JP4764351B2 - 熱伝導性熱可塑性樹脂組成物 - Google Patents
熱伝導性熱可塑性樹脂組成物 Download PDFInfo
- Publication number
- JP4764351B2 JP4764351B2 JP2006549538A JP2006549538A JP4764351B2 JP 4764351 B2 JP4764351 B2 JP 4764351B2 JP 2006549538 A JP2006549538 A JP 2006549538A JP 2006549538 A JP2006549538 A JP 2006549538A JP 4764351 B2 JP4764351 B2 JP 4764351B2
- Authority
- JP
- Japan
- Prior art keywords
- composition
- polymer
- weight percent
- thermoplastic
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011342 resin composition Substances 0.000 title description 4
- 229920005992 thermoplastic resin Polymers 0.000 title description 4
- 239000000203 mixture Substances 0.000 claims description 89
- 229920001169 thermoplastic Polymers 0.000 claims description 55
- 229920000728 polyester Polymers 0.000 claims description 30
- 229920000642 polymer Polymers 0.000 claims description 29
- 239000004416 thermosoftening plastic Substances 0.000 claims description 25
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 19
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 17
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 claims description 17
- 229910001634 calcium fluoride Inorganic materials 0.000 claims description 17
- 239000012765 fibrous filler Substances 0.000 claims description 15
- 239000000835 fiber Substances 0.000 claims description 7
- 239000003365 glass fiber Substances 0.000 claims description 5
- 238000012360 testing method Methods 0.000 claims description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
- 239000010456 wollastonite Substances 0.000 claims description 4
- 229910052882 wollastonite Inorganic materials 0.000 claims description 4
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 claims description 2
- 239000012745 toughening agent Substances 0.000 description 26
- 229920001577 copolymer Polymers 0.000 description 24
- 229920000139 polyethylene terephthalate Polymers 0.000 description 13
- 239000005020 polyethylene terephthalate Substances 0.000 description 13
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 12
- 239000005977 Ethylene Substances 0.000 description 12
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 12
- 239000004952 Polyamide Substances 0.000 description 12
- 239000000178 monomer Substances 0.000 description 12
- 229920002647 polyamide Polymers 0.000 description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 11
- 125000000524 functional group Chemical group 0.000 description 11
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 10
- 229920006324 polyoxymethylene Polymers 0.000 description 9
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 8
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- -1 aluminum Chemical class 0.000 description 7
- 229920000233 poly(alkylene oxides) Polymers 0.000 description 7
- 229920000058 polyacrylate Polymers 0.000 description 7
- 229920000098 polyolefin Polymers 0.000 description 7
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 6
- 239000004696 Poly ether ether ketone Substances 0.000 description 6
- 229930182556 Polyacetal Natural products 0.000 description 6
- 239000004721 Polyphenylene oxide Substances 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- 229920001519 homopolymer Polymers 0.000 description 6
- 239000004014 plasticizer Substances 0.000 description 6
- 229920001652 poly(etherketoneketone) Polymers 0.000 description 6
- 229920000515 polycarbonate Polymers 0.000 description 6
- 239000004417 polycarbonate Substances 0.000 description 6
- 229920002530 polyetherether ketone Polymers 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 239000004734 Polyphenylene sulfide Substances 0.000 description 5
- 229920010524 Syndiotactic polystyrene Polymers 0.000 description 5
- 125000003118 aryl group Chemical group 0.000 description 5
- 239000011258 core-shell material Substances 0.000 description 5
