限公司 | 一种导热聚酰胺复合材料及其制备方法 |
| FR3084202B1 (fr) * | 2018-07-20 | 2020-10-23 | Inst Supergrid | Materiau d'isolation electrique comprenant un melange de charges inorganiques micrometriques et procede de fabrication |
| CN113574106A (zh) * | 2019-01-11 | 2021-10-29 | 杜邦聚合物公司 | 电绝缘且导热的聚合物组合物 |
| FR3098817A1 (fr) * | 2019-07-16 | 2021-01-22 | Ppg Industries Ohio, Inc. | Compositions contenant des charges thermiquement conductrices |
| CN110423447A (zh) * | 2019-08-19 | 2019-11-08 | 浙江衡昶科技有限公司 | 一种由改性天然植物纤维、生物基材料补强增韧不饱和聚酯树脂的制备方法 |
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| JPH03200397A (ja) * | 1989-12-27 | 1991-09-02 | Tokai Rubber Ind Ltd | 放熱シート |
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| WO2006006535A1 (ja) * | 2004-07-12 | 2006-01-19 | Mitsubishi Engineering-Plastics Corporation | 熱可塑性樹脂組成物 |
| JP2006109600A (ja) * | 2004-10-04 | 2006-04-20 | Toshiba Corp | 回転電機の固定子コイルおよびその固定方法 |
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| JP4709795B2 (ja) * | 2007-03-16 | 2011-06-22 | 株式会社東芝 | 高熱伝導性材料 |
| US20090130471A1 (en) * | 2007-11-16 | 2009-05-21 | E.I. Du Pont De Nemours And Company | Thermally conductive plastic resin composition |
-
2008
- 2008-11-12 US US12/291,590 patent/US20090152491A1/en not_active Abandoned
- 2008-11-13 EP EP08848744A patent/EP2209844A1/en not_active Withdrawn
- 2008-11-13 JP JP2010534177A patent/JP5547644B2/ja not_active Expired - Fee Related
- 2008-11-13 CN CN2008801161874A patent/CN101861353B/zh not_active Expired - Fee Related
- 2008-11-13 WO PCT/US2008/083401 patent/WO2009064883A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| CN101861353A (zh) | 2010-10-13 |
| JP2011503328A (ja) | 2011-01-27 |
| WO2009064883A1 (en) | 2009-05-22 |
| EP2209844A1 (en) | 2010-07-28 |
| US20090152491A1 (en) | 2009-06-18 |
| CN101861353B (zh) | 2013-07-17 |
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