- 150000002009 diols Chemical class 0.000 description 5
- 125000003700 epoxy group Chemical group 0.000 description 5
- 239000003063 flame retardant Substances 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000155 melt Substances 0.000 description 5
- 229920002492 poly(sulfone) Polymers 0.000 description 5
- 229920001230 polyarylate Polymers 0.000 description 5
- 229920006380 polyphenylene oxide Polymers 0.000 description 5
- 229920000069 polyphenylene sulfide Polymers 0.000 description 5
- 239000012744 reinforcing agent Substances 0.000 description 5
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 4
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 150000001991 dicarboxylic acids Chemical class 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- OBETXYAYXDNJHR-UHFFFAOYSA-N 2-Ethylhexanoic acid Chemical compound CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 3
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 3
- 150000008065 acid anhydrides Chemical class 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- SHZIWNPUGXLXDT-UHFFFAOYSA-N caproic acid ethyl ester Natural products CCCCCC(=O)OCC SHZIWNPUGXLXDT-UHFFFAOYSA-N 0.000 description 3
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 3
- 150000001735 carboxylic acids Chemical class 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 229910052500 inorganic mineral Inorganic materials 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000010445 mica Substances 0.000 description 3
- 229910052618 mica group Inorganic materials 0.000 description 3
- 239000011707 mineral Substances 0.000 description 3
- 239000002667 nucleating agent Substances 0.000 description 3
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 3
- 229920001707 polybutylene terephthalate Polymers 0.000 description 3
- 239000002952 polymeric resin Substances 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- TVIDDXQYHWJXFK-UHFFFAOYSA-N dodecanedioic acid Chemical compound OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- LYBIZMNPXTXVMV-UHFFFAOYSA-N propan-2-yl prop-2-enoate Chemical compound CC(C)OC(=O)C=C LYBIZMNPXTXVMV-UHFFFAOYSA-N 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 159000000000 sodium salts Chemical class 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 2
- 229920001897 terpolymer Polymers 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- GRKDVZMVHOLESV-UHFFFAOYSA-N (2,3,4,5,6-pentabromophenyl)methyl prop-2-enoate Chemical compound BrC1=C(Br)C(Br)=C(COC(=O)C=C)C(Br)=C1Br GRKDVZMVHOLESV-UHFFFAOYSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- KQEIJFWAXDQUPR-UHFFFAOYSA-N 2,4-diaminophenol;hydron;dichloride Chemical compound Cl.Cl.NC1=CC=C(O)C(N)=C1 KQEIJFWAXDQUPR-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- UPHOPMSGKZNELG-UHFFFAOYSA-N 2-hydroxynaphthalene-1-carboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=C(O)C=CC2=C1 UPHOPMSGKZNELG-UHFFFAOYSA-N 0.000 description 1
- JZUHIOJYCPIVLQ-UHFFFAOYSA-N 2-methylpentane-1,5-diamine Chemical compound NCC(C)CCCN JZUHIOJYCPIVLQ-UHFFFAOYSA-N 0.000 description 1
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 1
- WSQZNZLOZXSBHA-UHFFFAOYSA-N 3,8-dioxabicyclo[8.2.2]tetradeca-1(12),10,13-triene-2,9-dione Chemical compound O=C1OCCCCOC(=O)C2=CC=C1C=C2 WSQZNZLOZXSBHA-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- VTDMBRAUHKUOON-UHFFFAOYSA-N 4-[(4-carboxyphenyl)methyl]benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1CC1=CC=C(C(O)=O)C=C1 VTDMBRAUHKUOON-UHFFFAOYSA-N 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- SFHBJXIEBWOOFA-UHFFFAOYSA-N 5-methyl-3,6-dioxabicyclo[6.2.2]dodeca-1(10),8,11-triene-2,7-dione Chemical compound O=C1OC(C)COC(=O)C2=CC=C1C=C2 SFHBJXIEBWOOFA-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000004953 Aliphatic polyamide Substances 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000004609 Impact Modifier Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920000305 Nylon 6,10 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 229920000572 Nylon 6/12 Polymers 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 229920012196 Polyoxymethylene Copolymer Polymers 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 229920013651 Zenite Polymers 0.000 description 1
- VJDDQSBNUHLBTD-GGWOSOGESA-N [(e)-but-2-enoyl] (e)-but-2-enoate Chemical compound C\C=C\C(=O)OC(=O)\C=C\C VJDDQSBNUHLBTD-GGWOSOGESA-N 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229920003231 aliphatic polyamide Polymers 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000002482 conductive additive Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- VEIOBOXBGYWJIT-UHFFFAOYSA-N cyclohexane;methanol Chemical compound OC.OC.C1CCCCC1 VEIOBOXBGYWJIT-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- FOTKYAAJKYLFFN-UHFFFAOYSA-N decane-1,10-diol Chemical compound OCCCCCCCCCCO FOTKYAAJKYLFFN-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- UHPJWJRERDJHOJ-UHFFFAOYSA-N ethene;naphthalene-1-carboxylic acid Chemical compound C=C.C1=CC=C2C(C(=O)O)=CC=CC2=C1 UHPJWJRERDJHOJ-UHFFFAOYSA-N 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000010102 injection blow moulding Methods 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 125000005647 linker group Chemical group 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000004668 long chain fatty acids Chemical class 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229920001427 mPEG Polymers 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical class C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- DFFZOPXDTCDZDP-UHFFFAOYSA-N naphthalene-1,5-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=CC2=C1C(O)=O DFFZOPXDTCDZDP-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical class C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- WPUMVKJOWWJPRK-UHFFFAOYSA-N naphthalene-2,7-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=CC2=CC(C(=O)O)=CC=C21 WPUMVKJOWWJPRK-UHFFFAOYSA-N 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- NZIDBRBFGPQCRY-UHFFFAOYSA-N octyl 2-methylprop-2-enoate Chemical compound CCCCCCCCOC(=O)C(C)=C NZIDBRBFGPQCRY-UHFFFAOYSA-N 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 150000002924 oxiranes Chemical group 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- GYDSPAVLTMAXHT-UHFFFAOYSA-N pentyl 2-methylprop-2-enoate Chemical compound CCCCCOC(=O)C(C)=C GYDSPAVLTMAXHT-UHFFFAOYSA-N 0.000 description 1
- 229910052628 phlogopite Inorganic materials 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001279 poly(ester amides) Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 1
- BOQSSGDQNWEFSX-UHFFFAOYSA-N propan-2-yl 2-methylprop-2-enoate Chemical compound CC(C)OC(=O)C(C)=C BOQSSGDQNWEFSX-UHFFFAOYSA-N 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229920006012 semi-aromatic polyamide Polymers 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical class [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- WXMKPNITSTVMEF-UHFFFAOYSA-M sodium benzoate Chemical compound [Na+].[O-]C(=O)C1=CC=CC=C1 WXMKPNITSTVMEF-UHFFFAOYSA-M 0.000 description 1
- 239000004299 sodium benzoate Substances 0.000 description 1
- 235000010234 sodium benzoate Nutrition 0.000 description 1
- BPILDHPJSYVNAF-UHFFFAOYSA-M sodium;diiodomethanesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C(I)I BPILDHPJSYVNAF-UHFFFAOYSA-M 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- VJDDQSBNUHLBTD-UHFFFAOYSA-N trans-crotonic acid-anhydride Natural products CC=CC(=O)OC(=O)C=CC VJDDQSBNUHLBTD-UHFFFAOYSA-N 0.000 description 1
- NSBGJRFJIJFMGW-UHFFFAOYSA-N trisodium;stiborate Chemical compound [Na+].[Na+].[Na+].[O-][Sb]([O-])([O-])=O NSBGJRFJIJFMGW-UHFFFAOYSA-N 0.000 description 1
- 239000000326 ultraviolet stabilizing agent Substances 0.000 description 1
- PGNWIWKMXVDXHP-UHFFFAOYSA-L zinc;1,3-benzothiazole-2-thiolate Chemical compound [Zn+2].C1=CC=C2SC([S-])=NC2=C1.C1=CC=C2SC([S-])=NC2=C1 PGNWIWKMXVDXHP-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/16—Halogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/50—Physical properties
- C08G2261/51—Charge transport
- C08G2261/514—Electron transport
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
- C08K5/134—Phenols containing ester groups
- C08K5/1345—Carboxylic esters of phenolcarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/12—Polymer mixtures characterised by other features containing additives being liquid crystalline or anisotropic in the melt
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C08L23/0869—Acids or derivatives thereof
- C08L23/0884—Epoxide containing esters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
(a)熱可塑性ポリエステル、ポリアミド、ポリアセタール、ポリカーボネート、ポリフェニレンオキシド、ポリフェニレンスルフィド、ポリスルホン、ポリアリーレート、ポリエーテルエーテルケトン、ポリエーテルケトンケトン、およびシンジオタクチックポリスチレンからなる群から選択される、約15〜約70重量パーセントの少なくとも1種の等方性熱可塑性ポリマーと;
(b)約30〜約70重量パーセントの非コートフッ化カルシウムと;
(c)0〜約30重量パーセントの少なくとも1種の繊維状充填材と;
(d)0〜約40重量パーセントの少なくとも1種の液晶ポリマーと;
(e)0〜約15重量パーセントの少なくとも1種のポリマー強化剤と、
を含む熱伝導性熱可塑性ポリマー組成物が開示され、および権利請求される。
(a)熱可塑性ポリエステル、ポリアミド、ポリアセタール、ポリカーボネート、ポリフェニレンオキシド、ポリフェニレンスルフィド、ポリスルホン、ポリアリーレート、ポリエーテルエーテルケトン、ポリエーテルケトンケトン、およびシンジオタクチックポリスチレンからなる群から選択される、約15〜約70重量パーセントの少なくとも1種の等方性熱可塑剤と;
(b)約30〜約70重量パーセントの表面コートされたフッ化カルシウムと;
(c)約2〜約15重量パーセントの少なくとも1種のポリマー強化剤または約5〜約40重量パーセントの少なくとも1種の液晶ポリマー、あるいはこれらの混合物と;
(d)0〜約30重量パーセントの少なくとも1種の繊維状充填材と;
を含む熱伝導性熱可塑性ポリマー組成物が開示され、および権利請求される。
表1に示されたポリマー組成物を、30mmのヴェルナーアンドプフライデラー(Werner and Pfleiderer)二軸スクリュー押出機中で配合することにより調製した。全部の要素を一緒にブレンドし、押出し機の後方(バレル1)に加えた。ただし、ニグロス(Nyglos)およびガラスファイバーは、バレル5(10バレルの内の)にサイドフィードし、可塑剤は液体注入ポンプを用いて加えた。ポリ(ブチレンテレフタレート)組成物については約270℃およびポリ(エチレンテレフタレート)組成物については約285℃にバレル温度を設定し、結果的にそれぞれ、約280℃および320℃の溶融温度となった。
熱伝導性を、ASTM F−433−77に従い、2インチの直径で厚さが1/8インチのディスクについて、ホロメトリックス(Holometrix)TCA−300熱伝導性分析器を用いて50℃で測定した。その結果を表1に示す。少なくとも0.5W/m・Kの熱伝導性が許容可能であるとみなされる。
PBTは、本願特許出願人製の、クラスチン(Crastin)(登録商標)6131、内部粘度が約0.82であるポリ(ブチレンテレフタレート)ホモポリマーを指す。
以下に、本発明の好ましい態様を示す。
[1] 熱伝導性熱可塑性ポリマー組成物であって、この組成物の総重量に基づいた割合で、
(a)熱可塑性ポリエステル、ポリアミド、ポリアセタール、ポリカーボネート、ポリフェニレンオキシド、ポリフェニレンスルフィド、ポリスルホン、ポリアリーレート、ポリエーテルエーテルケトン、ポリエーテルケトンケトン、およびシンジオタクチックポリスチレンからなる群から選択される、約15〜約70重量パーセントの少なくとも1種の等方性熱可塑性ポリマーと;
(b)約30〜約70重量パーセントの非コートフッ化カルシウムと;
(c)0〜約30重量パーセントの少なくとも1種の繊維状充填材と;
(d)0〜約40重量パーセントの少なくとも1種の液晶ポリマーと;
(e)0〜約15重量パーセントの少なくとも1種のポリマー強化剤と
を含むことを特徴とする熱伝導性熱可塑性ポリマー組成物。
[2] 繊維状充填材は、組成物の総重量に基づいて5〜約30重量パーセントで存在することを特徴とする[1]に記載の組成物。
[3] 液晶ポリマーは、組成物の総重量に基づいて約5〜約40重量パーセントで存在することを特徴とする[1]に記載の組成物。
[4] 熱可塑性ポリマーは、少なくとも1種の熱可塑性ポリエステルであることを特徴とする[1]に記載の組成物。
[5] ポリマー強化剤は、組成物の総重量に基づいて約2〜約15重量パーセントで存在することを特徴とする[1]に記載の組成物。
[6] 繊維状充填材は、珪灰石であることを特徴とする[1]に記載の組成物。
[7] ポリマー強化剤は、エチレンと、ブチルアクリレートと、グリシジルメタクリレートとのコポリマー、および/またはエチレンと、エチルアクリレートと、グリシジルメタクリレートとのコポリマーであることを特徴とする[4]に記載の組成物。
[8] ポリマー強化剤は、コアシェルアクリルポリマーであることを特徴とする[4]に記載の組成物。
[9] 熱伝導性熱可塑性ポリマー組成物であって、この組成物の総重量に基づいた割合で、
(a)熱可塑性ポリエステル、ポリアミド、ポリアセタール、ポリカーボネート、ポリフェニレンオキシド、ポリフェニレンスルフィド、ポリスルホン、ポリアリーレート、ポリエーテルエーテルケトン、ポリエーテルケトンケトン、およびシンジオタクチックポリスチレンからなる群から選択される約15〜約70重量パーセントの少なくとも1種の等方性熱可塑剤と;
(b)約30〜約70重量パーセントの表面コートされたフッ化カルシウムと;
(c)約2〜約15重量パーセントの少なくとも1種のポリマー強化剤または約5〜約40重量パーセントの少なくとも1種の液晶ポリマー、あるいはこれらの混合物と;
(d)0〜約30重量パーセントの少なくとも1種の繊維状充填材と
を含むことを特徴とする熱伝導性熱可塑性ポリマー組成物。
[10] 繊維状充填材は、組成物の総重量に基づいて5〜約30重量パーセントで存在することを特徴とする[9]に記載の組成物。
[11] 熱可塑性ポリマーは、少なくとも1種の熱可塑性ポリエステルであることを特徴とする[9]に記載の組成物。
[12] ポリマー強化剤は、エチレンと、ブチルアクリレートと、グリシジルメタクリレートとのコポリマー、および/またはエチレンと、エチルアクリレートと、グリシジルメタクリレートとのコポリマーであることを特徴とする[9]に記載の組成物。
[13] ポリマー強化剤は、コアシェルアクリルポリマーであることを特徴とする[9]に記載の組成物。
[14] [1]に記載の組成物から製造されることを特徴とする物品。
[15] モータハウジングの形態であることを特徴とする[14]に記載の物品。
[16] 自動車用ランプハウジングの形態であることを特徴とする[14]に記載の物品。
[17] [9]に記載の組成物から製造されることを特徴とする物品。
Claims (2)
- 熱伝導性熱可塑性ポリマー組成物であって、この組成物の総重量に基づいた割合で、
(a)熱可塑性ポリエステルからなる群から選択される、15〜70重量パーセントの少なくとも1種の等方性熱可塑性ポリマーと;
(b)30〜70重量パーセントの非コートフッ化カルシウムと;
(c)0〜30重量パーセントの少なくとも1種の繊維状充填材と;
(d)5〜40重量パーセントの少なくとも1種の液晶ポリマーと
を含み、前記繊維状充填材は、珪灰石、ガラスファイバー、ホウ酸アルミニウム繊維、炭酸カルシウム繊維、およびチタン酸カリウム繊維からなる群から選択され、前記液晶ポリマーはTOTテストによってテストされた場合に異方性を示すポリマーであることを特徴とする熱伝導性熱可塑性ポリマー組成物。 - 請求項1に記載の組成物から製造されることを特徴とする物品。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US53592904P | 2004-01-12 | 2004-01-12 | |
US60/535,929 | 2004-01-12 | ||
PCT/US2005/000866 WO2005071001A1 (en) | 2004-01-12 | 2005-01-11 | Thermally conductive thermoplastic resin compositions |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007517968A JP2007517968A (ja) | 2007-07-05 |
JP2007517968A5 JP2007517968A5 (ja) | 2011-01-27 |
JP4764351B2 true JP4764351B2 (ja) | 2011-08-31 |
Family
ID=34806972
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006549538A Expired - Fee Related JP4764351B2 (ja) | 2004-01-12 | 2005-01-11 | 熱伝導性熱可塑性樹脂組成物 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20050176835A1 (ja) |
EP (1) | EP1704179B1 (ja) |
JP (1) | JP4764351B2 (ja) |
CA (1) | CA2552080A1 (ja) |
WO (1) | WO2005071001A1 (ja) |
Families Citing this family (98)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7163421B1 (en) * | 2005-06-30 | 2007-01-16 | Amphenol Corporation | High speed high density electrical connector |
US20090291593A1 (en) | 2005-06-30 | 2009-11-26 | Prescott Atkinson | High frequency broadside-coupled electrical connector |
JP2007070374A (ja) * | 2005-09-02 | 2007-03-22 | Omron Corp | 高周波用部品 |
US8007885B2 (en) * | 2005-09-14 | 2011-08-30 | Georgios Topoulos | Light-emitting diode assembly housing comprising poly(cyclohexanedimethanol terephthalate) compositions |
EP1837884B1 (en) * | 2006-03-22 | 2008-08-13 | Premix Oy | Electrically conductive elastomer mixture, method for its manufacture, and use thereof |
US7794278B2 (en) * | 2007-04-04 | 2010-09-14 | Amphenol Corporation | Electrical connector lead frame |
US7722401B2 (en) * | 2007-04-04 | 2010-05-25 | Amphenol Corporation | Differential electrical connector with skew control |
US7794240B2 (en) * | 2007-04-04 | 2010-09-14 | Amphenol Corporation | Electrical connector with complementary conductive elements |
US20090130471A1 (en) * | 2007-11-16 | 2009-05-21 | E.I. Du Pont De Nemours And Company | Thermally conductive plastic resin composition |
US20090152491A1 (en) * | 2007-11-16 | 2009-06-18 | E. I. Du Pont De Nemours And Company | Thermally conductive resin compositions |
WO2009091598A2 (en) | 2008-01-17 | 2009-07-23 | Amphenol Corporation | Electrical connector assembly |
US8293831B2 (en) * | 2008-10-30 | 2012-10-23 | E I Du Pont De Nemours And Company | Thermoplastic composition including thermally conductive filler and hyperbranched polyesteramide |
US8172614B2 (en) | 2009-02-04 | 2012-05-08 | Amphenol Corporation | Differential electrical connector with improved skew control |
WO2011010290A1 (en) | 2009-07-24 | 2011-01-27 | Ticona Llc | Thermally conductive thermoplastic resin compositions and related applications |
KR20120051712A (ko) * | 2009-07-24 | 2012-05-22 | 티코나 엘엘씨 | 열전도성 중합체 조성물 및 이로부터 제조된 물품 |
US8550861B2 (en) * | 2009-09-09 | 2013-10-08 | Amphenol TCS | Compressive contact for high speed electrical connector |
CN102714363B (zh) | 2009-11-13 | 2015-11-25 | 安费诺有限公司 | 高性能小形状因数的连接器 |
EP2539971A4 (en) | 2010-02-24 | 2014-08-20 | Amphenol Corp | CONNECTOR WITH HIGH BANDWIDTH |
KR20130009981A (ko) * | 2010-02-25 | 2013-01-24 | 티코나 엘엘씨 | 열 전도성 및 치수 안정성 액정 중합체 조성물 |
CN107069274B (zh) | 2010-05-07 | 2020-08-18 | 安费诺有限公司 | 高性能线缆连接器 |
US8796371B2 (en) * | 2010-08-09 | 2014-08-05 | Kabushiki Kaisha Toyota Chuo Kenkyusho | Resin composition and electrically insulating part obtained from the same |
US20120080640A1 (en) | 2010-09-30 | 2012-04-05 | E.I. Du Pont De Nemours And Company | Thermally conductive resin composition |
US20120153217A1 (en) * | 2010-12-20 | 2012-06-21 | E.I.Du Pont De Nemours And Company | Thermally conductive polymeric resin composition |
CN103477503B (zh) | 2011-02-02 | 2016-01-20 | 安费诺有限公司 | 夹层连接器 |
US8552101B2 (en) | 2011-02-25 | 2013-10-08 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof |
US8741998B2 (en) | 2011-02-25 | 2014-06-03 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof |
PL2500577T3 (pl) | 2011-03-12 | 2016-12-30 | Pompa obiegowa do instalacji grzewczej | |
US9062198B2 (en) | 2011-04-14 | 2015-06-23 | Ticona Llc | Reflectors for light-emitting diode assemblies containing a white pigment |
US9453119B2 (en) | 2011-04-14 | 2016-09-27 | Ticona Llc | Polymer composition for producing articles with light reflective properties |
US9284448B2 (en) | 2011-04-14 | 2016-03-15 | Ticona Llc | Molded reflectors for light-emitting diode assemblies |
US8915617B2 (en) * | 2011-10-14 | 2014-12-23 | Ovation Polymer Technology And Engineered Materials, Inc. | Thermally conductive thermoplastic for light emitting diode fixture assembly |
US9004942B2 (en) | 2011-10-17 | 2015-04-14 | Amphenol Corporation | Electrical connector with hybrid shield |
CN104204055B (zh) | 2011-12-30 | 2016-05-25 | 提克纳有限责任公司 | 用于发光装置的反射器 |
CN108336593B (zh) | 2012-06-29 | 2019-12-17 | 安费诺有限公司 | 低成本高性能的射频连接器 |
CN104704682B (zh) | 2012-08-22 | 2017-03-22 | 安费诺有限公司 | 高频电连接器 |
CN104736672B (zh) | 2012-10-16 | 2017-10-24 | 提克纳有限责任公司 | 抗静电液晶聚合物组合物 |
US9355753B2 (en) | 2012-12-05 | 2016-05-31 | Ticona Llc | Conductive liquid crystalline polymer composition |
JP2016504459A (ja) | 2012-12-18 | 2016-02-12 | ティコナ・エルエルシー | 発光ダイオードアセンブリ用の成形反射体 |
US9227347B2 (en) | 2013-02-25 | 2016-01-05 | Sabic Global Technologies B.V. | Method of making a heat sink assembly, heat sink assemblies made therefrom, and illumants using the heat sink assembly |
US9520689B2 (en) | 2013-03-13 | 2016-12-13 | Amphenol Corporation | Housing for a high speed electrical connector |
JP2016510831A (ja) | 2013-03-13 | 2016-04-11 | ティコナ・エルエルシー | 液晶ポリマー組成物 |
US9484674B2 (en) | 2013-03-14 | 2016-11-01 | Amphenol Corporation | Differential electrical connector with improved skew control |
JP6438271B2 (ja) * | 2013-10-24 | 2018-12-12 | 三菱エンジニアリングプラスチックス株式会社 | 熱可塑性ポリエステル樹脂組成物 |
US9905975B2 (en) | 2014-01-22 | 2018-02-27 | Amphenol Corporation | Very high speed, high density electrical interconnection system with edge to broadside transition |
JP2017513977A (ja) | 2014-04-09 | 2017-06-01 | ティコナ・エルエルシー | 静電防止ポリマー組成物 |
WO2015157050A1 (en) | 2014-04-09 | 2015-10-15 | Ticona Llc | Camera module |
CN111641083A (zh) | 2014-11-12 | 2020-09-08 | 安费诺有限公司 | 在配合区域中具有阻抗控制的非常高速、高密度电互连系统 |
CN104497567B (zh) * | 2014-12-05 | 2017-12-05 | 中国科学院化学研究所 | 长碳链尼龙/硅酸钙晶须复合材料及其制备方法和应用 |
FR3034775B1 (fr) | 2015-04-13 | 2018-09-28 | Hutchinson | Materiau pour le stockage thermique |
FR3034771B1 (fr) | 2015-04-13 | 2019-04-19 | Hutchinson | Materiaux conducteurs thermiques et/ou electriques et leur procede de preparation |
CN114552261A (zh) | 2015-07-07 | 2022-05-27 | 安费诺富加宜(亚洲)私人有限公司 | 电连接器 |
TWI754439B (zh) | 2015-07-23 | 2022-02-01 | 美商安芬諾Tcs公司 | 連接器、製造連接器方法、用於連接器的擴充器模組以及電子系統 |
US10312638B2 (en) | 2016-05-31 | 2019-06-04 | Amphenol Corporation | High performance cable termination |
WO2017209694A1 (en) | 2016-06-01 | 2017-12-07 | Amphenol Fci Connectors Singapore Pte. Ltd. | High speed electrical connector |
US10243304B2 (en) | 2016-08-23 | 2019-03-26 | Amphenol Corporation | Connector configurable for high performance |
CN110088985B (zh) | 2016-10-19 | 2022-07-05 | 安费诺有限公司 | 用于超高速高密度电互连的柔性屏蔽件 |
CN110769729A (zh) | 2017-05-05 | 2020-02-07 | 提克纳有限责任公司 | 耐化学性的聚甲醛聚合物组合物 |
US11070006B2 (en) | 2017-08-03 | 2021-07-20 | Amphenol Corporation | Connector for low loss interconnection system |
EP3704762A4 (en) | 2017-10-30 | 2021-06-16 | Amphenol FCI Asia Pte. Ltd. | CARD EDGE PLUG WITH LOW CROSS-TALKING |
US10601181B2 (en) | 2017-12-01 | 2020-03-24 | Amphenol East Asia Ltd. | Compact electrical connector |
WO2019112847A1 (en) | 2017-12-05 | 2019-06-13 | Ticona Llc | Aromatic polymer composition for use in a camera module |
US10777921B2 (en) | 2017-12-06 | 2020-09-15 | Amphenol East Asia Ltd. | High speed card edge connector |
WO2019164723A1 (en) | 2018-02-20 | 2019-08-29 | Ticona Llc | Thermally conductive polymer composition |
US10665973B2 (en) | 2018-03-22 | 2020-05-26 | Amphenol Corporation | High density electrical connector |
CN112514175B (zh) | 2018-04-02 | 2022-09-09 | 安达概念股份有限公司 | 受控阻抗顺应性线缆终端头 |
CN208862209U (zh) | 2018-09-26 | 2019-05-14 | 安费诺东亚电子科技(深圳)有限公司 | 一种连接器及其应用的pcb板 |
CN113169484A (zh) | 2018-10-09 | 2021-07-23 | 安费诺商用电子产品(成都)有限公司 | 高密度边缘连接器 |
TWM576774U (zh) | 2018-11-15 | 2019-04-11 | 香港商安費諾(東亞)有限公司 | 具有防位移結構之金屬殼體及其連接器 |
US10931062B2 (en) | 2018-11-21 | 2021-02-23 | Amphenol Corporation | High-frequency electrical connector |
US11381015B2 (en) | 2018-12-21 | 2022-07-05 | Amphenol East Asia Ltd. | Robust, miniaturized card edge connector |
CN117175250A (zh) | 2019-01-25 | 2023-12-05 | 富加宜(美国)有限责任公司 | 被配置用于线缆连接到中板的i/o连接器 |
CN117175239A (zh) | 2019-01-25 | 2023-12-05 | 富加宜(美国)有限责任公司 | 插座连接器和电连接器 |
JP2020125412A (ja) * | 2019-02-05 | 2020-08-20 | 帝人株式会社 | 熱可塑性ポリエステル樹脂組成物およびその成形品 |
US11189971B2 (en) | 2019-02-14 | 2021-11-30 | Amphenol East Asia Ltd. | Robust, high-frequency electrical connector |
CN113728521A (zh) | 2019-02-22 | 2021-11-30 | 安费诺有限公司 | 高性能线缆连接器组件 |
JP7461959B2 (ja) | 2019-03-20 | 2024-04-04 | ティコナ・エルエルシー | カメラモジュールのためのアクチュエータアセンブリ |
US11086200B2 (en) | 2019-03-20 | 2021-08-10 | Ticona Llc | Polymer composition for use in a camera module |
TWM582251U (zh) | 2019-04-22 | 2019-08-11 | 香港商安費諾(東亞)有限公司 | Connector set with built-in locking mechanism and socket connector thereof |
EP3973597A4 (en) | 2019-05-20 | 2023-06-28 | Amphenol Corporation | High density, high speed electrical connector |
US11735852B2 (en) | 2019-09-19 | 2023-08-22 | Amphenol Corporation | High speed electronic system with midboard cable connector |
US11588277B2 (en) | 2019-11-06 | 2023-02-21 | Amphenol East Asia Ltd. | High-frequency electrical connector with lossy member |
US11799230B2 (en) | 2019-11-06 | 2023-10-24 | Amphenol East Asia Ltd. | High-frequency electrical connector with in interlocking segments |
WO2021154718A1 (en) | 2020-01-27 | 2021-08-05 | Fci Usa Llc | High speed, high density direct mate orthogonal connector |
TW202135385A (zh) | 2020-01-27 | 2021-09-16 | 美商Fci美國有限責任公司 | 高速連接器 |
CN113258325A (zh) | 2020-01-28 | 2021-08-13 | 富加宜(美国)有限责任公司 | 高频中板连接器 |
CN115700014A (zh) | 2020-02-26 | 2023-02-03 | 提克纳有限责任公司 | 电路结构 |
JP2023514820A (ja) | 2020-02-26 | 2023-04-11 | ティコナ・エルエルシー | 電子デバイス |
WO2021173411A1 (en) | 2020-02-26 | 2021-09-02 | Ticona Llc | Polymer composition for an electronic device |
TWM630230U (zh) | 2020-03-13 | 2022-08-01 | 大陸商安費諾商用電子產品(成都)有限公司 | 加強部件、電連接器、電路板總成及絕緣本體 |
US11728585B2 (en) | 2020-06-17 | 2023-08-15 | Amphenol East Asia Ltd. | Compact electrical connector with shell bounding spaces for receiving mating protrusions |
US11831092B2 (en) | 2020-07-28 | 2023-11-28 | Amphenol East Asia Ltd. | Compact electrical connector |
US11728065B2 (en) | 2020-07-28 | 2023-08-15 | Ticona Llc | Molded interconnect device |
US11652307B2 (en) | 2020-08-20 | 2023-05-16 | Amphenol East Asia Electronic Technology (Shenzhen) Co., Ltd. | High speed connector |
CN212874843U (zh) | 2020-08-31 | 2021-04-02 | 安费诺商用电子产品(成都)有限公司 | 电连接器 |
CN215816516U (zh) | 2020-09-22 | 2022-02-11 | 安费诺商用电子产品(成都)有限公司 | 电连接器 |
CN213636403U (zh) | 2020-09-25 | 2021-07-06 | 安费诺商用电子产品(成都)有限公司 | 电连接器 |
US11569613B2 (en) | 2021-04-19 | 2023-01-31 | Amphenol East Asia Ltd. | Electrical connector having symmetrical docking holes |
USD1002553S1 (en) | 2021-11-03 | 2023-10-24 | Amphenol Corporation | Gasket for connector |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62172056A (ja) * | 1986-01-23 | 1987-07-29 | Toray Ind Inc | ポリフエニレンスルフイド組成物 |
JPH1053654A (ja) * | 1996-08-09 | 1998-02-24 | Polyplastics Co | 射出成形体 |
JPH10279800A (ja) * | 1997-03-31 | 1998-10-20 | Toray Ind Inc | ポリフェニレンスルフィド樹脂組成物 |
JP2002188007A (ja) * | 2000-12-21 | 2002-07-05 | Hitachi Metals Ltd | 複合材料及び回路基板 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
PH15509A (en) * | 1974-05-10 | 1983-02-03 | Du Pont | Improvements in an relating to synthetic polyesters |
DE3585935D1 (de) * | 1984-02-24 | 1992-06-04 | Du Pont | Verstaerkte thermoplastische polyesterzusammensetzungen. |
JP2871752B2 (ja) * | 1989-10-27 | 1999-03-17 | 三井化学株式会社 | 転がり軸受用保持器 |
EP0944098B1 (en) * | 1998-03-19 | 2005-06-01 | Hitachi, Ltd. | Thermally conductive electrical insulating composition |
WO2002016132A1 (fr) * | 2000-08-18 | 2002-02-28 | Teijin Chemicals, Ltd. | Structure stratifiee d'aspect attrayant et son utilisation |
EP1393898B2 (en) * | 2001-04-19 | 2012-11-21 | Toray Industries, Inc. | White laminate polyester film and receiving sheet for thermal transfer recording using it |
JP2003040619A (ja) * | 2001-07-27 | 2003-02-13 | Hitachi Metals Ltd | CaF2粉末の表面処理方法、樹脂複合材料及びそれを用いた構成部材 |
US6986864B2 (en) * | 2002-04-30 | 2006-01-17 | David Scott Porter | Polyester compositions |
-
2005
- 2005-01-10 US US11/032,468 patent/US20050176835A1/en not_active Abandoned
- 2005-01-11 WO PCT/US2005/000866 patent/WO2005071001A1/en active Application Filing
- 2005-01-11 CA CA002552080A patent/CA2552080A1/en not_active Abandoned
- 2005-01-11 EP EP05705497A patent/EP1704179B1/en not_active Not-in-force
- 2005-01-11 JP JP2006549538A patent/JP4764351B2/ja not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62172056A (ja) * | 1986-01-23 | 1987-07-29 | Toray Ind Inc | ポリフエニレンスルフイド組成物 |
JPH1053654A (ja) * | 1996-08-09 | 1998-02-24 | Polyplastics Co | 射出成形体 |
JPH10279800A (ja) * | 1997-03-31 | 1998-10-20 | Toray Ind Inc | ポリフェニレンスルフィド樹脂組成物 |
JP2002188007A (ja) * | 2000-12-21 | 2002-07-05 | Hitachi Metals Ltd | 複合材料及び回路基板 |
Also Published As
Publication number | Publication date |
---|---|
EP1704179B1 (en) | 2011-12-28 |
US20050176835A1 (en) | 2005-08-11 |
CA2552080A1 (en) | 2005-08-04 |
JP2007517968A (ja) | 2007-07-05 |
EP1704179A1 (en) | 2006-09-27 |
WO2005071001A1 (en) | 2005-08-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4764351B2 (ja) | 熱伝導性熱可塑性樹脂組成物 | |
US9090751B2 (en) | Thermally conductive thermoplastic resin compositions and related applications | |
JP5547644B2 (ja) | 熱伝導性樹脂組成物 | |
JP5264924B2 (ja) | 熱伝導性プラスチック樹脂組成物 | |
JP5085927B2 (ja) | 難燃性樹脂組成物 | |
JP2009506191A (ja) | 高流動性ポリエステル組成物 | |
WO2011058992A1 (ja) | ポリブチレンテレフタレート樹脂組成物 | |
US20060142422A1 (en) | Hydrolysis resistant polyester compositions and articles made therefrom | |
JP2013540183A (ja) | 熱伝導性樹脂組成物 | |
WO2017010337A1 (ja) | ポリブチレンテレフタレート樹脂組成物 | |
JPH0948876A (ja) | 熱可塑性樹脂組成物 | |
CN111961341B (zh) | 一种复合材料及其制备方法、固定架及墙壁开关 | |
JPH0762209A (ja) | ポリエステル樹脂組成物 | |
EP3519501B1 (en) | Polymer composition comprising poly(butylene terephthalate). | |
JPH0627246B2 (ja) | 難燃性芳香族ポリエステル樹脂組成物 | |
JPH07113037A (ja) | ポリエステル樹脂組成物 | |
JP2000109657A (ja) | 熱可塑性ポリエステル樹脂組成物 | |
JPH05320486A (ja) | ポリエステル樹脂組成物 | |
JPH09235454A (ja) | ポリカーボネート系樹脂組成物 | |
JPH07278417A (ja) | ポリエステル樹脂組成物及びその製造法 | |
JPH0737558B2 (ja) | ポリエステル組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20071011 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20071011 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20100831 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100903 |
|
A524 | Written submission of copy of amendment under article 19 pct |
Free format text: JAPANESE INTERMEDIATE CODE: A524 Effective date: 20101201 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110128 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110411 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110603 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110610 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140617 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |